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Overview

Thermosonic wire bonding:
Westbond 7476E wedge bonder; two units are available, one set up for 25 µm gold wire bonding and the other for 25 µm aluminum wire bonding.
JFP WB-100; general purpose ball/wedge/ribbon bonder, typically set up for ball bonding 25 µm gold wire.

Dicing saw: Accretech SS20; up to 8” (200mm) wafers and up to 1 mm thick.

Chemical and mechanical polishing (CMP): ASAP-1 IPS Automated Mechanical Polisher.

PCB milling and processing: LPKF mill, LPKF bonder, LPKF plater.  

Staff contact: Ron Reger

• LPKF PCB System
  • LPKF Plater
  • LPKF Press
  • LPKF Mill
• Bonding
  • JFP WB-100 Wire Bonder
  • SB6e Bonder
  • Westbond 7400A Thermosonic Wire Bonder
  • Westbond 7476E Thermosonic Wire Bonder
  • Hotplate Bonder
  • K and S 4526 Wire Bonder
  • Finetech FW1 Multi-Purpose Manual Die Bonder
• Polishing
  • ASAP-1 IPS Digital Sample Preparation System
• Dicing
  • Accretech SS20 Dicing Saw
  • Disco DAD641 Dicing Saw