1 Rate Types
2 Lab Access Charges
3 Equipment Rates
4 Staff Time Charges
5 Notes
6 Birck Laboratory Stocked Supplies (subject to change without notice)

Birck Nanotechnology Center Recharge Rates.

Effective June 1, 2023.

Rate Types

INT: Internal (Subsidized)

ENP: External Non‐Profit, Academic, Governmental, and Indiana Small Business

EFP: External For‐Profit

Facilities and Administrative (F&A) costs are included in listed external prices.

Lab Access Charges

Entering BRK labs incurs daily charges to pay for consumables and staff support.

The Birck Lab Fee is charged for any day of lab entry into any BRK lab/galley.
An additional surcharge also applies depending on the type of lab.
If labs of different types are entered, multiple surcharges may be incurred.

Each fee/surcharge is daily: charged up to once per calendar day, per user, regardless of the number of entries or different labs of that type entered.

Monthly Lab Access Cap (Internal Users): Lab fees/surcharges are subsidized by BNC after paying 15 days per month (per user, per account, per fee/surcharge).

Access Charge	Applies to...	INT	ENP	EFP

Access Charge	Applies to...	INT	ENP	EFP
Birck Lab Fee	Daily entry to any BRK lab/galley	14	44	51
Bio Lab Surcharge	BSL1/2 labs: BRK 1081, 2077	9	20	23
Cleanroom Surcharge	BRK 2100A	28	53	61
Gen Lab Surcharge	Any stocked lab/galley not BSL1/2 or BRK 2100A	2	4	5

Equipment Rates

Rates are $ hourly unless specified otherwise in the service name. Hourly billed tools are billed in time step increments depending on the particular tool. Check iLab or contact the staff in charge of the tool for more information.
"C ‐ " indicates services eligible for Scifres Equipment Cap for internal users.
Precious metals are charged at market prices plus applicable markups and overhead charges.

