Overview
General Description
Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes.
Specifications
Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity
Technology Overview - Remove if multiple tools use the same technology/process
Sample Requirements and Preparation
Standard Operating Procedure
Questions & Troubleshooting
Process Library
References