PVD Sputtering System - Metal/Dielectric Sources

Owned by Former user (Deleted)
Last updated: yesterday at 4:55 pm by Witter, Daniel Joseph
1 min read


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusDown
Issue Date and Description

8/13/2024 Vibration has shaken loose part of the stage, such that loading and unloading is not possible

Estimated Fix Date and Comment
9/9/2024
Responding StaffDave Lubelski/Dan Witter


iLab KioskeLog: SubmiteLog: View/EditReport ProblemMSDS Documents


iLab NameC - PVD Sputtering System - Metal/Dielectric Sources
iLab KioskBRK Evaporation Sputtering Core
FICPeter Bermel
OwnerDave Lubelski
LocationCleanroom - S Bay
Max. Wafer4"/100 mm


Current Sources

Ti, TiN, Al, Ta

Potential SourcesSi,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, NbTi, W3Si4, TiO2, Si3N4, SiO2, TiN, MoSi2, Ru

Overview

General Description

Metal/dielectric sputtering system

Specifications

DC/RF sputtering capable, 2" targets, base pressure 2x10-6 torr, materials include: Si,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, WSi4, TiO2, Si3N4, SiO2, water cooled stage

Technology Overview 

No Organics/Polymers Allowed


Sample Requirements and Preparation


Standard Operating Procedure

Note 1: This instrument is billed "per use based on a 2 hour block.

Note 2:  Please observe only 1 user per session.  Your reservation concludes when you vent the system and unload your sample.  

Example: If the usage is 10+ minutes past the 2 hour reservation, you will be billed for 2 uses.



Questions & Troubleshooting



Process Library

References