iLab Name:
iLab Kiosk:
FIC: Tim Sands
Owner: Nithin Raghunathan
Location: BRK 1217
Maximum Wafer Size: 

Overview

General Description

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes.

Specifications

Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity

Technology

Overview 

Sample Requirements and Preparation

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References