Technology Overview

Spin coating of photoresist allows a uniform layer to be distributed on a substrate in a short amount of time.

Advantages:

• Uniform coating of photoresist on rotationally symmetric substrates (i.e. wafers)
• Small amount of photoresist used
• Quick process

Disadvantages:

• Coating uniformity degrades for non-rotationally symmetric substrates (i.e. squares and rectangles)
• Edge bead formation
• Potentially poor coverage Coverage of textured/patterned surface depends on the thickness of photoresist

Representative Coating Cycle

Process Library

For in-depth information about photoresist properties and spin recipes, see BNC Supplied Photoresists.

Typical Recipe:
Step 0:   Values should be set to 0 or "None". Disp should be rounded up to the nearest chuck size, and Disp Time may be set to a nonzero value to avoid the "Homing" step after spinning.
Step 1:   Timed ramp and dwell at process rpm.
Step 2:   Timed ramp down to zero rpm / unload

AZ1518

Standard Spin, AZ1518, no dispersal steps

Standard Spin, AZ1518, initial dispersal spin

References

MicroChemicals: Spin Coating of Photoresist