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SU-8 Process
SU-8 Process
- Joon Hyeong Park
Owned by Joon Hyeong Park
What to Use
| Epoxy resist | Features | UV sensitivity | Film thickness | Resolution |
|---|---|---|---|---|
| SU-8 |
| i-line (365nm) | 10-200 µm | >10:1 Aspect Ratio |
| SU-8 2000 |
| i-line (365nm) | 10-100 µm | >10:1 Aspect Ratio |
| SU-8 3000 |
| i-line (365nm) | 10-70 µm | >5:1 Aspect Ratio |
| SU-8 TF6000 |
| g-line (436nm) h-line (405nm) i-line (365nm) | 0.5-10 µm | High resolution |
(https://kayakuam.com/su-8-series/)
Process Flow
- Substrate Preparation: Piranha cleaning, Oxygen plasma cleaning
- Dehydration bake
- Spin coat: at 500rpm for 5-10 sec and proper rpm for target thickness
- Soft Bake
- Expose: 365nm at contact mask aligners
- Post Exposure Bake (PEB)
- Develop: SU-8 developer (PGMEA, Birck supplied)
- Rinse and Dry: rinse with IPA, dry with nitrogen
- Hard Bake (optional)
Datasheet
Thickness vs Spin Speed
- SU-8 3000 series
Where to Order
, multiple selections available,
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