| Table of Content Zone | ||||||||
|---|---|---|---|---|---|---|---|---|
| ||||||||
|
Technology Overview
Spin coating of photoresist allows a uniform layer to be distributed on a substrate in a short amount of time.
Advantages:
- Uniform coating of photoresist on rotationally symmetric substrates (i.e. wafers)
- Small amount of photoresist used
- Quick process
Disadvantages:
- Coating uniformity degrades for non-rotationally symmetric substrates (i.e. squares and rectangles)
- Edge bead formation
- Potentially poor coverage of textured/patterned surface
| Widget Connector | ||
|---|---|---|
|
Representative Coating Cycle
Process Library
For in-depth information about photoresist properties and spin recipes, see BNC Supplied Photoresists.
Typical Recipe:
Step 0: Values should be set to 0 or "None". Disp should be rounded up to the nearest chuck size, and Disp Time may be set to a nonzero value to avoid the "Homing" step after spinning.
Step 1: Timed ramp and dwell at process rpm.
Step 2: Timed ramp down to zero rpm / unload
AZ1518
Standard Spin, AZ1518, no dispersal steps
| Step | Ramp (s) | RPM | Dwell (s) |
|---|---|---|---|
| 0 | 0 | 0 | 0 |
| 1 | 2.0 | 4000 | 40 |
| 2 | 2.0 | 0 | 0 |
Standard Spin, AZ1518, initial dispersal spin
| Step | Ramp (s) | RPM | Dwell (s) |
|---|---|---|---|
| 0 | 0 | 0 | 0 |
| 1 | 1.0 | 500 | 5 |
| 2 | 2.0 | 4000 | 40 |
| 3 | 2.0 | 0 | 0 |