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iLab Name: C - ASAP-1 IPS Digital Sample Preparation System
iLab Kiosk: BRK Packaging and Assembly Core
FIC: Walter Leon-Salas
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Spindle speed is lagged in grind step
iLab Name: C - ASAP-1 IPS Digital Sample Preparation System
iLab Kiosk: BRK Packaging and Assembly Core
FIC: Walter Leon-Salas
Owner: Jerry Shepard
Owner: Jerry Shepard
Location: BRK 2221
Maximum Wafer Size: 4"/100 mm
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Overview
Note: the following is quoted from ULTRA TEC's documentation
General Description
ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polishing of packaged wafer-level devices.
Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device centric’ – designed to meet the non-destructive, high yield and survivability needs of micro-electronic components.
IPS’ Touch Screen OS has been designed from the ground-up to control all aspects of the sample preparation process. Advanced programming drives IPS’s deep sub-micron axes of motion. The machine vision monitor provides an unique ‘always-live’ image of the device, along with key navigational and process information.
The touch-off tool control provides Z-position at pre-defined locations and pressures – enabling package and die tilt to be corrected quickly and accurately. Tool height variations are automatically-calibrated.
Selected area preparation
"Selected Area Preparation (SAP) has long been established as a low damage machining method, with the use of relatively low spindle speeds, in conjunction with the floating head providing very low temperature rises. This is in stark contrast with high speed 'mills' which introduce excess vibration, ultrasonics, and process temperature rises -- generally requiring either a cooling bath to be in position at all time, or even a constant high flow of coolant to avoid device overheating. SAP is almost always a ‘wet process’ . However the coolant required is minimal."
The use of ULTRA TEC’s patented 'float down' head approach has enabled several hundred customers to achieve high quality polished surfaces, ready for analysis. High yields have been shown using analog ASAP-1® equipment for thinning silicon to less than 20 micron target RST. The move to higher accuracy digital systems allows for routine thinning of extremely thin substrates at even low single-digit RST’s. The move to larger flip chips mounted on PCB substrates requires inherent design for 3D sample prep. Sample Preparation developments have been driven by the industry's push for both smaller RST’s – for optimal backside imaging and attenuation – and the need for improved uniformity, to satisfy the latest analytical techniques.
• “A Straightforward Guide to the Sample Preparation of Curved & Warped IC's”; TEC Note #16, 2015 • “Backside Failure Analysis Techniques: What’s The Gain Of Silicon Getting Thinner”; Boit, Schafer et al; ESREF 2014 • “The State of the Art in Backside Sample Prep”; Jim Colvin, EDFA Vol 4, No.2, 2002 • “Packages Have Become the New IC’s”; Jim Colvin, EDFA Volume 16, Issue 4, November 2014
Specifications
- Suits all sizes of die - package, wafer and board-level
- Real Time Video Monitor with system parameter
- Touchscreen control with physical joystick & controls
- Rigidized Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
- X, Y and Z axes all have deep sub-micron accuracy
- Accurately decaps, then thins substrate and polishes
- Patented Floating Head provides a true polishing action -- yields polishing quality & high survivability
- Intuitive menus provide a powerful, easy to use, system
- USB Flash Driveinterface for preparation recipe storage
- Short set-up and process times
- Accurate die-tilt adjustment ‘on the fly’
- Bench-top & Quiet in Operation
Tool Overview
Operator Controls
- Floating polishing head assembly.
- Floating head lock knob.
- USB Slot for storing recipes
- Real time camera view
- Operator input screen. (Touch Sensitive)
- Emergency OFF button
- XYZ control joystick
- Dual purpose input knob
- X axis manual/micro move
- Manual table speed adjust
- Dual purpose input knob
- Y axis manual/micro move
- Manual tool speed adjust
- Z axis micro move
- Power button
- spindle shown with tool inserted
Operator Input Screens
Screen Title: ASAP - 1 Initialization Screen
Menu Label: NA
- Displays during initial power up routine. Touch screen with stylus to exit.
Screen Title: Menu
Menu Label: NA
- To access this menu, press
located in the upper left corner of
any operator screen.
Screen Title: Load/Save Recipes
Menu Label: Load-Save and Tool Dia
- This screen loads after power ON initialization screen is touched.