Equipment	INT	ENP	EFP

Equipment	INT	ENP	EFP
C ‐ Deposition, ALD (4200001865)	19	37	42
C ‐ Fiji200 ALD	19	37	42
C - Veeco Fiji G3 Atomic Layer Deposition Tool	19	37	42
C ‐ Deposition, CVD (4200001866)	45	89	102
C ‐ 2D CVD	45	89	102
C ‐ Axic	45	89	102
C ‐ EasyTube 3000	45	89	102
C ‐ Epigress	45	89	102
C ‐ Parylene CVD Furnace	45	89	102
C ‐ Plasma-Therm Apex SLR HDPCVD Deposition System	45	89	102
C ‐ Tube 02 Nitride Dep	45	89	102
C ‐ Tube 03 LTO Dep	45	89	102
C ‐ Tube 06 Polysilicon	45	89	102
C ‐ Tube 09 TEOS	45	89	102
C ‐ Deposition, Flex Compatible PVD, Per Run (4200001862)	161	308	354
C ‐ Lesker E‐Beam Evaporator ‐ Flexible Substrate Compatible (Per Run)	161	308	354
C ‐ PVD Sputtering System ‐ Flexible Substrate Compatible (Per Run)	161	308	354
C ‐ Deposition, PVD and Electroplating, Per Run (4200001863)	117	229	263
C ‐ CHA E‐Beam Evaporator #1 (Per Run)	117	229	263
C ‐ CHA E‐Beam Evaporator #2 (Per Run)	117	229	263
C ‐ Iko Electroplating System (Per Run)	117	229	263
C ‐ Lesker E‐Beam Evaporator (Per Run)	117	229	263
C ‐ PVD E‐Beam Evaporator ‐ Glancing Angle Deposition (GLAD) (Per Run)	117	229	263
C ‐ PVD E‐Beam Evaporator ‐ Metal/Magnetic Sources (Per Run)	117	229	263
C ‐ PVD Sputtering System ‐ 4 Target Magnetic Sources (Per Run)	117	229	263
C ‐ PVD Sputtering System ‐ 6 Target Magnetic Sources (Per Run)	117	229	263
C ‐ PVD Sputtering System ‐ Metal/Dielectric Sources (Per Run)	117	229	263
C ‐ PVD Sputtering System ‐ Nitride (Per Run)	117	229	263
C ‐ WAFAB Electroplating (Per Run)	117	229	263
C ‐ Etching, General (4200001857)	20	40	46
C ‐ Branson Asher	20	40	46
C ‐ March Jupiter II	20	40	46
C ‐ March Jupiter III	20	40	46
C ‐ Xactix E1 Xenon Difluoride (XeF2) Etcher	20	40	46
C ‐ Etching, ICP (4200001856)	60	116	133
C ‐ AJA Ion Mill - 6”	60	116	133
C ‐ AJA Ion Mill - 8”	60	116	133
C ‐ Panasonic E620 ICP RIE Etcher	60	116	133
C ‐ Plasma-Therm Apex SLR ICP RIE Etcher	60	116	133
C - Plasma-Therm Versaline DSE Deep Silicon Etcher	60	116	133
C ‐ STS AOE	60	116	133
C ‐ STS ASE 2	60	116	133
C ‐ Furnace, Oxidation/Annealing (4200001867)	23	43	49
C ‐ Blue M Furnace	23	43	49
C ‐ Jipelec RTA	23	43	49
C ‐ Nitric Oxide Anneal	23	43	49
C ‐ Nitrogen Anneal Furnace	23	43	49
C ‐ RCA Hood	23	43	49
C ‐ Tube 01 Clean Ox	23	43	49
C ‐ Tube 04 Field Ox	23	43	49
C ‐ Tube 05 Anneal	23	43	49
C ‐ Tube 07 General Ox	23	43	49
C ‐ Tube 08 Phos Drive	23	43	49
C ‐ Lithography, Aligners (4200001860)	46	115	132
C ‐ 557 MJB3 Aligners	46	115	132
C ‐ Heidelberg MLA150 Maskless Aligner	46	115	132
C ‐ MA6	46	115	132
C ‐ MJB3_1	46	115	132
C ‐ MJB3_2	46	115	132
C ‐ MJB4	46	115	132
C ‐ Nanonex NX‐2000	46	115	132
C ‐ SB6e bonder	46	115	132
C ‐ Lithography, E‐Beam, 100 kV (4200001858)	92	238	273
C ‐ JEOL JBX‐8100FS E‐Beam Writer #1	92	238	273
C ‐ JEOL JBX‐8100FS E‐Beam Writer #2	92	238	273
C ‐ Lithography, Spinners (4200001859)	21	44	50
C ‐ Laurell EDC‐650 Spin Processor	21	44	50
C ‐ SCS 6808P Spinner #2	21	44	50
C ‐ SCS G3P‐8 Spinner #1	21	44	50
C ‐ Spinner3	21	44	50
C ‐ Spinner4	21	44	50
C ‐ Metrology, General (4200001864)	26	51	59
C ‐ Alpha‐Step	26	51	59
C ‐ Bruker GT‐K	26	51	59
C ‐ Cleanroom Ellipsometer	26	51	59
C ‐ DI3100 BRK1265	26	51	59
C ‐ Filmetrics F10‐RT	26	51	59
C ‐ Filmetrics F40‐UV	26	51	59
C ‐ JEOL JCM 5000 Neoscope SEM	26	51	59
C ‐ Keyence VHX‐6000 Digital Microscope	26	51	59
C ‐ KLA‐Tencor P‐10 Profilometer	26	51	59
C ‐ Leica DCM8 Confocal Microscope	26	51	59
