Leybold E-Beam Evaporator
- Wirth, Justin C
- Witter, Daniel Joseph
- David A Lubelski
Overview
General Description
- E-beam evaporates materials with a 6 pocket hearth
- Pockets hold 15cc pocket volume with 8.2cc liner volume
- Substrate fixture can hold two 4" wafer with adapters for a 3" wafer, 2" wafer, and fragments of wafers
- Telemark controller
- Deposition rates from 0.2 - 8.0 Angstroms/sec
Source Materials
Source Materials: Ti, Fe, Ni, Al, Ag, Al2O3, SiO2, Cr, Py, Cu, Au, Co, Si, Mn, Ta2O5, Ge, Ni/Cr, Pt, TiO2, Er
Technology Overview
Sample Requirements and Preparation
Make sure your sample has been properly baked when using any PR or PMMA.
Substrates must be solvent cleaned in the standard 3 step Toluene, Acetone, and IPA solvent clean.
Samples must be cleaned in accordance to processing needs. NO FLEXIBLE SUBSTRATES OF ANY KIND ARE ALLOWED IN THIS TOOL
Any AL2O3 or SiO2 with a thickness over 300 nanometers in one deposition must be done During business hours (7am-5pm) Monday through Friday. The source must be checked by staff Before Proceeding.
Standard Operating Procedure
Please Note: This instrument is billed per use based on a 5 hour block
Example : 1 user only uses the tool per use. When you vent the system and unload your sample that concludes your reservation .
Example: If the usage is 10+ minutes past the initial 5 hour reservation, you will be billed for 2 uses
MAXIMUM ALLOWED AL2O3 and SiO2 thickness is 300 nanometers per deposition
Questions & Troubleshooting
Why does pump down take so long?
Answer: Due to the the size of the chamber and the use of so many different types of materials that coat the system componets it takes longer for the vacuum system to pump all of the out-gassing produced by w wide variety of source materials used in this system
What is the optimum deposition for SiO2 and other oxides?
We have found the best film quality is obtained at at rates between 1 and 1.5 angstroms per second.
I had a problem with the way the last aluminum samples turned out. It looked like there were almost pin holes or something in the aluminum layer. I am not sure if you know what may have been wrong but I can show you the samples and maybe you have an idea of what caused it.
The pinholes are most likely caused by contaminates on the substrate , below are some more comments
Harcourt Butler Technological Institute
Dear Dr. Sivagami
Deposit the film at higher vacuum than what you are using at present. For good adhesion, Degass the substrates before deposition. Make slightly thicker films. Anneal them after evaporation in vacuum at higher temperatures for getting rid of voids. See if you are able to solve the problem. Substrate cleaning can also be improved for better uniformity. Good luck.
Harcourt Butler Technological Institute
If substrates are glass plates, degassing is done by putting a heater inside the coating unit over the substrates and heat them up to 200 degree centigrade for about two hours in vacuum. The gasses absorbed comes out in this process. Switch off the heater to cool down to room temperature. Thereafter, deposit the film without exposing them to air.
Added an answer
pinholes are mainly created due to any foreign material already present in the substrate and they tries to come out through the deposited films during deposition. Clean your substrate thoroughly in piranha solution (1:1 ratio of H2O2 and H2SO4 for 20 min. ** you can search in net for details) . Thereafter rinse in DI water and preheat in oven @ 150 deg. Cent. for at least 30 min and then place in thermal chamber for deposition. Also you should heat your substrate up to 150 deg. cent. just before deposition. For better film quality high vacuum is essenti
Pinholes are either caused by surface contamination remaining on the "cleaned" surface. Use the water break test to determine if the surface is residue free. You will see interference fringes as it dries. The fringes will be even as the water evaporates. Any island fringes or streaks means the surface is not clean. Any of these particles actually become nucleation sites as the coating is deposited
Process Library