PVD Sputtering System - Metal/Dielectric Sources
Status | UP |
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Issue Date and Description |
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Estimated Fix Date and Comment | |
Responding Staff | Ethan Zhang |
iLab Name | |
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iLab Kiosk | |
FIC | Peter Bermel |
Owner | Ethan Zhang |
Location | Cleanroom - S Bay |
Max. Wafer | 4"/100 mm |
Current Sources | Cu W Al Ti |
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Potential Sources | Ag, Al, Al₂O₃, Au, Cr, Cu, Ge, MoSi₂, Nb, Nb70Ti30(wt%), Pt, Ru, Si, Si₃N₄, SiO₂, Ta, Ti, TiN, TiO₂, W, W₃Si₄ |
Overview
General Description
Metal/dielectric sputtering system
Specifications
DC/RF sputtering capable, 2" targets, base pressure 2x10-6 torr, water cooled stage
Technology Overview
No Organics/Polymers Allowed
Standard Operating Procedure