With the install of the new spinners, materials will be segregated by spinner. Please see the following page for what spinner you will need to use for a particular material once the spinners are reclasiffied.
The categories and allowed chemical/spinner pairings are still being refined and your feedback would be appreciated. Please comment on this page (at the page bottom) with any questions, comments, or feedback.
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Spinner 1 & 2 : Acetone Soluble Resists
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Spinner 1: Laurell WS-650HSpinner 2: Laurell WS-650Novolak Resists
Acrylic Resists
Adhesion Promoters
Solvents
ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists. Approval for new/additional chemicals:Additional materials must be pre-approved, and material must: A) Be completely removed in acetone if dried. |
Spinner 3: SU-8, PGME Resists, Plastics, and other Spin-on-Materials (Foil required)
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Spinner 3: SCS GSP-8
SU-8 Epoxy
Plastics
LOR/PGMI (Cyclopentanone/PGME)
Adhesion promoters
Spin on dopants/Spin on glass
Etch Protectants/Waxes
Other Spin on Materials
Cleaning Solvents
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Spinner 4: EBL/NIL (Foil required)
Spinner 4: SCS G3P-8
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EBL Resists
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EBL Adhesion Promoters
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NIL Resists & Promoters
- NXR-3000
- Ormolayer stamp
- Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)
Resist Removal Solvents
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Approval for new/additional chemicals
Additional materials must be pre-approved, and material must:
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A) Be for use in an EBL or NIL system. |
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Spinner 3: SCS GSP-8
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Complete aluminum foil covering of the spinner bowl is required! |
SU-8 Epoxy
SU-8 (Any dilution)
SU-8 Thinner (gamma-Butyrolactone (GBL)
- OmniCoat (PGME/Cyclopentanone)
Plastics
- Polyimide
- Polystyrene
- Poly(vinyl alcohol)
- Poly(ethyleneimine)
LOR/PGMI (Cyclopentanone/PGME)
LOR A:
3A
3B
5A
30B
LOR B:
- 3B
- 30B
PGMI SF 8
Adhesion promoters
- 80% PGMEA + 20% HMDS Solutions
- MCC Primer 80/20
- Microprime MP-P20
Silgard A-174
- Ormoprime 08
- HD Microsystems VM652
3-mercaptopropyl trimethoxysilane
Spin on dopants/Spin on glass
P509 SOD
- B155 SOD
Etch Protectants/Waxes
- Protek A2-22
- Epotek OE
- Protek PSB and PS
- Protek B2 and B2 Primer
- Protek B3 and B3 Primer
Other Spin on Materials
- Polypropylene carbonate
- Graphite oxide
- Alq3
- Pelc conductive silver paint
- PST toluene
- Spin on teflon
- Coronene in toluene
Cleaning Solvents
As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate.
Specifically not permitted in Cleanroom
Silicones/PDMS
Reason: These are impossible to remove chemically once cured, and are not used for lithography processes. Email Joon Park for information on proper curing of HMDS outside the cleanroom.
- Sylgard 182
- Sylgard 184
100% HMDS
Reason: 100% HMDS is extremely hazardous for both skin contact and inhalation. Additionally, in air, it degrades into ammonia upon evaporation, which crosslinks common photoresist. It gives sub-optimal results compared to diluted (80% PGMEA + 20% HMDS) solutions, or SurPass. Contact Justin Wirth with any questions.
- HMDS/Hexamethyldisilazane
TBD:
AP
Ti prime
Nanoparticles
Liquid diamond monocrystalline (microdiamant)