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Problem Reporting Guide
Problem Reporting Guide
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StatusUpDOWN
Issue Date and Description

wafer stuck in LL

Estimated Fix Date and Comment

Investigating

Responding StaffFrancisR. Hosler


Plasma-Therm Apex SLR HDPCVD

Page Properties
idInfo


iLab Name

Plasma-Therm ICP RIE

iLab Kiosk


FIC

Shared

Owner

Francis Manfred

Location

Cleanroom - K Bay

Max. Wafer

6"

Internal Page
Staff Page



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eLog - General Etching
eLog - General Etching
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Overview

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idEtch_Capabilities


TypeMaterialsRestricted MaterialsAvailable GasesMax RF PowerWafer Size
ICP RIESi, Oxides, III-IV's, Ti, Al, SiCAu, Ag, Pt, CuAr, CHF3, CF4, SF6, Cl2, N2, O2, BCl3, H2, C4F82000 ICP / 600 Platen6 inch (150 mm) SEMI Specification



General Description



Specifications


Factory Support:

     Plasma-Therm APEX SLR Website

     Paris Harvey - Field Service Engineer

  • 727-687-7947 mobile
  • paris.harvey@plasmatherm.com
  • Paris did the initial tool commissioning and installation in August 2019. He was great to work with and had worked in manufacturing on these tools as well, so he knew it inside and out.

     JJ Whitehead - Field Service Engineer


     Plasma Power Supply

  • 600W 13.56MHz Bias Supply
  • 2kW 2MHz ICP




Sample Requirements and Preparation


Standard Operating Procedure

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nameSOP-V14.pdf
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View file
nameFM - Recipe Writing - J.pdf
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Questions & Troubleshooting



Process Library

References