- This displays machine default settings loaded on power up.
- This screen displays current machine settings after changes.
Screen Title: Load-Save and Tool Diameter Select
Menu Label: Not directly accessible from the menu
- To access this screen, first navigate to Load/Save Recipes screen shown
above. Then click
. - This screen is used only to select tool diameter.
Screen Title: Set Scan Start/Endpoints
Menu Label: Start/Endpoints
- This screen is primarily used to define the area to be thinned/polished.
is essentially the same as pressing Run on the Run screen
allows the user to interrupt the system while it is running,
and will allow table moves and resetting of Start/End points.
are temporary coordinate holders. You can store X,Y
positions of interest to return to later.
Screen Title: 3D
Menu Label: 3D/Tilt
- This screen is used to manage auto tilt and curvature parameters.
Screen Title:
Menu Label: Illumination/Cam Mode/Text
- Text overlay contrast on real time camera view can be adjusted.
- Control of camera mode is achieved on this screen.
- This screen is used to manage power to the laser indicator.
- This screen also controls the display of the text overlay on the
real time camera display
Screen Title: Table Travel Pattern Select
Menu Label: Patterns
- Pattern selection defines the motion of the polishing tool over the area to
be thinned/polished.
Screen Title: Run
Menu Label: Run Process
- This screen is used to control the process start and stop.
- Checking the Timer box will force the process to stop when the timer has
reached 0 remaining seconds. - Checking the Trip box will ...?
- Checking the Zstop box will ....?
- Vac En is not used on this tool
Screen Title:
Menu Label: Z Force Feedback
Screen Title: Keypad
Menu Label: Keypad
- This screen is used to enter numerical values directly into parameters
- Can be used to move the stage to absolute coordinates
- Press
, then enter coordinate, then press
axis label
/ 
/ 
- Press
- Can be used to move the stage using reletive coordinates
- Press , then enter coordinate, then press
axis label
/ 
/ 
- Press
Safety Precautions
This device produces visible laser radiation. To prevent injury to your eyes, never look directly into the laser.
Sample Requirements and Preparation
The Automated Selected Area Polisher (ASAP-1-IPS) is designed to thin and polish small selected areas (windows) in electronic packages and wafer-level dies. The resultant thinned component is transparent to infra-red light, thus enabling backside failure analysis to be carried out on the (front side) circuitry in the device.
Typical Applications
Mechanical Decapuslation
Standard Operating Procedure
Turn Power ON
Generally, turning the machine on only requires pressing the Green Power
button on the lower right of the control panel.
- The Green button will light up
- The input screen will power on
- The real time camera view will power on
- The illumination light will power on
- The polishing head will move to the top of travel
- After the tool quits moving and "Wait for RESET Initialization" is no
longer shown on the real time camera view, use the stylus to touch
anywhere on the input screen. - The input screen now displays the Load/Save Recipes screen and is
ready for normal use. - The tool requires three things for power ON. Two of which are
normally already in the correct state.- Toggle switch on back of tool in the down position
- Emergency button on front panel released
- Green power button engaged
Sample mounting
Your sample needs to be mounted flat and rigid to the sample holder. Assuming mounting technique meets these two criteria, there is no preferred method. Below are a couple common mounting techniques used regularly.
- Bond small samples to glass slide using Crystal Bond 555-HMP, then use clamps to hold slide in place.
- Place glass slide on hot plate and heat to 80 degrees C.
- Spread a small amount of Crystal Bond 555-HMP over the area where sample will be mounted.
- Press sample firmly down onto Crystal Bond and allow assembly to cool to room temperature.
- Place assembly onto sample holder and use mechanical clamps to hold the glass slide in place.
- Bond sample directly to the sample holder using Crystal Bond 555-HMP.
- Remove the sample holder from the ASAP-1 tool.
- Place on hot plate and heat to 80 degrees C.
- Spread a small amount of Crystal Bond 555-HMP over the area where sample will be mounted.
- Press sample firmly down onto Crystal Bond and allow assembly to cool to room temperature.
- Mount sample holder back onto the ASAP-1 tool.
