Recharge Rates
Birck Nanotechnology Center Recharge Rates.
Effective June 1, 2023.
- Rate Types
- INT = Internal (Subsidized)
- ENP = External Non‐Profit, Academic, Governmental, and Indiana Small Business
- EFP = External For‐Profit
- Facilities and Administrative (F&A) costs are included in listed external prices.
Lab Access Charges
- Entering BRK labs incurs daily charges to pay for consumables and staff support.
- The Birck Lab Fee is charged for any day of lab entry into any BRK lab/galley.
- An additional surcharge also applies depending on the type of lab.
- If labs of different types are entered, multiple surcharges may be incurred.
- Each fee/surcharge is daily: charged up to once per calendar day, per user, regardless of the number of entries or different labs of that type entered.
- Monthly Lab Access Cap (Internal Users): Lab fees/surcharges are subsidized by BNC after paying 15 days per month (per user, per account, per fee/surcharge).
Access Charge | Applies to... | INT | ENP | EFP |
---|---|---|---|---|
Birck Lab Fee | Daily entry to any BRK lab/galley | 14 | 44 | 51 |
Bio Lab Surcharge | BSL1/2 labs: BRK 1081, 2037, 2043, 2066, 2077, 2087 | 9 | 20 | 23 |
Cleanroom Surcharge | BRK 2100A | 28 | 53 | 61 |
Gen Lab Surcharge | Any stocked lab/galley not BSL1/2 or BRK 2100A | 2 | 4 | 5 |
Equipment Rates
- Rates are $ hourly unless specified otherwise in the service name. Hourly billed tools are billed in time step increments of 5 - 60 minutes depending on the particular tool. Check iLab or contact the staff in charge of the tool for more information.
- "C ‐ " indicates services eligible for Scifres Equipment Cap for internal users.
- Precious metals are charged at market prices plus applicable markups and overhead charges.
Equipment | INT | ENP | EFP |
---|---|---|---|
C ‐ Deposition, ALD (4200001865) | 19 | 37 | 42 |
C ‐ Fiji200 ALD | 19 | 37 | 42 |
C ‐ Deposition, CVD (4200001866) | 45 | 89 | 102 |
C ‐ 2D CVD | 45 | 89 | 102 |
C ‐ Axic | 45 | 89 | 102 |
C ‐ EasyTube 3000 | 45 | 89 | 102 |
C ‐ Epigress | 45 | 89 | 102 |
C ‐ Parylene CVD Furnace | 45 | 89 | 102 |
C ‐ Plasma-Therm Apex SLR HDPCVD Deposition System | 45 | 89 | 102 |
C ‐ Tube 02 Nitride Dep | 45 | 89 | 102 |
C ‐ Tube 03 LTO Dep | 45 | 89 | 102 |
C ‐ Tube 06 Polysilicon | 45 | 89 | 102 |
C ‐ Tube 09 TEOS | 45 | 89 | 102 |
C ‐ Deposition, Flex Compatible PVD, Per Run (4200001862) | 161 | 308 | 354 |
C ‐ Lesker E‐Beam Evaporator ‐ Flexible Substrate Compatible (Per Run) | 161 | 308 | 354 |
C ‐ PVD Sputtering System ‐ Flexible Substrate Compatible (Per Run) | 161 | 308 | 354 |
C ‐ Deposition, PVD and Electroplating, Per Run (4200001863) | 117 | 229 | 263 |
C ‐ CHA E‐Beam Evaporator #1 (Per Run) | 117 | 229 | 263 |
