iLab Name: AJA Ion Mill
iLab Kiosk: BRK Etch Core
FIC: Sunil Bhave
Owner: Neil Dilley
Location: Cleanroom - Q Bay
Maximum Wafer Size: 6"
Overview
General Description
This system is used for direct argon ion milling of thin and thick films. The rotating sample chuck can be oriented +/- 90 degrees from normal beam incidence. A top load-lock system saves time with pumpdown. The chamber can also be vented and the chuck mounted by hand.
An endpoint detector from Hiden uses SIMS-based (atomic mass) detection of milled material to monitor elemental composition and automatically stop when a certain element is reached.
Specifications
Technology Overview - Remove if multiple tools use the same technology/process
Sample Requirements and Preparation
Note that thick films requiring high etch rates (and hence high amounts of heating)
Standard Operating Procedure
Questions & Troubleshooting
Process Library