Skip to end of metadata
Go to start of metadata

You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 8 Next »

2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff



iLab Name: C - Cascade Tek TVO-2 Vacuum Oven
iLab Kiosk: BRK Lithography Core
FIC:
Shared
Owner: Joon Park 

Location:
Cleanroom - M Bay
Maximum Wafer Size: 
12"/300 mm

Overview

Vacuum oven for PMMA and ZEP (for solvent Anisole bake-out)


Standard Operating Procedure

Cascade TEK Vacuum Oven SOP

Questions & Troubleshooting

  1. Is it enough to bake PMMA at 75C for 30 min?

(answered by Justin Wirth)

PMMA “A” uses anisole as the solvent that we’re trying to remove in the soft bake, which is normally done by baking for 3 – 5 minutes at 180 C atmospheric pressure. Anisole has a vapor pressure of 3.54 Torr (3540 mTorr) @ 25 C (https://pubchem.ncbi.nlm.nih.gov/compound/Anisole#section=Vapor-Pressure) and 200 Torr at 110 C (https://webbook.nist.gov/cgi/cbook.cgi?ID=C100663&Mask=4&Type=ANTOINE&Plot=on).

Coming up with some vapor pressure values from here: https://webbook.nist.gov/cgi/cbook.cgi?ID=C100663&Mask=4&Type=ANTOINE&Plot=on

1545 Torr @ 180 C (estimated)
1180 Torr @ 170 C (estimated)
900 Torr @ 160 C
760 Torr @ 153 C
687 Torr @ 150 C
524 Torr @ 140 C
80 Torr @ 70 C (estimated)
For effective outgassing, we’d like the vapor pressure at our temperature to be double the actual temperature. For example, the vapor pressure at the softbake temperature of 180 C is 1545 Torr, which is 2x ambient pressure (760 Torr). Put another way, for efficient outgassing, we’d need to be at half of the vapor pressure of anisole at a given temperature.

At 25 C, this would be 3.54 Torr/2 = 1.77 Torr (1770 mTorr), and I’d estimate at 20 C it’s ~1530 mTorr. So if we can get the vacuum oven below 1500 mTorr (TEK vacuum oven can go down to 1000 mTorr), even at room temperature, it will be sufficient to properly outgas the anisole in PMMA.

The reason for the elevated temperature is to add a factor of safety, and to further increase the rate of outgassing. There’s about a 31% increase in outgassing effectiveness for every 10 C. Working at 75 C gives a very thorough factor of safety (4x, (100%+31%)^5). 


Process Library

1. PMMA Bake: bake at 75C for 30 min


References


  • No labels