Deposition

Overview

At Birck, over 30 systems provide a variety of methods to deposit over 60 different metals, dielectrics, and organics. Capabilities include:

• Atomic Layer Deposition (ALD)
• Chemical Vapor Deposition (CVD)
• Plasma Enhanced Chemical Vapor Deposition (PECVD)
• High Density Plasma CVD (HDPCVD)
• E-beam Evaporation
• DC/RF Sputtering
• multi-deposition (E-Beam Evaporation + Sputtering)
• GaN Molecular Beam Epitaxy (MBE)
• PVD Pulsed Laser Deposition (PLD)
• Electrodeposition

Staff contact: Ron Reger

List of currently available materials for deposition

Evaporator Sources

Sputterer Sources

• Atomic Layer Deposition (ALD)
  • Aixtron BlackMagic ALD
  • LC Tech Glovebox and ALD Systems
  • VTI Glovebox and ALD Systems
  • Cambridge Nanotech Fiji ALD
  • ASM F120 ALD
• PECVD (Plasma Enhanced Chemical Vapor Deposition)
  • Axic PECVD
  • Plasma-Therm Apex SLR HDPCVD
  • Carbon Nanotube PECVD
• CVD
  • Epigress
  • SCS Parylene CVD
  • EasyTube 3000 CVD
• Evaporation
  • CHA E-Beam Evaporator #1
  • CHA E-Beam Evaporator #2
  • Lesker E-Beam Evaporator - Flexible Substrate Compatible
  • Leybold E-Beam Evaporator
  • PVD E-Beam Evaporator - Metal/Magnetic Sources
  • PVD E-Beam Evaporator - Glancing Angle Deposition (GLAD)
• Sputtering
  • PVD Sputtering System - Nitride
  • PVD Sputtering System - Metal/Dielectric Sources
  • PVD Sputtering System - 4 Target Magnetic Sources
  • PVD Sputtering System - 6 Target Magnetic Sources
  • PVD Sputtering System - Flexible Substrate Compatible
• Other
  • GaN MBE
  • PVD Pulsed Laser Deposition (PLD) System
  • AJA E-Beam Evaporation and Sputtering System
• Electrodeposition
  • Electrodeposition (Princeton Applied)
  • IKO Jr Electroplater
• Materials in Vacuum
  • Vacuum Oven at BRK2031