<font size="6">Photoresist Dry Film Laminator</font>

iLab Name: Thick Film Photoresist Laminator
iLab Kiosk: BRK Lithography Core
FIC: Michael Sinani
Owner: Michael Sinani
Location: Cleanroom - N Bay
Maximum Wafer Size: 

Overview

General Description

The dry photoresist laminator allows application of dry-film photosensitive films for complete substrate protection and/or patterning. It can be used for semiconductor wafers or PCBs.

Specifications

Will handle a substrate up to 10" wide.

Technology Overview

 Si and PCB/FR4.

Sample Requirements and Preparation

Samples that may be used in the tool, materials that are compatible/incompatible, and the required cleaning before the tool may be used. May include both an "ideal" clean and a minimum required clean. Also include BOE/oxide removal, dehydration, or any recommended post process steps.

Standard Operating Procedure

Standard procedure for tool operation, base off established Birck SOPs.

Questions & Troubleshooting

Question about tool use or process result?
Answer to question.

Process Library

Create process template for tool, allows a user to fill in the details of their process. 

References

Manufacturer brocheurs, specifications, papers with relevant info on process, and presentations covering the technology. Confluence lacks a native reference feature, so these are added as links.