Overview

Optical Lithography

• Heidelberg MLA150 Maskless Aligner: for mask-making or direct write photolithography
• Suss MA6 Mask Aligner
• Suss MJB3 UV400 Mask Aligner
• Suss MJB4 UV400 Mask Aligner

Electron Beam Lithography

JEOL JBX-8100FS

• 100kV max beam energy
• 125 MHz scan speed
• Resolutions down to 7nm
• 2 Modes:
  • High Throughput - 1000um Field Size
  • High Resolution - 100um Field Size
• Cassettes for pieces: 3”, 4”, 6” wafers, 5” photomasks
• GenISys Beamer software

Raith: e LiNE

• 30kV max beam energy
• 20 MHz scan speed
• Resolutions down to 18nm
• Standard or Ultra-flat Cassette
• Up to 4” wafer
• Excellent SEM imaging
• Excellent for work on nanowires, graphene, carbon nanotubes

Other patterning

• Nanonex NX-2000: nano-imprint lithography tool for making multiple copies of small geometry patterns
• PLS6MW Laser Engraver
• Photoresist Dry Film Laminator
• Interference Lithography System
• Laurell EDC-650 Spin Processor

Staff contact: Ron Reger

• Photomask Fabrication
  • External Photomask Suppliers
• Spin Coating
  • Spinner Allowed Chemicals
  • Laurell WS-650
  • SCS 6808P Spinner
  • SCS G3P-8 Spinner
  • Spinner Allowed Chemicals - 2018 Version
  • Laurell EDC-650 Spin Processor
• Photoresist Baking
  • Cascade Tek TVO-2 Vacuum Oven
• Optical Lithography
  • Heidelberg MLA150 Maskless Aligner
  • Suss MJB4 UV400 Mask Aligner
  • Suss MA6 Mask Aligner
  • Suss MJB3 UV400 Mask Aligner
• Electron Beam Lithography
  • JEOL JBX-8100FS E-Beam Writer
  • Raith eLine E-Beam Writer
• Other Patterning
  • Nanonex NX-2000
  • Nanoscribe Photonic Professional GT2 3D Printer
  • Photoresist Dry Film Laminator
  • PLS6MW Laser Engraver
  • Zeiss Orion NanoFab Helium Ion Microscope (HIM)/Helium FIB
• Test patterns

Any patterning begins with a pattern, usually in GDS or OAS. See this youtube tutorial on KLayout: https://www.youtube.com/channel/UC45cUNKyJLlRDqCsL1QZFPQ/videos