SU-8 Process

Owned by park218
Last updated: Jun 17, 2021
2 min read

What to Use

Epoxy resistFeaturesUV sensitivityFilm thicknessResolution
SU-8
  • Wide range of viscosities
  • High aspect ratio patterning
  • Photo-definable ultra-thick structures

i-line

(365nm)

10-200 µm>10:1 Aspect Ratio
SU-8 2000
  • Improved substrate wetting
  • Faster drying
  • Higher process throughput

i-line

(365nm)

10-100 µm>10:1 Aspect Ratio
SU-8 3000
  • Improved substrate adhesion
  • Reduced coating stress

i-line

(365nm)

10-70 µm>5:1 Aspect Ratio
SU-8 TF6000
  • High resolution thin film processing
  • Highly uniform thin films
  • Improved substrate adhesion

g-line (436nm)

h-line (405nm)

i-line (365nm)

0.5-10 µmHigh resolution

(https://kayakuam.com/su-8-series/)

Process Flow

  • Substrate Preparation: Piranha cleaning, Oxygen plasma cleaning
  • Dehydration bake
  • Spin coat: at 500rpm for 5-10 sec and proper rpm for target thickness
  • Soft Bake
  • Expose: 365nm at contact mask aligners
  • Post Exposure Bake (PEB)
  • Develop: SU-8 developer (PGMEA, Birck supplied)
  • Rinse and Dry: rinse with IPA, dry with nitrogen
  • Hard Bake (optional)

Datasheet

Thickness vs Spin Speed

 SU-8 2000 series

  • SU-8 3000 series

Where to Order

https://kayakuam.com/place-an-order/