C ‐ CHA E‐Beam Evaporator #2 (Per Run) | 117 | 229 | 263 |
C ‐ Iko Electroplating System (Per Run) | 117 | 229 | 263 |
C ‐ Lesker E‐Beam Evaporator (Per Run) | 117 | 229 | 263 |
C ‐ Leybold E‐Beam Evaporator (Per Run) | 117 | 229 | 263 |
C ‐ PVD E‐Beam Evaporator ‐ Glancing Angle Deposition (GLAD) (Per Run) | 117 | 229 | 263 |
C ‐ PVD E‐Beam Evaporator ‐ Metal/Magnetic Sources (Per Run) | 117 | 229 | 263 |
C ‐ PVD Sputtering System ‐ 4 Target Magnetic Sources (Per Run) | 117 | 229 | 263 |
C ‐ PVD Sputtering System ‐ 6 Target Magnetic Sources (Per Run) | 117 | 229 | 263 |
C ‐ PVD Sputtering System ‐ Metal/Dielectric Sources (Per Run) | 117 | 229 | 263 |
C ‐ PVD Sputtering System ‐ Nitride (Per Run) | 117 | 229 | 263 |
C ‐ WAFAB Electroplating (Per Run) | 117 | 229 | 263 |
C ‐ Etching, General (4200001857) | 20 | 40 | 46 |
C ‐ Branson Asher | 20 | 40 | 46 |
C ‐ March Jupiter II | 20 | 40 | 46 |
C ‐ March Jupiter III | 20 | 40 | 46 |
C ‐ Xactix E1 Xenon Difluoride (XeF2) Etcher | 20 | 40 | 46 |
C ‐ Etching, ICP (4200001856) | 60 | 116 | 133 |
C ‐ AJA Ion Mill | 60 | 116 | 133 |
C ‐ Panasonic E620 ICP RIE Etcher | 60 | 116 | 133 |
C ‐ Plasma-Therm Apex SLR ICP RIE Etcher | 60 | 116 | 133 |
C - Plasma-Therm Versaline DSE Deep Silicon Etcher | 60 | 116 | 133 |
C ‐ STS AOE | 60 | 116 | 133 |
C ‐ STS ASE 2 | 60 | 116 | 133 |
C ‐ Furnace, Oxidation/Annealing (4200001867) | 23 | 43 | 49 |
C ‐ Blue M Furnace | 23 | 43 | 49 |
C ‐ Jipelec RTA | 23 | 43 | 49 |
C ‐ Nitric Oxide Anneal | 23 | 43 | 49 |
C ‐ Nitrogen Anneal Furnace | 23 | 43 | 49 |
C ‐ RCA Hood | 23 | 43 | 49 |
C ‐ Tube 01 Clean Ox | 23 | 43 | 49 |
C ‐ Tube 04 Field Ox | 23 | 43 | 49 |
C ‐ Tube 05 Anneal | 23 | 43 | 49 |
C ‐ Tube 07 General Ox | 23 | 43 | 49 |
C ‐ Tube 08 Phos Drive | 23 | 43 | 49 |
C ‐ Lithography, Aligners (4200001860) | 46 | 115 | 132 |
C ‐ 557 MJB3 Aligners | 46 | 115 | 132 |
C ‐ Heidelberg MLA150 Maskless Aligner | 46 | 115 | 132 |
C ‐ MA6 | 46 | 115 | 132 |
C ‐ MJB3_1 | 46 | 115 | 132 |
C ‐ MJB3_2 | 46 | 115 | 132 |
C ‐ MJB4 | 46 | 115 | 132 |
C ‐ Nanonex NX‐2000 | 46 | 115 | 132 |
C ‐ SB6e bonder | 46 | 115 | 132 |
C ‐ Lithography, E‐Beam, 100 kV (4200001858) | 92 | 238 | 273 |
C ‐ JEOL JBX‐8100FS E‐Beam Writer #1 | 92 | 238 | 273 |
C ‐ JEOL JBX‐8100FS E‐Beam Writer #2 | 92 | 238 | 273 |
C ‐ Lithography, Spinners (4200001859) | 21 | 44 | 50 |
C ‐ Laurell EDC‐650 Spin Processor | 21 | 44 | 50 |
C ‐ SCS 6808P Spinner #2 | 21 | 44 | 50 |
C ‐ SCS G3P‐8 Spinner #1 | 21 | 44 | 50 |
C ‐ Spinner3 | 21 | 44 | 50 |
C ‐ Spinner4 | 21 | 44 | 50 |
C ‐ Metrology, General (4200001864) | 26 | 51 | 59 |
C ‐ Alpha‐Step | 26 | 51 | 59 |
C ‐ Bruker GT‐K | 26 | 51 | 59 |
