Overview

General Description

The LasX LaserSharp Dual LPM100 and LPM250 is a laser processing system that is integrated in-line with a roll-to-roll handling system that allows roll-fed and stationary operating modes.  The LMP100 is a 100W pulsed fiber laser (wavelength = 1064 nm), and the LMP250 is a 250W sealed CO2 diffusion cooled laser (wavelength = 10.6 micrometers).  Either or both lasers can be used to cut, ablate, or selectively heat materials in vector, raster, or drill modes.  When materials are stationary, processing is limited to the field of view for each laser.  When operated in roll-to-roll mode, processing is unlimited in the material travel direction, and repeated patterns may be triggered with a photodiode and/or camera-based registration mark sensor.  Alternatively, repeated patterns may be prompted after a periodic distance (precisely measured by encoder wheel) in the absence of registration marks.

A wide variety of materials may be processed using the lasers to achieve various outcomes.  This includes:

• cutting shapes and patterns from rolls of plastic film or paper or from stationary plastic sheets
• selectively heating to pattern phase changes or partially melt plastics to imprint identification marks
• ablating a thin metal layer from a plastic substrate to pattern circuitry, electrodes, or other electronic devices and components
• cutting through a silicon wafer to create a hole of a desired shape at a location of interest
• cutting metallic foils is also possible in some cases

Specifications

Technology Overview

Sample Requirements and Preparation

Guidelines:

• Samples should be of fairly uniform thickness; otherwise settings that achieve the desired outcome in one location may result in an undesired outcome in another region of different thickness.
• Many materials may be processed, but the most common are polymer films and sheets.  The thickness can also vary significantly.  Typical thickness for film is 25 to 500 micrometers.  Acrylic sheets up to 6.4 mm thick have been cut successfully.  Thin films that are not processed in-line as part of a roll may need to be secured with weights or adhesive tape to keep them from moving during processing due to the ventilation system.
• Cutting through 150mm diameter (~650 micrometer thick) silicon wafers is possible with the LPM100 module via ~200X repeat tracing.
• Some metallic foils and parts can also be cut, but they must typically not be too thick.  Thin (<200 micrometer) brass and aluminum foils have been successfully cut.
• Although processing is limited to the field of view in Specifications, samples may be substantially larger than this.
• Unsure whether your sample can be processed, contact the tool owner

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References