C ‐ Nanoman AFM	26	51	59
C ‐ Nikon Eclipse L150 Microscope 1 (N Bay)	26	51	59
C ‐ Nikon Eclipse L150 Microscope 2 (N Bay)	26	51	59
C ‐ Olympus BX‐60 Microscope (J Bay)	26	51	59
C ‐ Olympus Microscope	26	51	59
C ‐ P‐7 Profilometer	26	51	59
C ‐ Park NX20 AFM	26	51	59
C ‐ Stress Machine	26	51	59
Characterization, LDV (4200001842)	26	41	47
Polytec Laser Vibrometer	26	41	47
Suss PLV50 ProbeStation	26	41	47
Characterization, Probe Station (4200001836)	27	51	59
Cleanroom Probe 1	27	51	59
FormFactor PAV200 Semi-Automatic Vacuum Probe Station	27	51	59
Jandel 4‐point Probe	27	51	59
Microxact CPS-50-HT High Temperature Probe Station	27	51	59
MM P200L Semi‐Automatic Probe Station	27	51	59
MMR Probe	27	51	59
Probe 1	27	51	59
Probe 2	27	51	59
Characterization, Spin Lab (4200001837)	12	46	53
Lakeshore CRX-4K Cryogenic Probe Station	12	46	53
Lakeshore CRX-VF Cryogenic Vertical Field Probe Station	12	46	53
MPMS	12	46	53
PPMS	12	46	53
Deposition, PLD, Per Run (4200001839)	400	628	723
PVD Pulsed Laser Deposition (PLD) (Per Run)	400	628	723
Lithography, E‐Beam, 30 kV (4200001838)	64	124	142
Raith eLine E‐Beam Writer	64	124	142
Metrology, Center for AFM (4200001841)	48	89	102
Asylum MFP 3D Bio	48	89	102
Asylum_Cypher_BRK	48	89	102
Metrology, Femtosecond and Raman (4200001840)	31	49	56
Coherent Legend FS	31	49	56
Horiba LabRAM HR	31	49	56
Metrology, Helium Ion Microscope (4200002158)	121	190	219
Zeiss Orion NanoFab Helium Ion Microscope	121	190	219
Metrology, Kratos XPS (4200001844)	40	66	75
Kratos AXIS Ultra DLD Imaging XPS	40	66	75
Metrology, Omicron Surface Analysis (4200001845)	19	37	42
Omicron Surface Analysis Cluster	19	37	42
Metrology, Optics and Spectroscopy Lab (4200001843)	32	53	61
J.A. Woollam RC2 Spectroscopic Ellipsometer	32	53	61
Lambda 950	32	53	61
Neaspec IR-Neascope - TERS - NSOM - TEPL	32	53	61
Neaspec NanoFTIR Ultrafast Pump-probe	32	53	61
SolsticeACE‐TOPAS	32	53	61
Thermo Scientific DXR3xi Raman Imaging Microscope	32	53	61
VASE Ellipsometer	32	53	61
Metrology, PQSEI (4200002159)	16	24	28
Horiba XploRA Confocal Raman Microscope	16	24	28
Metrology, Panalytical XRD (4200001846)	29	50	58
XRD	29	50	58
Packaging and Assembly, Advanced (4200001848)	44	85	98
Accretech SS20 Dicing Saw	44	85	98
DiscoDad 2	44	85	98
Finetech Fineplacer Lambda 2 Flip Chip Bonder	44	85	98
G&P Technology POLI-500 Chemical Mechanical Polishing System	44	85	98
JFP Wire Bonder	44	85	98
LPKF Mill	44	85	98
LPKF Plater	44	85	98
LPKF Press	44	85	98
Nordson C-SAM Gen 7 Scanning Acoustic Microscope	44	85	98
Pick and Place	44	85	98
Westbond 7476E Thermosonic Wedge Bonder ‐ Aluminum	44	85	98
Westbond 7476E Thermosonic Wedge Bonder ‐ Gold	44	85	98
Packaging and Assembly, Basic (4200001847)	19	37	42
ASAP‐1 IPS Digital Sample Preparation System	19	37	42
Critical Point Dryer	19	37	42
Fuji Inkjet	19	37	42
Kruss DSA25 Drop Shape Analyzer	19	37	42
Maxwell Component: E‐spin chamber/Laser	19	37	42
Maxwell Component: Novacentrix PulseForge	19	37	42
Nanoscribe Photonic Professional GT2 3D Printer	19	37	42
TA Instruments DHR3 Rheometer	19	37	42
ULS PLS6MW Laser Engraver	19	37	42
Roll‐to‐Roll, Process Demonstration (4200001850)	191	350	402
Maxwell Roll to Roll System	191	350	402
Mirwec	191	350	402
PPSI_Inkjet	191	350	402
Roll‐to‐Roll, Prototyping (4200001849)	95	149	172
LasX	95	149	172
MPS TF‐100 Screen Printer	95	149	172
Nordson Quantum Q‐6800 Fluid Dispensing System	95	149	172