C ‐ Cleanroom Ellipsometer | 26 | 51 | 59 |
C ‐ DI3100 BRK1265 | 26 | 51 | 59 |
C ‐ Filmetrics F10‐RT | 26 | 51 | 59 |
C ‐ Filmetrics F40‐UV | 26 | 51 | 59 |
C ‐ JEOL JCM 5000 Neoscope SEM | 26 | 51 | 59 |
C ‐ Keyence VHX‐6000 Digital Microscope | 26 | 51 | 59 |
C ‐ KLA‐Tencor P‐10 Profilometer | 26 | 51 | 59 |
C ‐ Leica DCM8 Confocal Microscope | 26 | 51 | 59 |
C ‐ Nanoman AFM | 26 | 51 | 59 |
C ‐ Nikon Eclipse L150 Microscope 1 (N Bay) | 26 | 51 | 59 |
C ‐ Nikon Eclipse L150 Microscope 2 (N Bay) | 26 | 51 | 59 |
C ‐ Olympus BX‐60 Microscope (J Bay) | 26 | 51 | 59 |
C ‐ Olympus Microscope | 26 | 51 | 59 |
C ‐ P‐7 Profilometer | 26 | 51 | 59 |
C ‐ Park NX20 AFM | 26 | 51 | 59 |
C ‐ Stress Machine | 26 | 51 | 59 |
Characterization, LDV (4200001842) | 26 | 41 | 47 |
Polytec Laser Vibrometer | 26 | 41 | 47 |
Suss PLV50 ProbeStation | 26 | 41 | 47 |
Characterization, Probe Station (4200001836) | 27 | 51 | 59 |
Cleanroom Probe 1 | 27 | 51 | 59 |
FormFactor PAV200 Semi-Automatic Vacuum Probe Station | 27 | 51 | 59 |
Jandel 4‐point Probe | 27 | 51 | 59 |
Microxact CPS-50-HT High Temperature Probe Station | 27 | 51 | 59 |
MM P200L Semi‐Automatic Probe Station | 27 | 51 | 59 |
MMR Probe | 27 | 51 | 59 |
Probe 1 | 27 | 51 | 59 |
Probe 2 | 27 | 51 | 59 |
Characterization, Spin Lab (4200001837) | 12 | 46 | 53 |
Lakeshore CRX-4K Cryogenic Probe Station | 12 | 46 | 53 |
Lakeshore CRX-VF Cryogenic Vertical Field Probe Station | 12 | 46 | 53 |
MPMS | 12 | 46 | 53 |
PPMS | 12 | 46 | 53 |
Deposition, PLD, Per Run (4200001839) | 400 | 628 | 723 |
PVD Pulsed Laser Deposition (PLD) (Per Run) | 400 | 628 | 723 |
Lithography, E‐Beam, 30 kV (4200001838) | 64 | 124 | 142 |
Raith eLine E‐Beam Writer | 64 | 124 | 142 |
Metrology, Center for AFM (4200001841) | 48 | 89 | 102 |
Asylum MFP 3D Bio | 48 | 89 | 102 |
Asylum_Cypher_BRK | 48 | 89 | 102 |
Metrology, Femtosecond and Raman (4200001840) | 31 | 49 | 56 |
Coherent Legend FS | 31 | 49 | 56 |
Horiba LabRAM HR | 31 | 49 | 56 |
Metrology, Helium Ion Microscope (4200002158) | 121 | 190 | 219 |
Zeiss Orion NanoFab Helium Ion Microscope | 121 | 190 | 219 |
Metrology, Kratos XPS (4200001844) | 40 | 66 | 75 |
Kratos AXIS Ultra DLD Imaging XPS | 40 | 66 | 75 |
Metrology, Omicron Surface Analysis (4200001845) | 19 | 37 | 42 |
Omicron Surface Analysis Cluster | 19 | 37 | 42 |
Metrology, Optics and Spectroscopy Lab (4200001843) | 32 | 53 | 61 |
J.A. Woollam RC2 Spectroscopic Ellipsometer | 32 | 53 | 61 |
Lambda 950 | 32 | 53 | 61 |
Neaspec IR-Neascope - TERS - NSOM - TEPL | 32 | 53 | 61 |
Neaspec NanoFTIR Ultrafast Pump-probe | 32 | 53 | 61 |
SolsticeACE‐TOPAS | 32 | 53 | 61 |
Thermo Scientific DXR3xi Raman Imaging Microscope | 32 | 53 | 61 |
VASE Ellipsometer | 32 | 53 | 61 |
