Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.



Page Properties
idFunctionality

Insert excerpt
Problem Reporting Guide
Problem Reporting Guide
nopaneltrue

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff




Page Properties
idInfo


iLab Name
iLab Kiosk
FIC
Owner
LocationBRK 1100A
Max. Substrate
Info LinksInternal | Staff




Table of Content Zone
locationtop
styledisc

Table of Contents
outlinetrue
indent25px
stylenone


Overview

General Description

Specifications

Technology Overview - Remove if multiple tools use the same technology/process

The LasX LaserSharp Dual LPM100 and LPM250 is a laser processing system that is integrated in-line with a roll-to-roll handling system that allows roll-fed and stationary operating modes.  The LMP100 is a 100W pulsed fiber laser (wavelength = 1064 nm), and the LMP250 is a 250W sealed CO2 diffusion cooled laser (wavelength = 10.6 micrometers).  Either or both lasers can be used to cut, ablate, or selectively heat materials in vector, raster, or drill modes.  When materials are stationary, processing is limited to the field of view for each laser.  When operated in roll-to-roll mode, processing is unlimited in the material travel direction, and repeated patterns may be triggered with a photodiode and/or camera-based registration mark sensor.  Alternatively, repeated patterns may be prompted after a periodic distance (precisely measured by encoder wheel) in the absence of registration marks.


A wide variety of materials may be processed using the lasers to achieve various outcomes.  This includes:

  • cutting shapes and patterns from rolls of plastic film or paper or from stationary plastic sheets
  • selectively heating to pattern phase changes or partially melt plastics to imprint identification marks
  • ablating a thin metal layer from a plastic substrate to pattern circuitry, electrodes, or other electronic devices and components
  • cutting through a silicon wafer to create a hole of a desired shape at a location of interest
  • cutting metallic foils is also possible in some cases

Specifications

Technology Overview

 


Sample Requirements and Preparation


Standard Operating Procedure


Questions & Troubleshooting



Process Library


References