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Problem Reporting Guide
Problem Reporting Guide
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StatusUp
Issue Date and Description

 


Estimated Fix Date and Comment 


Responding StaffJustin Wirth




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iLab NameJEOL JBX-8100FS E-Beam Writer
iLab KioskBRK Lithography Core
FICShared
OwnerBill Rowe and Justin Wirth (Email, Chat)
LocationBRK 2100P
Max. Wafer6"/150 mm
Info LinksSOP/wiki/spaces/BNCWiki/pages/6232822 | /wiki/spaces/BNCWiki/pages/6232164




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Overview

General Description

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The new JEOL JBX-8100FS series spot beam lithography system is designed for higher throughput and lower operating costs. The JBX-8100FS writes ultrafine patterns at a faster rate of speed while minimizing idle time, especially during the exposure process, thus increasing throughput. This new, high precision compact e-beam tool is suitable for a wide range of applications from research to production, while its small footprint and low power consumption reduce cost of ownership.

Main Features

  • Small footprint
    The area required for the standard system is 4.9 m (W) x 3.7 m (D) x 2.6 m (H), much smaller than the conventional systems.
  • Low power consumption
    Power needed for normal operation is approximately 3 kVA, reduced to 1/3 of the conventional systems.
  • High throughput
    The system has two exposure modes, high resolution and high throughput modes, supporting different types of patterning from ultra fine processing to small to mid size production. It has minimized the idle time during exposure while increasing the maximum scanning speed by 1.25 to 2.5 times to 125 MHz (the world’s highest level) for high speed writing.
  • Version
    The JBX-8100FS is available in 2 versions: G1 (entry model) and G2 (full option model). Optional accessories can be added to the G1 model as needed.
  • New Functions
    An optional optical microscope is available to enable examination of patterns on the sample without exposing resist to light. A signal tower is provided as standard for visual monitoring of system operation.
  • Laser positioning resolution
    Stage positions are measured and controlled in 0.6 nm steps as standard, and in 0.15 nm steps with an optional upgrade.
  • System control
    Versatile Linux® operating system combined with a new graphic user interface provides ease in operation. The data preparation program supports both Linux® and Windows®.

Specifications

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The JBX-8100FS is an electron-beam lithography system designed to write nanometer to submicron sized patterns using a spot beam.

Write Modes Specifications

Note: High Throughput will be almost exclusively used, contact Bill Rowe if you think you need HR mode.


High Throughput
(HT/4th Lens/EOS 3)

High Resolution
(HR/5th Lens/EOS 6)
Max. Main Field Size1000 μm x 1000 μm100 μm x 100 μm
Max. Sub Field Size8 μm x 8 μm0.8 μm x 0.8 μm
Min. Beam Step Size0.5 nm0.05 nm
Min. Shape Placement Step1 nm0.1 nm
Overlay Accuracy≤±20 nm≤±9 nm
Field Stitching Accuracy≤±20 nm≤±9 nm
Min. Beam Diameter5.1 nm1.8 nm
Min. Line Width (Field Center)<12 nm<8 nm
Available Currents (at BNC)2, 10, 30, 100 nA (200 nA available as a test file)0.5 nA

Features

  • ZrO/W emitter 
  • 4-stage electron-beam focusing system
  • Accelerating voltage: 100 kV
  • Writing: Vector scan (within a subfield) and Step-and-repeat (electronically between subfields and physically between fields).
  • Beam scanning speed: ≤125 MHz
  • Scan speed modulation: 256 rank / 0.05 nsec resolution
  • Mainfield/Positioning DAC: 20-bit
  • Subfield/Scanning DAC: 14-bit
  • Focus range: ±100 μm
  • Max wafer size: 200 mm
  • Max writing area: 150 mm x 150 mm
  • Movable area: 190 mm x 170 mm
  • Stage positioning resolution: λ/1024 (~0.6 nm)
  • Beam current stability: 0.2% pp/hr
  • Beam position stability: ≤60 nm pp/hr (HT) / ≤10 nm pp/hr (HR)
  • Substrate thickness compatibility: 225 μm to 1.3 mm
  • Deflection amplitude correction and objective-lens focus correction, using the substrate height detector
  • Smallest features size: 4.2 nm (demonstrated by JEOL in Development of the JBX-8100FS Electron Beam Lithography System).