Metrology, PQSEI (4200002159) | 16 | 24 | 28 |
Horiba XploRA Confocal Raman Microscope | 16 | 24 | 28 |
Metrology, Panalytical XRD (4200001846) | 29 | 50 | 58 |
XRD | 29 | 50 | 58 |
Packaging and Assembly, Advanced (4200001848) | 44 | 85 | 98 |
Accretech SS20 Dicing Saw | 44 | 85 | 98 |
DiscoDad 2 | 44 | 85 | 98 |
Finetech Fineplacer Lambda 2 Flip Chip Bonder | 44 | 85 | 98 |
JFP Wire Bonder | 44 | 85 | 98 |
LPKF Mill | 44 | 85 | 98 |
LPKF Plater | 44 | 85 | 98 |
LPKF Press | 44 | 85 | 98 |
Pick and Place | 44 | 85 | 98 |
Westbond 7476E Thermosonic Wedge Bonder ‐ Aluminum | 44 | 85 | 98 |
Westbond 7476E Thermosonic Wedge Bonder ‐ Gold | 44 | 85 | 98 |
Packaging and Assembly, Basic (4200001847) | 19 | 37 | 42 |
ASAP‐1 IPS Digital Sample Preparation System | 19 | 37 | 42 |
Critical Point Dryer | 19 | 37 | 42 |
Fuji Inkjet | 19 | 37 | 42 |
Kruss DSA25 Drop Shape Analyzer | 19 | 37 | 42 |
Maxwell Component: E‐spin chamber/Laser | 19 | 37 | 42 |
Maxwell Component: Novacentrix PulseForge | 19 | 37 | 42 |
Nanoscribe Photonic Professional GT2 3D Printer | 19 | 37 | 42 |
TA Instruments DHR3 Rheometer | 19 | 37 | 42 |
ULS PLS6MW Laser Engraver | 19 | 37 | 42 |
Roll‐to‐Roll, Process Demonstration (4200001850) | 191 | 350 | 402 |
Maxwell Roll to Roll System | 191 | 350 | 402 |
Mirwec | 191 | 350 | 402 |
PPSI_Inkjet | 191 | 350 | 402 |
Roll‐to‐Roll, Prototyping (4200001849) | 95 | 149 | 172 |
LasX | 95 | 149 | 172 |
MPS TF‐100 Screen Printer | 95 | 149 | 172 |
Nordson Quantum Q‐6800 Fluid Dispensing System | 95 | 149 | 172 |
Staff Time Charges
- Rates are $ hourly.
Charge | INT | ENP | EFP |
---|---|---|---|
Staff Time, Engineering | 76 | 144 | 166 |
Staff Time, Scientific, Center for AFM | 64 | 101 | 116 |
Staff Time, Scientific, Optics | 90 | 140 | 161 |
Staff Time, Scientific, Roll to Roll | 102 | 160 | 184 |
Staff Time, Scientific, Spin Lab | 106 | 166 | 191 |
Staff Time, Scientific, Surface Analysis | 103 | 162 | 186 |
Notes
Scifres Equipment Service Cap
Scifres Equipment Service Cap: For internal users, a $13,000 hard cap is implemented for shared use equipment services on the Scifres cost center per user, per account (WBSE/IO), per fiscal year (by billing date). Any user is “uncapped” after being subsidized a total of $12,000 under this cap across all their associated accounts per fiscal year (by billing date). Capping is done monthly by covering the costs for the affected usage from the Birck General Fund.
Staff Core Services
Any training or core services on tools by BNC engineers/scientists will be added onto the iLab calendar charge as an add-on based on the amount of actual time spent on the training/core service, rounded up to a reasonable fraction of the hour.