- Mechanical Clamps
- Using the threaded holes provided in the sample holder, mount clamps in place as needed. Two options on each side, one closer to the middle, the second further away from center accomodating a wide range of sample widths.
- The screw that threads into the clamp is used to adjust the clamp for your sample thickness. That screw needs to be adjusted so that it sticks our futher than the sample is thick resulting the the front edge of the clamp making contact with the sample.
- Tighten the slotted screw until firm.
Be sure to adjust the rear screw on the clamp appropriately based on the sample thickness. You need to have the edge exerting force on the sample top, not exerting clamping force on the glass slide / sample edge.
Be careful not to exert too much force on the sample. Clamping introduces stress on the package/wafer that can result in cracking or warping during the thinning process.
* _Proper contact angle in this image is exagerated for illustrative purposes.
Typical Sample Mounting Technique Examples
Mechanical Clamping for Decapsulation
Image from http://www.ultratecusa.com
Wax Mounting Direct to Sample Holder
Image from http://www.ultratecusa.com
Selected Area Polish of Wafer Backside Process Example
Set Processing Parameters
The parameters needed for backside polishing are directly observable and will not require cross sectioning of a sample as is required with decapuslation. The tool can only polish a rectangular area with radiused corners, no other geometry is possible.
- Minimum: 1600 rpm
- Maximum: 2400 rpm
- Start Point (μm)
- Xstart = - (Length of Area to polish in X axis-Tool Diameter) / 2
- Ystart = (Length of Area to polish in Y axis-Tool Diameter) / 2
- End Point (μm)
- Xend = (Length of Area to polish in X axis-Tool Diameter) / 2
- Yend = - (Length of Area to polish in Y axis-Tool Diameter) / 2
- Depth of polish in Z axis (μm)
Select appropriate tool size and Polishing Force
Tools can be purchased from the manufacturer at the following link:
https://www.ultratecusa.com/product/sap-tools/
Area to be Polished
* Length x Width
(mm2)
Tool Diameter
(mm)
Suggested Polishing Force
( grams)
Processing factor
(seconds/mm2)
5
900
- Corner radius need not be taken into consideration for calculating area to be polished.
- To estimate processing time in seconds, based on the tool diameter selected, select
the appropriate processing factor and multiply by processing area. Values are typically
between 5 and 15 minutes.
Step 1 - Set the processing timer
- Navigate to Keypad Screen
- Press , enter appropriate time in seconds then press
.
Step 2 - Set the table rastering speed (3.5 mm/s recommended)
- Navigate to Keypad Screen
- Click , enter desired table speed into the field, then click
.
Step 3 - Select polishing pattern
- Navigate to Table Travel Pattern Select screen
- Click on the radio button below the desired pattern.
(ASAP-1 or ASAP-1 X recommended)
Step 4 - Set polishing force
- Navigate to Keypad Screen
- Press , enter appropriate force in grams, then press
.
Step 5 - Set tool diameter
- Navigate to Load/Save Recipes screen and press button.
- Click radio button next to selected tool diameter
Step 6 - Verify above settings are active
- Navigate to the Load/Save Recipes Screen
- In the left column review:
- Time setting
- Speed setting
- Selected pattern
- Force setting
- In the right column review:
- Tool Dia: setting
Processing - Four Steps
| title | Click here to expand Process Overview... |
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This process recipe should be considered a guide, the procedure can be modified to meet your specific needs.
The following procedure should yield a thinned surface with no scratches in a cavity the size of your choosing.
Process Time
(minutes)
10 per 50 μm
| title | Click here to expand Processing Stage 1 - Silicon Thinning |
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Processing Stage 1 - Silicon Thinning
Step 1 - Mount the selected diameter Fine Diamond tool into the spindle.
- Make sure to align the flat on the tool shank with the set screw
when inserting the tool into the spindle.
Step 2 - Mount the sample to be thinned.
- Wafer piece mounted backside up onto a glass slide using
Crystal Bond 555-HMP and then mechanically clamped to the
sample holder shown.
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- Be careful, damageto the tool will occur, and you may be
held responsible for damages, if you release the locking
mechanism and allow the polishing head to drop onto the force
sensor.
Step 5 - Define the Start point of the area to be polished.