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JEOL JBX-8100FS - Internal Resources - Detailed Specifications
JEOL JBX-8100FS - Internal Resources - Detailed Specifications
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The JBX-8100FS is mounted on a TMC Quiet Island with STACIS III antivibration supports. Transmission is minimized at high frequencies, and unlike older anti-vibration supports, is reduced at low (<10 Hz) frequencies as well.


Sample Requirements and Preparation

Samples need to be free of outgassing contaminants, and PR must be properly baked to avoid contamination of the column


Standard Operating Procedure

Login to Confluence to view the SOP, or email jcwirth@purdue.edu if you are external to Purdue and interested:

SOP - JEOL JBX-8100FS E-Beam Writer


Process Library

Currently empty, please contribute your processes here.

8100calculator.xlsx

Use this Excel file to assist with picking currents, shot pitches, ensuring you're within the clock headroom (<125 MHz, >8ns), to roughly estimate your write time based on the current/dose/pattern area, and track alignment mark locations.

8100calculator.xlsx


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iLab KioskeLog: SubmiteLog: View/EditReport Problem


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eLog - JEOL JBX-8100FS E-Beam Writer
eLog - JEOL JBX-8100FS E-Beam Writer
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References

BNC Staff Presentations - Internal Resources

J. C. Wirth, "Introduction to the JEOL JBX-8100FS", BNC Faculty Seminar, 2/08/2018 (Updated 10/25/2018).

Purdue's JBX-8100FS, from JEOL - Internal Resources

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JBX-8100FS Performance Test Report - Purdue

Training for JBX-8100FS - Purdue

STACIS III Anti-vibration Platform for JBX-8100FS IOC report - Purdue

Beam Diameter of JBX-8100FS - Purdue

BEAMER Manual

JEOL Manuals - Internal Resources

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Internal - JEOL JBX-8100FS E-Beam Writer
Internal - JEOL JBX-8100FS E-Beam Writer
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General References

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JEOL

JEOL USA Semiconductor Equipment Documents - Electron Beam Lithography

Yukinori Aida, "Development of the JBX-8100FS Electron Beam Lithography System", JEOL News 53(1), 59 (2018).

(Web Version)

Georgia Tech

100 kV Electron Beam Lithography System: JBX-9300FS

"JEOL JBX-9300FS Electron Beam Lithography System Training", Georgia Tech

Yale

YINQE EBL - Manuals and Documentation

YINQE EBL - Software Downloads

YINQE EBL - Electron-Beam Lithography Training

University of Washington

Run Time Estimator

Schedule File Compiling

Cornell

JEOL 6300

JEOL 9500

JEOL Alignment Marks

Shot Pitch and Write Time Calculator - XLS

University of Michigan

JEOL JBX-6300FS

University of Minnesota

Vistec EBPG5000 (with good process resources)

Electron Properties

Accelerating Voltage Calculator

Properties of Electrons

Electron Beam properties

Relevant Literature

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"Quality control of JEOL JBX-9500FSZ e-beam lithography system in a multi-user laboratory", T. Greibe et al, Microelectronic Engineering 155, 25-28 (2016).

"5-nm-Order Electron-Beam Lithography for Nanodevice Fabrication," K. Yamazaki and H. Namatsu, japanese Journal of Applied Physics 43, 3767 (2004).
This paper explains why the measured beam size on the knife edge mark (AE mark) is so much larger than the actual beam size. It further discusses some ultrasmall patterns in HSQ

Partnership Opportunities - Alternate EBL Resists/Processes

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Contact Justin Wirth if you are interested in partnering with BNC to evaluate these resists and develop standard processes of broad usefulness to the BNC research community. 

AZ nLOF 2000

AllResist

AR-P 6200 and AR-N 7520 are of particular interest:

FAQ: E-Beam Resists

AR-P 6200:

Nanostructures

Developer Comparison

High Contrast Developer