Spinner 1 & 2 : Acetone Soluble Resists

Spinner 1: Laurell WS-650H

Spinner 2: Laurell WS-650

Novolak Resists

• AZ 1500 Series

• AZ 5200 Series
• AZ 9200 Series
• Shipley 1800 Series
• SPR 220 Series
• ma-N 2400 Series

Acrylic Resists

• 495 PMMA
• 950 PMMA
• PMMA + Compolymers

Adhesion Promoters

• SurPass 3000/4000
• MCC Primer 80/20
• Microprime MP-P20

Solvents

• Acetone
• Methanol
• IPA
• DI H20
• PGMEA (AZ EBR Solvent, Microposit Thinner P)

ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.

Approval for new/additional chemicals:

Additional materials must be pre-approved, and material must:

A) Be completely removed in acetone if dried.
B) Not polymerize in contact with acetone, PGMEA, or water.
C) Not have vapors which harden resist (NMP, Ammonia, toluene, cholorbenzene) or dope substrates.

Spinner 3: EBL/NIL (Foil required)

Spinner 3: SCS G3P-8

EBL Resists:

• HSQ
  • XR-1541
  • FOX-1X
• ZEP-520
• PMMA
  • 495 PMMA
  • 950 PMMA
  • PMMA + Compolymers
• ma-N 2400

EBL Conductive Polymers

• Aquasave 57xs

• ESpacer 300Z

EBL Adhesion Promoters

• 80% PGMEA + 20% HMDS Solutions
  • MCC Primer 80/20
  • Microprime MP-P20
• MAMA(8.5)MAA EL 11

NIL Resists & Promoters

• NXR-3000
• Ormolayer stamp
• Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)

Resist Removal Solvents

• As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate.

Approval for new/additional chemicals

Additional materials must be pre-approved, and material must:

A) Be for use in an EBL or NIL system.
B) Be spun in low volumes.
C) Be removable with an approved solvent or alkaline.

Spinner 4: SU-8, PGME Resists, Plastics, and other Spin-on-Materials (Foil required)

Spinner 4: SCS GSP-8

Epoxy:

• SU-8 (Any dilution/Thinner/OmniCoat ()

• SU-8 Thinner (gamma-Butyrolactone (GBL)

• OmniCoat (PGME/Cyclopentanone)

Plastics

• Polyimide
• Polystyrene
• Poly(vinyl alcohol)
• Poly(ethyleneimine)

LOR/PGMI (Cyclopentanone/PGME)

• LOR A:

  • 3A

  • 3B

  • 5A

  • 30B

• LOR B:

  • 3B
  • 30B

• PGMI SF 8

Adhesion promoters

• 80% PGMEA + 20% HMDS Solutions
  • MCC Primer 80/20
  • Microprime MP-P20

• Silgard A-174

• Ormoprime 08
• HD Microsystems VM652

• 3-mercaptopropyl trimethoxysilane

Spin on dopants/Spin on glass

• P509 SOD

• B155 SOD

Etch Protectants/Waxes

• Protek A2-22
• Epotek OE
• Protek PSB and PS
• Protek B2 and B2 Primer
• Protek B3 and B3 Primer

Other Spin on Materials

• Polypropylene carbonate
• Graphite oxide
• Alq3
• Pelc conductive silver paint
• PST toluene
• Spin on teflon
• Coronene in toluene

Cleaning Solvents

• As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate.

Specifically not permitted in Cleanroom

Silicones/PDMS

Reason: These are impossible to remove chemically once cured, and are not used for lithography processes. Email Joon Park for information on proper curing of HMDS outside the cleanroom.

• Sylgard 182
• Sylgard 184

100% HMDS

Reason: 100% HMDS is extremely hazardous for both skin contact and inhalation. Additionally, in air, it degrades into ammonia upon evaporation, which crosslinks common photoresist. It gives sub-optimal results compared to diluted (80% PGMEA + 20% HMDS) solutions, or SurPass. Contact Justin Wirth with any questions.

• HMDS/Hexamethyldisilazane

TBD:
AP
Ti prime
Nanoparticles
Liquid diamond monocrystalline (microdiamant)