iLab Name: Disco Dad641
iLab Kiosk: BRK Packaging and Assembly Core
FIC: Shared
Owner: Tim Miller
Location: BRK 2261
Maximum Wafer Size: 6"/150 mm

Overview

General Description

The Disco dicing saw is a precision sawing machine used in cutting semiconductor and MEMS wafers for separation of individual chips or devices. Pieces to be cut are mounted on wafer tape, which allows any size and shape of sample to be cut, up to 8 inches in diameter, and up to 1 millimeter thick. A supply of blades is on hand for most common substrates. Unusual substrates or non-standard cutting dimensions (i. e. extremely narrow kerf) may necessitate ordering special blades. There may be an extra cost to order special blades.

Due to the nature of the automation in this tool, it is challenging to align smaller samples.  The Disco DAD2H/6 is better suited to handling small (less than 2" in diameter) samples.

Specifications

Technology

Overview 

Sample Requirements and Preparation

No special sample preparation is required.  Users have the option of applying a sacrificial layer of photoresist to the top surface of the sample prevent surface damage. 

Samples over 1 mm thick require special handling and specific blades.  Please consult Tim or Nithin before attempting to cut anything over 1 mm in thickness. 

Standard Operating Procedure

Questions & Troubleshooting

Under no conditions should a user try to replace a broken blade!  Please contact Tim or Nithin to have it replaced.

Process Library

References