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SU-8 Process

SU-8 Process

Jun 17, 2021

What to Use

Epoxy resist

Features

UV sensitivity

Film thickness

Resolution

SU-8

  • Wide range of viscosities

  • High aspect ratio patterning

  • Photo-definable ultra-thick structures

i-line

(365nm)

10-200 µm

>10:1 Aspect Ratio

SU-8 2000

  • Improved substrate wetting

  • Faster drying

  • Higher process throughput

i-line

(365nm)

10-100 µm

>10:1 Aspect Ratio

SU-8 3000

  • Improved substrate adhesion

  • Reduced coating stress

i-line

(365nm)

10-70 µm

>5:1 Aspect Ratio

SU-8 TF6000

  • High resolution thin film processing

  • Highly uniform thin films

  • Improved substrate adhesion

g-line (436nm)

h-line (405nm)

i-line (365nm)

0.5-10 µm

High resolution

(https://kayakuam.com/su-8-series/)

Process Flow

  • Substrate Preparation: Piranha cleaning, Oxygen plasma cleaning

  • Dehydration bake

  • Spin coat: at 500rpm for 5-10 sec and proper rpm for target thickness

  • Soft Bake

  • Expose: 365nm at contact mask aligners

  • Post Exposure Bake (PEB)

  • Develop: SU-8 developer (PGMEA, Birck supplied)

  • Rinse and Dry: rinse with IPA, dry with nitrogen

  • Hard Bake (optional)

Datasheet

Thickness vs Spin Speed

  • SU-8 3000 series

Where to Order

https://kayakuam.com/place-an-order/