Staff time related to researchers having used equipment, laboratories, or software in a manner inconsistent with BNC standard operating procedures, including staff time for communications, retraining, user identification, determining a timeline of events, extraordinary repair, etc., may be charged as core services at an unsubsidized rate for internal users (the approved break-even rate for the relevant Staff Time, rounded up to the nearest dollar). Where applicable, and consistent with the principles in 2 CFR 200, direct costs for replacement/repair of equipment, parts, and consumables may be charged directly to the relevant user and grant which incurred the cost if the research techniques which incurred the cost were outside the scope of relevant standard operating procedures. Operation of shared equipment/spaces inconsistent with the relevant standard operating procedures is generally not covered by the recharge rate.
Definition of Indiana Small Businesses
Indiana Small Business are defined here as *'s organized for profit, with a place of business located in the State of Indiana, or which makes a significant contribution to the economy of the State of Indiana through use of Indiana labor; is in the legal form of an individual proprietorship, partnership, limited liability company, corporation, joint venture, association, trust or cooperative; and has, including its affiliates, not more than 50 employees.
Birck Laboratory Stocked Supplies (subject to change without notice)
- General Labs stocked supplies:
- Gloves
- Ultrasense (Deep blue) nitrile gloves
- Accutech latex gloves (for solvent use, cleanroom grade)
- Acid gloves (cleanroom grade)
- Wipes
- 1109 Techwipe cleanroom wipes
- Kimwipes (Small, Standard, EXL)
- Solvents
- Isopropanol
- Methanol
- Acetone
- Toluene
- Solvent squeeze bottles
- Solvent waste bottles
- Acids
- Hydrogen Peroxide
- Buffered Oxide Etch
- Hydrofluoric Acid
- Hydrochloric Acid
- Ammonium Hydroxide
- Sulfuric Acid
- Nitric Acid
- Phosphoric Acid
- Acetic Acid (Glacial)
- Chemical PPE
- Acid PPE (aprons and face shields)
- Sharps containers and broken glass containers
- HF Safety Items
- Bottle carriers
- Available by request, if needed and used responsibly:
- Supreno (light blue) nitrile gloves
- Tacky mats
- Swiffers
- Hair covers
- Shoe covers (conductive or non-conductive)
- Microscope slides
- Pasteur pipettes
- Small latex bulbs
- Swabs
- UHV foil
- 2069 cleanroom wipes
- Nanofabrication solvents and optical lithography chemicals
- Gloves
- BioLabs Stocked Supplies: In addition to General Labs supplies:
- Bio specific PPE and safety items
- Midknight nitrile gloves (BSL1) or Sterling nitrile gloves (BSL2)
- Biowaste bags
- Soap
- Paper Towels
- Serological pipettes (3 sizes)
- Aspirating pipettes
- Bio specific PPE and safety items
- Cleanroom: In addition to general lab supplies:
- Cleanroom Chemicals
- Nanofabrication Solvents
- Chlorobenzene
- HMDS
- Xylene
- PGMEA (SU8 Developer)
- Nanofabrication Acids/bases
- PRS 2000
- Remover PG
- CR-16 Chrome Etchant
- FE-12-CC-11 Iron Oxide Etchant
- Pure Strip
- 25% TMAH
- Lithography Chemicals
- AZ Developer
- AZ 1518 Photoresist
- AZ 9260 Photoresist / AZ 10XT Photoresist
- AZ 400K KOH Developer
- MF26A Developer
- E-Beam Lithography Chemicals
- 950 PMMA and 495 PMMA EBL Resist
- MIBK/IPA 1:3 PMMA Developer
- AR-P 6200.13 EBL Resist (see Bill Rowe for details, wrowe@purdue.edu)
- XR-1541 HSQ EBL Resist
- Nanofabrication Solvents
- Cleanroom supplies
- Many “by request” items are stocked:
- Hair covers
- Shoe covers (non-conductive)
- Microscope slides
- Pasteur pipettes
- Small latex bulbs
- Swabs
- UHV foil
- 2069 cleanroom wipes
- Many “by request” items are stocked:
- Cleanroom veils and Cleanroom M3 face masks
- Cleanroom paper and pens
- Label makers and printer labels for glassware
- Cleanroom tape
- Cleanroom Chemicals