Status	PROBLEM
Issue Date and Description	Deposition can be run while bypassing loadlock and loading substrates directly into chamber. Stage does not fully lower without operator intervention but deposition can proceed normally. There is a water leak around the stage during stage rotation that is external to the chamber; leak is contained currently and is only present during stage rotation.
Estimated Fix Date and Comment	8/1/22
Responding Staff	Dave Lubelski/Dan Witter

iLab Name	C - PVD Sputtering System - Flexible Substrate Compatible
iLab Kiosk	BRK Evaporation Sputtering Core
FIC	Hugh Lee
Owner	Dave Lubelski
Location	Cleanroom - S Bay
Max. Wafer	4"/100 mm

Current Sources	Cr, Pt, Au, Ti
Potential Sources	SiO2, TiN, Au, Ti, Ag, Cu, Si3N4, Al, Ni, Si, NbTi, Cr, Ge, Pt, Ni/Ti, Nb

Overview

General Description

Can Accommodate Substrates Up to 4"dia.
Reactive Sputtering Capable

Water Cooled Stage
4-gun System

Base Pressure 2.0x10-6 Torr
Gases available N2, Ar, O2

Specifications

For use with substrates of organic materials, polyimides, parylene, etc.

Technology Overview

Sample Requirements and Preparation

Standard Operating Procedure

Please Note: This instrument is billed per use based on a 2 hour block

Example : 1 user only uses the tool per use. When you vent the system and unload your sample that concludes your reservation .

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses

Questions & Troubleshooting

Question about tool use or process result?
Answer to question.

Process Library

Create process template for tool, allows a user to fill in the details of their process.

References

Manufacturer brocheurs, specifications, papers with relevant info on process, and presentations covering the technology. Confluence lacks a native reference feature, so these are added as links.