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Page Properties
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Problem Reporting Guide
Problem Reporting Guide
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StatusDownUP
Issue Date and Description

8/13/2024 Vibration has shaken loose part of the stage, such that loading and unloading is not possible

Estimated Fix Date and Comment
9/10/2024 Lower shielding has been temporarily removed, which should not impact operation, as oxide etch is not available
Responding StaffDave Lubelski/Dan Witter


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e-Log Link - Sputtering System
e-Log Link - Sputtering System
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iLab NameC - PVD Sputtering System - Metal/Dielectric Sources
iLab KioskBRK Evaporation Sputtering Core
FICPeter Bermel
OwnerDave Lubelski
LocationCleanroom - S Bay
Max. Wafer4"/100 mm



Page Properties
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Current Sources

Ti, TiN, Al, Ta

Potential SourcesSi,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, NbTi, W3Si4, TiO2, Si3N4, SiO2, TiN, MoSi2, Ru




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Overview

General Description

Metal/dielectric sputtering system

Specifications

DC/RF sputtering capable, 2" targets, base pressure 2x10-6 torr, materials include: Si,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, WSi4, TiO2, Si3N4, SiO2, water cooled stage

Technology Overview 

No Organics/Polymers Allowed


Sample Requirements and Preparation


Standard Operating Procedure

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Note 1: This instrument is billed "per use based on a 2 hour block.

Note 2:  Please observe only 1 user per session.  Your reservation concludes when you vent the system and unload your sample.  

Example: If the usage is 10+ minutes past the 2 hour reservation, you will be billed for 2 uses.



Questions & Troubleshooting



Process Library

References