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Ion Polishing System

Precision ion polishing system for precise centering, control, and reproducibility of your milling process.

The PIPS II system incorporates the patented WhisperLok® with the X,Y positioning stage for precise centering of the milling target. The PIPS II system incorporates a 10 inch touch screen for ease of use and increased control and reproducibility of the milling process.

The Digital Zoom Microscope monitors the polishing process in real time and the color images can be stored in Gatan’s DigitalMicrograph® software for review and analysis while the sample is in the TEM.

Improved collimated beam provides useable voltages as low as 100 volts for rapid and damage free preparation of FIB lamella
Low energy focusing Penning Ion Guns - Improved low energy milling FIB prepared samples.
Variable energy from 100 V to 8.0 kV - Improved low energy milling for reduction in amorphous layer for correct TEMs.
LN2 specimen cooling - Eliminates artifacts 10 inch color touch screen control - Simple but full control from the graphical user interface (GUI).
Digital Zoom Microscope - Operates in real time while milling.
Color image storage in DigitalMicrograph - Ability to store and use optical images with the TEM EELS data in the same format.

The NanoMill system is easily programmable. The system if fully automated: Adjustable ion beam energies, milling angles, specimen rotation, and cryogenic specimen cooling parameters afford maximum flexibility to ensure the optimal preparation of a wide variety of specimens. The ion beam can be targeted to a specific area of interest. A secondary electron detector is used to image the ion-induced secondary electrons that are generated from the targeted area of the specimen.

Removes amorphous and implanted layers.
Ultra-low energy ion source, variable from 50 eV to 2 keV.
Concentrated argon ion beam, with a diameter down to 1 µm at 2 keV.
Milling angle range: -10° to +30°.
Liquid nitrogen-cooled specimen stage.
Ion-induced secondary electron imaging of the specimen.
Oil-free vacuum system with a base pressure of 3 x 10^-5 Pa and operating pressure of 1 x 10^-2 Pa.

The SPI-Module line of modular sputter coaters and carbon coaters are optimized for Au/Pd coating and Carbon coating for all SEM and EDS applications.

Au/Pd sputter to disperse charge on SEM samples.
SPI Vacuum Control Base is equipped with both a diode magnetron sputtering head and carbon coater.
Sputtering is achieved with Ar+ plasma and Au/Pd (60:40) target for SEM sample coating.
Carbon coater head uses carbon fiber filaments (provided).
Work chamber accommodates up to 6 pin-mount specimen stubs (12.5mm dia).

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