- Navigate to the Set Scan Start/Endpoints screen.
- Make sure the lower right button is
indicating the
joystick will move the spindle in the Z axis.
Z axis will move very slowly
Z axis will move quickly
- Using the joystick, bring the head down until the tool nearly conacts
the surface of your sample. Force reading should still be ~0.
- Press button to change to
indicating the
joystick will move the table in the X and Y axis. - Use the joystick to move the spindle to the upper left corner of area
to be polished.
- Press , then
to define the start point of the
area to be polished.
Step 6 - Define the End point of the area to be polished.
- Use the joystick to move the spindle to the lower right corner of area
to be polished. - Press , then
to define the end point of the
area to be polished.
- Use the joystick to move the spindle to the lower right corner of area
Step 7 - Define the center of area to be polished as XY origin (0,0).
- Press
to move the spindle to the center of the start and
end points previously defined.- If
is displayed rather than on the
Set Scan Start/Endpoints screen, press and will
change to.
- If
- Press , then
to define the center of the
area to be polished. You should see the X and Y display values
change to 0.
Step 8 - Define the top surface of the sample as the origin, or zero,
point for the Z axis.
- Make sure force sensor is on.
- Make sure is displayed before continuing.If
is not displayed, click to switch joystick control to the
Z axis. - Using the joystick bring the tool down to the sample surface until
100 gm is reached. Z motion should stop automatically at 100 gm.
Displayed on real time camera view. - Click
to navigate to the Keypad Screen. - Click and then
. The display on real time camera
view will update to show Z position as 0. - Click , enter 20 into field, then click . The head should
lift 20 μm off the sample and force should read ~0. This will allow you
to safely start the 5 point tilt auto generate process.
Step 9 - Compensate for sample tilt
- Navigate to the Set Scan Start/End screen
- Press to change to
- Press and the tool will proceed automatically touching
off at 5 points within the selected area to polish. - Once completes the tool will move to XY 0 and Z at 5 mm
above the surface. - X and Y tilt values are shown on the real time camera view.
- Navigate to the 3D/Tilt screen.
- Press followed by
. The motorized tilt stage will move
and auto align the stage based on tilt measurement just taken. - Press followed by
to measure sample tilt. The tool will
proceed through the auto tilt measurement process as before. - Once auto tilt measurement completes, X and Y tilt values are shown on
the real time camera view. The goal is to have these values measure
at ~0. You may need to repeat this many times to achieve 0 values
in both axis. - If you need to repeat, press followed by . The
motorized tilt stage will move and auto align the stage based on tilt
measurement just taken. - Press followed by to measure sample tilt and
verify alignment.
- From the Keypad screen, click , enter desired rotational speed into
the field, then click
. The spindle will begin rotating at the
set speed.
Step 11 - Begin the thinning process
- Navigate to the Run screen
- You should see your entered timer value in the Timer section
under Set(Sec). - Make sure the Timer box is checked, indicating the tool should stop when
the Elapsed time equals Set time. - Click
and the tool will start rastering across the selected
area. - Click to navigate to the Keypad Screen.
- Click , enter desired depth into field as a negative value,
then click. It is recommended to remove a maximum of 50 μm
per processing step. - While continuing to raster, the head will slowly move down onto the part
until the set polishing force is reached. Initially, the tool will try to maintian
this set force by moving down in Z. Once Z has reached set point, the
tool will hold Z position and continue processing while the applied force
fades to zero. - The process will stop automatically and position the tool at the end point
with Z ~50 μm above final Z depth when the set time has past.
Step 12 - Continuing to thin the sample
- Since our extender fluid will become saturated with ground material,
if you need to thin your sample by more than 50 μm, you should do so in
multiple steps. - From the Keypad screen click , enter 20 into field,
then click
. The head should lift 20 μm off the sample and
force should read ~0. - Use your hand to gently lift the head to the top of travel. Engage the
locking handle by rotating the handle clockwise until tight. Make sure
the head is locked before removing the support of your hand. - Wipe up the used extender fluid using a clean wipe and isopropyl
alcohol. - Apply another drop or two of fresh extender fluid.
- Gently lower the head into operating position.
