Versions Compared

Old Version 22

changes.mady.by.user Francis R Manfred

Saved on

compared with

New Version Current

changes.mady.by.user Ethan Zhang

Saved on

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.


Page Properties
idFunctionality

Insert excerpt
Problem Reporting Guide
Problem Reporting Guide
nopaneltrue

Status
Down
Up
Issue Date and Description

Electrical Issue 


Estimated Fix Date and Comment

 


Responding StaffFrancis


Plasma-Therm Apex SLR HDPCVD

Page Properties
idInfo


iLab Name

Plasma-Therm Apex SLR ICP RIE Etcher

iLab Kiosk


FIC

Shared

Owner

Francis Manfred

Location

Cleanroom - K Bay

Max. Wafer

6"

Internal Page
Staff Page



Insert excerpt
eLog - General Etching
eLog - General Etching
nopaneltrue


Overview

Page Properties
idEtch_Capabilities


TypeMaterialsRestricted MaterialsAvailable GasesMax RF PowerWafer Size
ICP RIESi, Oxides, III-IV's, Ti, Al, SiCAu, Ag, Pt, CuAr, CHF3, CF4, SF6, Cl2, N2, O2, BCl3, H2, C4F82000 ICP / 600 Platen6 inch (150 mm) SEMI Specification



General Description

Image Modified



Specifications


Factory Support:

     Plasma-Therm APEX SLR Website

     Paris Harvey - Field Service Engineer

  • 727-687-7947 mobile
  • paris.harvey@plasmatherm.com
  • Paris did the initial tool commissioning and installation in August 2019. He was great to work with and had worked in manufacturing on these tools as well, so he knew it inside and out.

     JJ Whitehead - Field Service Engineer


     Plasma Power Supply

  • 600W 13.56MHz Bias Supply
  • 2kW 2MHz ICP




Sample Requirements and Preparation


Standard Operating Procedure

View file
nameSOP-V14.pdf
height250
View file
nameFM - Recipe Writing - J.pdf
height250

Questions & Troubleshooting



Process Library

References