iLab Name: N/A
iLab Kiosk:
FIC: Tim Sands
Owner: Nithin Raghunathan
Location: BRK 1217
Maximum Wafer Size:
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Overview
General Description
Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes.
Specifications
Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity
Technology Overview - Remove if multiple tools use the same technology/process
Sample Requirements and Preparation
Standard Operating Procedure
Questions & Troubleshooting
Process Library
References