Staff Time Charges

Rates are $ hourly.

Charge	INT	ENP	EFP

Charge	INT	ENP	EFP
Staff Time, Engineering	76	144	166
Staff Time, Scientific, Center for AFM	64	101	116
Staff Time, Scientific, Optics	90	140	161
Staff Time, Scientific, Roll to Roll	102	160	184
Staff Time, Scientific, Spin Lab	106	166	191
Staff Time, Scientific, Surface Analysis	103	162	186

Notes

Scifres Equipment Service Cap

Scifres Equipment Service Cap: For internal users, a $13,000 hard cap is implemented for shared use equipment services on the Scifres cost center per user, per account (WBSE/IO), per fiscal year (by billing date). Any user is “uncapped” after being subsidized a total of $12,000 under this cap across all their associated accounts per fiscal year (by billing date). Capping is done monthly by covering the costs for the affected usage from the Birck General Fund.

Staff Core Services

Any training or core services on tools by BNC engineers/scientists will be added onto the iLab calendar charge as an add-on based on the amount of actual time spent on the training/core service, rounded up to a reasonable fraction of the hour.

Staff time related to researchers having used equipment, laboratories, or software in a manner inconsistent with BNC standard operating procedures, including staff time for communications, retraining, user identification, determining a timeline of events, extraordinary repair, etc., may be charged as core services at an unsubsidized rate for internal users (the approved break-even rate for the relevant Staff Time, rounded up to the nearest dollar). Where applicable, and consistent with the principles in 2 CFR 200, direct costs for replacement/repair of equipment, parts, and consumables may be charged directly to the relevant user and grant which incurred the cost if the research techniques which incurred the cost were outside the scope of relevant standard operating procedures. Operation of shared equipment/spaces inconsistent with the relevant standard operating procedures is generally not covered by the recharge rate.

Definition of Indiana Small Businesses

Indiana Small Business are defined here as *'s organized for profit, with a place of business located in the State of Indiana, or which makes a significant contribution to the economy of the State of Indiana through use of Indiana labor; is in the legal form of an individual proprietorship, partnership, limited liability company, corporation, joint venture, association, trust or cooperative; and has, including its affiliates, not more than 50 employees.

Birck Laboratory Stocked Supplies (subject to change without notice)

General Labs stocked supplies:
- Gloves
  - Ultrasense (Deep blue) nitrile gloves
  - Accutech latex gloves (for solvent use, cleanroom grade)
  - Acid gloves (cleanroom grade)
- Wipes
  - 1109 Techwipe cleanroom wipes
  - Kimwipes (Small, Standard, EXL)
- Solvents
  - Isopropanol
  - Methanol
  - Acetone
  - Toluene
  - Solvent squeeze bottles
  - Solvent waste bottles
- Acids
  - Hydrogen Peroxide
  - Buffered Oxide Etch
  - Hydrofluoric Acid
  - Hydrochloric Acid
  - Ammonium Hydroxide
  - Sulfuric Acid
  - Nitric Acid
  - Phosphoric Acid
  - Acetic Acid (Glacial)
- Chemical PPE
  - Acid PPE (aprons and face shields)
  - Sharps containers and broken glass containers
  - HF Safety Items
  - Bottle carriers
- Available by request, if needed and used responsibly:
  - Supreno (light blue) nitrile gloves
  - Tacky mats
  - Swiffers
  - Hair covers
  - Shoe covers (conductive or non-conductive)
  - Microscope slides
  - Pasteur pipettes
  - Small latex bulbs
  - Swabs
  - UHV foil
  - 2069 cleanroom wipes
  - Nanofabrication solvents and optical lithography chemicals
BioLabs Stocked Supplies: In addition to General Labs supplies:
- Bio specific PPE and safety items
  - Midknight nitrile gloves (BSL1) or Sterling nitrile gloves (BSL2)
  - Biowaste bags
  - Soap
  - Paper Towels
  - Serological pipettes (3 sizes)
  - Aspirating pipettes
Cleanroom: In addition to general lab supplies:
- Cleanroom Chemicals
  - Nanofabrication Solvents
    - Chlorobenzene
    - HMDS
    - Xylene
    - PGMEA (SU8 Developer)
  - Nanofabrication Acids/bases
    - PRS 2000
    - Remover PG
    - CR-16 Chrome Etchant
    - FE-12-CC-11 Iron Oxide Etchant
    - Pure Strip
    - 25% TMAH
  - Lithography Chemicals
    - AZ Developer
    - AZ 1518 Photoresist
    - AZ 9260 Photoresist / AZ 10XT Photoresist
    - AZ 400K KOH Developer
    - MF26A Developer
  - E-Beam Lithography Chemicals
    - 950 PMMA and 495 PMMA EBL Resist
    - MIBK/IPA 1:3 PMMA Developer
    - AR-P 6200.13 EBL Resist (see Bill Rowe for details, wrowe@purdue.edu)
    - XR-1541 HSQ EBL Resist
- Cleanroom supplies
  - Many “by request” items are stocked:
    - Hair covers
    - Shoe covers (non-conductive)
    - Microscope slides
    - Pasteur pipettes
    - Small latex bulbs
    - Swabs
    - UHV foil
    - 2069 cleanroom wipes
- Cleanroom veils and Cleanroom M3 face masks
- Cleanroom paper and pens
- Label makers and printer labels for glassware
- Cleanroom tape

Birck Nanotechnology Center Wiki

Recharge Rates