Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
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iLab Name: Stress machine
iLab Kiosk: BRK Metrology Core
FIC: Shared
Owner: Rich Harlan
Location: Cleanroom - R/S Chase
Maximum Wafer Size: 8"/200 mm

Overview

General Description

The Thin Film Stress Machine is a non-destructive testing tool used to analyze the stress of thin films. The stress machine analyzes the radius of curvature of your whole wafer prior to the film being deposited. Then after film deposition, the stress machine reanalyzes your sample to compare to the original. This change in radius of curvature will then result in a film stress value in the units of MPa.

Specifications

Capable of 3, 4, 5, 6, and 8 inch whole wafers
Can measure film stress from ambient to 500°C
Can measure film stress over a period of time
Capable of graphing time vs stress, and temp vs stress
Capable of measuring deflection of the substrate
Nitrogen reduces oxidation during heating
CDA can assist in cooling

Technology Overview

Sample Requirements and Preparation

Note: You must know your substrate thickness and film thickness to achieve a proper stress value

Standard Operating Procedure

Questions & Troubleshooting