- Be careful, if you release the locking mechanism and allow the
polishing head to drop onto the force sensor, damage to the tool
will occur.
- Be careful, if you release the locking mechanism and allow the
- Return to Step 10 above and continue. Repeat steps 10 through 12 until
the desired thinning has been achieved.
Rasing the head
Lowering the head
| title | Click here to expand Processing Stage 2 - Pre-polish |
|---|
Processing Stage 2 - Pre-polish
Step 2 - Thoroughly clean your sample and realign for pre-polish
- After the thinning process it is necessary to thoroughly clean your
sample to remove large particles that would cause scratches that can't be
removed during the pre-polish step. - If the sample was removed for cleaning, you must realign and clamp your
sample, see these instructions.
Step 3 - Mount the selected diameter Xylem tool into the spindle.
- Make sure to mount the tool reserved for the blue diamond paste, it will
be marked with blue paint on the mounting flat. - Make sure to align the flat on the tool shank with the set screw
when inserting the tool into the spindle.
Step 4 - Apply a small amount of Blue Diamond paste to the thinned area.
Step 5 - Apply one to two drops of Extender Fluid to the thinned area
and spread blue diamond paste.
Step 6 - Gently lower the head into operating position.
- Be careful, if you release the locking mechanism and allow the
polishing head to drop onto the force sensor, damage to the tool
will occur.
- Be careful, if you release the locking mechanism and allow the
Step 7 - Define the top surface of the sample as the origin, or zero,
point for the Z axis.
- Since you have changed tools, we must re establish the Z origin.
- Make sure force sensor is on.
- Make sure is displayed before continuing. If
is not displayed, click to switch joystick control to the
Z axis. - Using the joystick bring the tool down to the sample surface until
100 gm is reached. Z motion should stop automatically at 100 gm.
Displayed on real time camera view. - Click to navigate to the Keypad Screen.
- Click and then . The display on real time camera
view will update to show Z position as 0. - Click , enter 50 into field, then click . The head will
lift 50 μm off the sample and force should read ~0.
Step 8 - Move to the center of the selected area
- Navigate to the Set Scan Start/Endpoints screen
- Press . The head will move to the defined XY origin.
Step 9 - Change the timer for the polishing process if applicable. If no
change needed, skip to next step.
(600 seconds in this example)
- Navigate to the Keypad screen.
- Click , enter processing time into the field, then click .
This will not produce an immediate and noticable result, however it does
set the Run timer shown on the Run screen. - Follow this step's instructions to reset the timer. Setting the timer,
even to the same value, resets the timer. However, the displayed elapse
time will not change to 0 until the button is pressed on
the Run screen.
Step 10 - Start the spindle (2000 RPM recommended)
- From the Keypad screen, click , enter desired rotational speed into
the field, then click. The spindle will begin rotating at the
set speed.
Step 11 - Begin the pre-polishing process
- Navigate to the Run screen
- You should see your entered timer value in the Timer section
under Set(Sec). - Make sure the Timer box is checked, indicating the tool should stop when
the Elapsed time equals Set time. - Click and the tool will start rastering across the selected
area. - Click to navigate to the Keypad Screen.
- Click , enter an unreachable depth into field as a negative value,
then click. This ensures you are controlled by the timer. - While continuing to raster, the head will slowly move down onto the part
until the set polishing force is reached. - The process will stop automatically and position the tool at the end point
with Z ~50 μm above final Z depth when the set time has past.
| title | Click here to expand Processing Stage 3 - Intermediate polish |
|---|
Processing Stage 3 - Intermediate polish
Step 2 - Thoroughly clean your sample and realign for intermediate polish
- After the blue compound it is necessary to thoroughly clean your
sample to remove large particles that would cause scratches that can't be
removed during the intermediate polish step. - If the sample was removed for cleaning, you must realign and clamp your
sample, see these instructions.
Step 3 - Mount the selected diameter Xylem tool into the spindle.
- Make sure to mount the tool reserved for the yellow diamond paste, it will
be marked with yellow paint on the mounting flat. - Make sure to align the flat on the tool shank with the set screw
when inserting the tool into the spindle.
Step 4 - Apply a small amount of Yellow Diamond paste to the thinned area.
