Overview

General Description

The LasX LaserSharp Dual LPM100 and LPM250 is a laser processing system that is integrated in-line with a roll-to-roll handling system that allows roll-fed and stationary operating modes.  The LMP100 is a 100W pulsed fiber laser (wavelength = 1064 nm), and the LMP250 is a 250W sealed CO2 diffusion cooled laser (wavelength = 10.6 micrometers).  Either or both lasers can be used to cut, ablate, or selectively heat materials in vector, raster, or drill modes.  When materials are stationary, processing is limited to the field of view for each laser.  When operated in roll-to-roll mode, processing is unlimited in the material travel direction, and repeated patterns may be triggered with a photodiode and/or camera-based registration mark sensor.  Alternatively, repeated patterns may be prompted after a periodic distance (precisely measured by encoder wheel) in the absence of registration marks.

A wide variety of materials may be processed using the lasers to achieve various outcomes.  This includes:

• cutting shapes and patterns from rolls of plastic film or paper or from stationary plastic sheets
• selectively heating to pattern phase changes or partially melt plastics to imprint identification marks
• ablating a thin metal layer from a plastic substrate to pattern circuitry, electrodes, or other electronic devices and components
• cutting through a silicon wafer to create a hole of a desired shape at a location of interest
• cutting metallic foils is also possible in some cases

CAD or image files may be imported to define the pattern to be traced by the laser.  Accepted files are JPG, PNG, BMP, PDF, DXT, and DWG.  These must be converted to the RCPX files used by the LasX LightGuide software, and some files may not convert or may convert with poor fidelity.  It is recommended to check the file conversion from your preferred software with a few simple features prior to making a detailed design.  For vector and drill-only features, the LightGuide software may be used to draw features and create RCPX files directly.

Specifications

Technology Overview

 Laser processing uses focused, coherent light, often of a single wavelength or tight spectral band, to heat and modify materials.  Because of the spatial focusing and collimation of the laser, the energy transferred by the light beam is of high intensity at the small point where the beam contacts a material.  If the material absorbs light at the wavelength or spectral range of the laser, the material will heat up at that point, often quite rapidly and dramatically.  This rapid absorption of energy locally can accomplish a phase change of the material, which might also include melting locally.  This could be a means to cut a material.  Another way a material may be cut or ablated is by thermal expansion; in this case, the region contacting the beam heats up and expands rapidly relative to the nearby material, which remains closer to ambient temperature.  The resulting thermal stress results in the heated material separating from the neighboring material.  Finally, heating via the laser beam can result in a local chemical change, especially when multiple materials are present either in the sample or when the atmosphere near the sample is reactive with the sample (this includes combustion of organic or metallic samples in the presence of oxygen).

Precise shapes may be cut or rastered on a sample by programming the laser with a CAD drawing and software that precisely positions mirrors to direct the laser beam to desired positions to trace out the design.  Processing is tuned to achieve the desired outcome (cutting, "marking" or partial melting, ablation, sintering, etc.  Tuning parameters include laser power level and process speed (rate that the beam travels along the programmed path), as well as repeat tracing, focus offset, pulsing frequency, and line spacing and angle (in the case of rastering).  For the LasX system, there are no default process settings defined; typically trial and error is used to define a process for a given material set, design, and desired outcome.

Sample Requirements and Preparation

Guidelines:

• Samples should be of fairly uniform thickness; otherwise settings that achieve the desired outcome in one location may result in an undesired outcome in another region of different thickness.
• Many materials may be processed, but the most common are polymer films and sheets.  The thickness can also vary significantly.  Typical thickness for film is 25 to 500 micrometers.  Acrylic sheets up to 6.4 mm thick have been cut successfully.  Thin films that are not processed in-line as part of a roll may need to be secured with weights or adhesive tape to keep them from moving during processing due to the ventilation system.
• Cutting through 150mm diameter (~650 micrometer thick) silicon wafers is possible with the LPM100 module via ~200X repeat tracing.
• Some metallic foils and parts can also be cut, but they must typically not be too thick.  Thin (<200 micrometer) brass and aluminum foils have been successfully cut.
• Although processing is limited to the field of view in Specifications, samples may be substantially larger than this.
• Unsure whether your sample can be processed? Contact the tool owner for training or to give it a try.

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References