CrossLab Name:  JFP Wire Bonder
FIC: David Janes
Owner: Tim Miller
Location: BRK 2092
Maximum Wafer Size: N/A

Overview

General Description

This precision tool welds gold wire from chip pad to package. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

Specifications

The JFP WB-100 is a general purpose wire bonder.  It is capable of ball, wedge, and ribbon bonding, HOWEVER the changeover from one mode to another is non-trivial, therefore it is usually set up for ball bonding with 1 mil (25 micron) gold wire.

Technology Overview - Remove if multiple tools use the same technology/process

Sample Requirements and Preparation

No special sample cleaning is required prior to wire bonding.  Sample metallization must be thick enough to withstand the rigors of bonding.  Samples must be securely mounted in their respective packages, and the package must be securely mounted to the bonding fixture.  Double-sided cellophane tape is not an acceptable mounting technique.  

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References