Status	UP
Issue Date and Description	10/8/2025 Matching network controller for RF2 supply has been removed to use on the 4-target metal/magnetics tool. RF1 still is available and functional, and RF2 will be back after the controller has been repaired.
Estimated Fix Date and Comment
Responding Staff	Dave Lubelski/Dan Witter

iLab Name	C - PVD Sputtering System - Metal/Dielectric Sources
iLab Kiosk	BRK Evaporation Sputtering Core
FIC	Peter Bermel
Owner	Dave Lubelski
Location	Cleanroom - S Bay
Max. Wafer	4"/100 mm

Current Sources	Ta, Cu, Si3N4, TiN
Potential Sources	Si,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, NbTi, W3Si4, TiO2, Si3N4, SiO2, TiN, MoSi2, Ru, Pt

Overview

General Description

Metal/dielectric sputtering system

Specifications

DC/RF sputtering capable, 2" targets, base pressure 2x10-6 torr, materials include: Si,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, WSi4, TiO2, Si3N4, SiO2, water cooled stage

Technology Overview

_{No Organics/Polymers Allowed}

Sample Requirements and Preparation

Standard Operating Procedure

Note 1: This instrument is billed "per use based on a 2 hour block.

Note 2: Please observe only 1 user per session. Your reservation concludes when you vent the system and unload your sample.

Example: If the usage is 10+ minutes past the 2 hour reservation, you will be billed for 2 uses.

Questions & Troubleshooting

PVD Sputtering System - Metal/Dielectric Sources