Skip to end of metadata
Go to start of metadata

You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 3 Next »

Technology Overview

Spin coating of photoresist allows a uniform layer to be distributed on a substrate.

 

Representative Coating Cycle

 

Process Library

 

Typical Recipe:
Step 0:   Values should be set to 0 or "None". Disp should be rounded up to the nearest chuck size, and Disp Time may be set to a nonzero value to avoid the "Homing" step after spinning.
Step 1:   Timed ramp and dwell at process rpm.
Step 2:   Timed ramp down to zero rpm / unload

AZ1518

Standard Spin, AZ1518, no dispersal steps

StepRamp (s)RPMDwell (s)
0000
12.0400040
22.000

Standard Spin, AZ1518, initial dispersal spin

StepRamp (s)RPMDwell (s)
0000
11.05005
22.0400040
32.000

References

Main Wiki Page

  • No labels