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iLab Name: Thermo Scientific Helios G4 UX Dual Beam
iLab Kiosk: Purdue Electron Microscopy Facility
FIC: Rosa Diaz
Owner: Xingtao Liu
Location: BRK 1237
Maximum Wafer Size: 2"/50 mm
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Overview
General Description
The Thermo Scientific Helios G4 DualBeam product family redefines the standard in sample preparation and three dimensional characterization through the most advanced focused ion- and electron beam performance, exclusive software, and an unprecedented level of automation and ease-of-use.
The Thermo Scientific™ Helios™ G4 UX DualBeam™ System is part of the fourth generation of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of scientists and engineers, combining the innovative Elstar™ electron column with high-current UC+ technology for extreme high-resolution imaging and the highest materials contrast with the superior Thermo Scientific Phoenix™ Focused Ion Beam (FIB) column for the fastest, easiest, and most precise high quality sample preparation. In addition to the most advanced electron and ion optics, the Helios G4 UX Dual Beam System incorporates a suite of state-of-the-art technologies that enable simple and consistent high-resolution S/TEM and Atom Probe Tomography (APT) sample preparation, as well as the highest quality subsurface and 3D characterization, even on the most challenging samples.
Specifications
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1.2.1 Electron optics • Elstar extreme high-resolution field emission SEM column with: – Immersion magnetic objective lens – High-stability Schottky field emission gun to provide stable high-resolution analytical currents – UC+ monochromator technology • 60 degree dual objective lens with pole piece protection allows tilting larger samples • Automated heated apertures to ensure cleanliness and touch free aperture exchange • Electrostatic scanning for higher deflection linearity and speed • Thermo Scientific Constant Power™ Lens Technology for higher thermal stability • Integrated Fast Beam Blanker* • Beam deceleration with stage bias from 0 V to -4 kV • Minimum source lifetime: 12 months 1.2.2 Electron beam resolution • At optimum WD: – 0.6 nm at 30 kV STEM – 0.7 nm at 1 kV – 1.0 nm at 500 V (ICD) • At coincident point: – 0.6 nm at 15 kV – 1.2 nm at 1 kV 1.2.3 Electron beam parameter space • Electron beam current range: 0.8 pA to 100 nA • Accelerating voltage range: 350 V – 30 kV • Landing energy range: 20 eV – 30 keV • Maximum horizontal field width: 2.3 mm at 4 mm WD 1.2.4 Ion optics Phoenix ion column with superior high current and low voltage performance • Ion beam current range: 0.1 pA – 65 nA • Accelerating voltage range: 500 V – 30 kV • 2-stage differential pumping • Time-of-flight (TOF) correction • 15-position aperture strip • Max. horizontal field width: 0.7 mm at beam coincidence point • Minimum source lifetime: 1,000 hours 1.2.5 Ion beam resolution at coincident point • 4.0 nm at 30 kV using preferred statistical method • 2.5 nm at 30 kV using selective edge method 1.2.6 Detectors • Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE) • Elstar in-column SE/BSE detector (ICD) • Elstar in-column BSE detector (MD) • Everhart-Thornley SE detector (ETD) • IR camera for viewing sample/column • High performance ion conversion and electron (ICE) detector for secondary ions (SI) and electrons (SE) • Sample navigation with in-chamber Nav-Cam Camera • Retractable low voltage, high contrast directional solid-state backscatter electron detector (DBS)* • Retractable STEM 3+ detector with BF/ DF/ HAADF segments* • Integrated beam current measurement 1.2.7 Stage and sample • High precision 5-axis motorized stage, with XYR axis Piezo driven: • XY range: 150 mm • Z range: 10 mm • Rotation: 360° (endless) • Tilt range: -10° to +60° • XY repeatability: 1 μm • Max sample height: Clearance 55 mm to eucentric point • Max sample weight: 500 g (including sample holder) • Max sample size: 150 mm with full rotation (larger samples possible with limited rotation) • Compucentric rotation and tilt 1.2.8 Image processor • Dwell time range from 25 ns – 25 ms/pixel • Up to 6144 × 4096 pixels • File type: TIFF (8, 16, 24-bit), BMP o JPEG standard • SmartSCAN Modes (256 frame average or integration, line integration and averaging, interlaced scanning) • DCFI (Drift Compensated Frame Integration) 1.2.9Accessories* • Thermo Scientific MultiChem™: Pt, C and W deposition • Thermo Scientific EasyLift™ for precise in situ sample manipulation • Plasma cleaner • Oxford Instruments X-Max Energy Dispersive Detector (EDS) |
Technology Overview
Dual beam system. Electron beam and Ion beam capabilites. Microscopy, Writing, Sample Prep. Nanometer resolution
Sample Requirements and Preparation
Sample size is limited to 1cm x 1cm x 1mm. If the sample is bigger, contact the staff.
he sample should be completely dried before loading into the chamber.
The sample can be fixed using double sided carbon tape directly onto the pin stub
No magnetic sample for immersion mode.
Standard Operating Procedure
Please follow the ThermoScientific Helios G4 Dual Beam SEM/FIB User manual
ThermoScientific Helios G4 Dual Beam SEM-user manual.docxHelios Training Manual
Questions & Troubleshooting
Do no try to repair or remove any part of the instrument
Do not add any software or hard ware to the computer.
If there is anything that you are not confident or you think that is not right, contact the staff!