Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.



Page Properties
idFunctionality

Insert excerpt
Problem Reporting Guide
Problem Reporting Guide
nopaneltrue

StatusUp
Issue Date and Description


Estimated Fix Date and Comment

Responding StaffFrancis


Plasma-Therm Apex SLR HDPCVD

Page Properties
idInfo


iLab Name
iLab Kiosk


FIC

Shared

Owner

Francis Manfred

Location

Cleanroom - K Bay

Max. Wafer

6"

Internal Page
Staff Page





Overview

Page Properties
idEtch_Capabilities


TypeMaterialsRestricted MaterialsAvailable GasesMax RF PowerWafer Size
ICP RIESi, Oxides, III-IV's, Ti, Al, SiCAu, Ag, Pt, CuAr, CHF3, CF4, SF6, Cl2, N2, O2, BCl3, H2, C4F82000 ICP / 600 Platen6 inch (150 mm) SEMI Specification



General Description

Tip

This is an example of a tip

WarningThis is an example of a tool warning

Image Added

Image Added



Specifications

Factory Support:

Plasma-Therm APEX SLR Website

Paris Harvey - Field Service Engineer

  • 727-687-7947 mobile
  • paris.harvey@plasmatherm.com
  • Paris did the initial tool commissioning and installation in August 2019. He was great to work with and had worked in manufacturing on these tools as well, so he knew it inside and out.

JJ Whitehead - Field Service Engineer

Specifications

Lower Electrode Temperature Range

  • 10 - 60°C

Chamber Leak Rate

Plasma Power Supply

  • 600W 13.56MHz Bias Supply
  • 2kW 2MHz ICP

Technology Overview - Remove if multiple tools use the same technology/process

 


Sample Requirements and Preparation


Standard Operating Procedure

View file
nameSOP-V14.pdf
height250
View file
nameFM - Recipe Writing - J.pdf
height250

Questions & Troubleshooting



Process Library


References