Step 5 - Apply one to two drops of Extender Fluid to the thinned area
and spread yellow diamond paste.
Step 6 - Gently lower the head into operating position.
- Be careful, if you release the locking mechanism and allow the
polishing head to drop onto the force sensor, damage to the tool
will occur.
- Be careful, if you release the locking mechanism and allow the
Step 7 - Define the top surface of the sample as the origin, or zero,
point for the Z axis.
- Since you have changed tools, we must re establish the Z origin.
- Make sure force sensor is on.
- Make sure is displayed before continuing. If
is not displayed, click to switch joystick control to the
Z axis. - Using the joystick bring the tool down to the sample surface until
100 gm is reached. Z motion should stop automatically at 100 gm.
Displayed on real time camera view. - Click to navigate to the Keypad Screen.
- Click and then . The display on real time camera
view will update to show Z position as 0. - Click , enter 50 into field, then click . The head will
lift 50 μm off the sample and force should read ~0.
Step 8 - Move to the center of the selected area
- Navigate to the Set Scan Start/Endpoints screen
- Press . The head will move to the defined XY origin.
Step 9 - Change the timer for the polishing process if applicable. If no
change needed, skip to next step.
(600 seconds in this example)
- Navigate to the Keypad screen.
- Click , enter processing time into the field, then click .
This will not produce an immediate and noticeable result, however it does
set the Run timer shown on the Run screen. - Follow this step's instructions to reset the timer. Setting the timer,
even to the same value, resets the timer. However, the displayed elapse
time will not change to 0 until the button is pressed on
the Run screen.
Step 10 - Start the spindle (2000 RPM recommended)
- From the Keypad screen, click , enter desired rotational speed into
the field, then click. The spindle will begin rotating at the
set speed.
Step 11 - Begin the intermediate polishing process
- Navigate to the Run screen
- You should see your entered timer value in the Timer section
under Set(Sec). - Make sure the Timer box is checked, indicating the tool should stop when
the Elapsed time equals Set time. - Click and the tool will start rastering across the selected
area. - Click to navigate to the Keypad Screen.
- Click , enter an unreachable depth into field as a negative value,
then click. This ensures you are controlled by the timer. - While continuing to raster, the head will slowly move down onto the part
until the set polishing force is reached. - The process will stop automatically and position the tool at the end point
with Z ~50 μm above final Z depth when the set time has past.
| title | Click here to expand Processing Stage 4 - Final polish |
|---|
Processing Stage 4 - Final polish
Step 2 - Thoroughly clean your sample and realign for intermediate polish
- After the blue compound it is necessary to thoroughly clean your
sample to remove large particles that would cause scratches that can't be
removed during the intermediate polish step. - If the sample was removed for cleaning, you must realign and clamp your
sample, see these instructions.
Step 3 - Mount the selected diameter Xbove tool into the spindle.
- Make sure to mount the tool reserved for the yellow diamond paste, it will
be marked with yellow paint on the mounting flat. - Make sure to align the flat on the tool shank with the set screw
when inserting the tool into the spindle.
Step 4 - Apply one to two drops of Extender Fluid to the thinned area
and spread yellow diamond paste.
Step 5 - Gently lower the head into operating position.
- Be careful, if you release the locking mechanism and allow the
polishing head to drop onto the force sensor, damage to the tool
will occur.
- Be careful, if you release the locking mechanism and allow the
Step 6 - Define the top surface of the sample as the origin, or zero,
point for the Z axis.
- Since you have changed tools, we must re establish the Z origin.
- Make sure force sensor is on.
- Make sure is displayed before continuing. If
is not displayed, click to switch joystick control to the
Z axis. - Using the joystick bring the tool down to the sample surface until
100 gm is reached. Z motion should stop automatically at 100 gm.
Displayed on real time camera view. - Click to navigate to the Keypad Screen.
- Click and then . The display on real time camera
view will update to show Z position as 0. - Click , enter 50 into field, then click . The head will
lift 50 μm off the sample and force should read ~0.
Step 7 - Move to the center of the selected area
- Navigate to the Set Scan Start/Endpoints screen
- Press . The head will move to the defined XY origin.
Step 8 - Change the timer for the polishing process if applicable. If no
change needed, skip to next step.
