2025-05-05 to 2025-05-23: Semi-Annual Facility Preventive Maintenance

Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

Status	UP
Issue Date and Description
Estimated Fix Date and Comment
Responding Staff

iLab Name: N/A
iLab Kiosk:N/A
FIC: Tim Sands
Owner: Nithin Raghunathan
Location: BRK 1217
Maximum Wafer Size: 

Overview

General Description

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes.

Specifications

Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity

Technology Overview 

Sample Requirements and Preparation

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References