StatusUp
Issue Date and Description

10/28/2024 Breaker work delayed, cancel previous plan

Estimated Fix Date and Comment

Responding StaffDave Lubelski/Dan Witter




iLab NameC - PVD Sputtering System - Flexible Substrate Compatible
iLab KioskBRK Evaporation Sputtering Core
FICHugh Lee
OwnerDave Lubelski
LocationCleanroom - S Bay
Max. Wafer4"/100 mm




Current SourcesAl, W, SiO2, ITO
Potential SourcesSiO2, TiN, Au, Ti, Ag, Cu, Si3N4, Al, Ni, Si, NbTi, Cr, Ge, Pt, Ni/Ti, Nb, Ta, ITO, MgO, W, Al2O3, CoFeB, TiO2





Overview

General Description

  • Can Accommodate Substrates Up to 4"dia.
  • Reactive Sputtering Capable
    • Water Cooled Stage
    • 4-gun System
  • Base Pressure 2.0x10-6 Torr
  • Gases available N2, Ar, O2

Specifications

For use with substrates of organic materials, polyimides, parylene, etc.

Technology Overview 


Sample Requirements and Preparation


Standard Operating Procedure

Please Note: This instrument is billed per  use  based on a 2 hour block

Example : 1  user only uses the tool  per use.  When you vent the system and unload your sample that concludes your reservation .  

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses


Questions & Troubleshooting

Question about tool use or process result?
Answer to question.


Process Library

Create process template for tool, allows a user to fill in the details of their process. 


References

Manufacturer brocheurs, specifications, papers with relevant info on process, and presentations covering the technology. Confluence lacks a native reference feature, so these are added as links.