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Hotplate Bonder
Hotplate Bonder
iLab Name: N/A
iLab Kiosk:N/A
FIC: Tim Sands
Owner: Nithin Raghunathan
Location: BRK 1217
Maximum Wafer Size:
Overview
General Description
Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes.
Specifications
Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity
Technology Overview
Sample Requirements and Preparation
Standard Operating Procedure
Questions & Troubleshooting
Process Library
References
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