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Thermosonic wire bonding:
Westbond 7476E wedge bonder; two units are available, one set up for 25 µm gold wire bonding and the other for 25 µm aluminum wire bonding.
JFP WB-100; general purpose ball/wedge/ribbon bonder, typically set up for ball bonding 25 µm gold wire.

Dicing saw: Accretech SS20; up to 8” (200mm) wafers and up to 1 mm thick.

Chemical and mechanical polishing (CMP): ASAP-1 IPS Automated Mechanical Polisher.

PCB milling and processing: LPKF mill, LPKF bonder, LPKF plater.