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Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff


iLab Name: N/A
iLab Kiosk:N/A
FIC: 
Owner: Mihailo Bradash
Location: Cleanroom 
Maximum Wafer Size: 

Overview

General Description

Multi-Purpose Manual Die Bonder for applying temperature, pressure, and ultrasonic during bonding processes.

Specifications

Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 500N.

Technology Overview 

 


Sample Requirements and Preparation


Standard Operating Procedure


Questions & Troubleshooting



Process Library

References


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