(600 seconds in this example)
- Navigate to the Keypad screen.
- Click , enter processing time into the field, then click .
This will not produce an immediate and noticeable result, however it does
set the Run timer shown on the Run screen. - Follow this step's instructions to reset the timer. Setting the timer,
even to the same value, resets the timer. However, the displayed elapse
time will not change to 0 until the button is pressed on
the Run screen.
Step 9 - Start the spindle (2000 RPM recommended)
- From the Keypad screen, click , enter desired rotational speed into
the field, then click. The spindle will begin rotating at the
set speed.
Step 10 - Begin the Final polishing process
- Navigate to the Run screen
- You should see your entered timer value in the Timer section
under Set(Sec). - Make sure the Timer box is checked, indicating the tool should stop when
the Elapsed time equals Set time. - Click and the tool will start rastering across the selected
area. - Click to navigate to the Keypad Screen.
- Click , enter an unreachable depth into field as a negative value,
then click. This ensures you are controlled by the timer. - While continuing to raster, the head will slowly move down onto the part
until the set polishing force is reached. - The process will stop automatically and position the tool at the end point
with Z ~50 μm above final Z depth when the set time has past.
Questions & Troubleshooting
Process Library
References
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Mihailo Bradash
Location: BRK 2221
Maximum Wafer Size: 4"/100 mm
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Overview
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Note: the following is quoted from ULTRA TEC's documentation General DescriptionASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polishing of packaged wafer-level devices. Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device centric’ – designed to meet the non-destructive, high yield and survivability needs of micro-electronic components. IPS’ Touch Screen OS has been designed from the ground-up to control all aspects of the sample preparation process. Advanced programming drives IPS’s deep sub-micron axes of motion. The machine vision monitor provides an unique ‘always-live’ image of the device, along with key navigational and process information. The touch-off tool control provides Z-position at pre-defined locations and pressures – enabling package and die tilt to be corrected quickly and accurately. Tool height variations are automatically-calibrated. Selected area preparation"Selected Area Preparation (SAP) has long been established as a low damage machining method, with the use of relatively low spindle speeds, in conjunction with the floating head providing very low temperature rises. This is in stark contrast with high speed 'mills' which introduce excess vibration, ultrasonics, and process temperature rises -- generally requiring either a cooling bath to be in position at all time, or even a constant high flow of coolant to avoid device overheating. SAP is almost always a ‘wet process’ . However the coolant required is minimal." The use of ULTRA TEC’s patented 'float down' head approach has enabled several hundred customers to achieve high quality polished surfaces, ready for analysis. High yields have been shown using analog ASAP-1® equipment for thinning silicon to less than 20 micron target RST. The move to higher accuracy digital systems allows for routine thinning of extremely thin substrates at even low single-digit RST’s. The move to larger flip chips mounted on PCB substrates requires inherent design for 3D sample prep. Sample Preparation developments have been driven by the industry's push for both smaller RST’s – for optimal backside imaging and attenuation – and the need for improved uniformity, to satisfy the latest analytical techniques. • “A Straightforward Guide to the Sample Preparation of Curved & Warped IC's”; TEC Note #16, 2015 • “Backside Failure Analysis Techniques: What’s The Gain Of Silicon Getting Thinner”; Boit, Schafer et al; ESREF 2014 • “The State of the Art in Backside Sample Prep”; Jim Colvin, EDFA Vol 4, No.2, 2002 • “Packages Have Become the New IC’s”; Jim Colvin, EDFA Volume 16, Issue 4, November 2014 Specifications
Tool Overview
Operator Input Screens
Safety PrecautionsThis device produces visible laser radiation. To prevent injury to your eyes, never look directly into the laser. |
Sample Requirements and Preparation
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The Automated Selected Area Polisher (ASAP-1-IPS) is designed to thin and polish small selected areas (windows) in electronic packages and wafer-level dies. The resultant thinned component is transparent to infra-red light, thus enabling backside failure analysis to be carried out on the (front side) circuitry in the device.
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Standard Operating Procedure
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Turn Power ON
Sample mounting
Selected Area Polish of Wafer Backside Process Example
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Questions & Troubleshooting
Process Library
References
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