CrossLab Name:  West Bond 7476E Wire BonderiLab Name: Westbond 7476E
iLab Kiosk: BRK Packaging and Assembly Core
FIC: David Janes
Owner: Tim Miller
Location: BRK  BRK 2092
 Maximum Wafer Size:

Overview

General Description

This precision tool welds gold wire from chip pad to package. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

Specifications 

         Spec sheet from West Bond - http://www.westbond.com/7400aspc.htm

Technology Overview - Remove if multiple tools use the same technology/process

Sample Requirements and Preparation

No special sample cleaning is required prior to wire bonding.  Sample metallization must be thick enough to withstand the rigors of bonding.  Samples must be securely mounted in their respective packages, and the package must be securely mounted to the bonding fixture.  Double-sided cellophane tape is not an acceptable mounting technique.  

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References