| Page Properties | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| |||||||||||||||||
Equipment Status:Set as UP, PROBLEM, or DOWN. See Problem Reporting Guide for more info.
|
iLab Name: Westbond 7476E
iLab Kiosk: BRK Packaging and Assembly Core
FIC: David Janes
Owner: Tim Miller
Location: BRK 2092
| Table of Content Zone | ||||||||
|---|---|---|---|---|---|---|---|---|
| ||||||||
|
Overview
General Description
This precision tool welds gold wire from chip pad to package. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded
Specifications
Spec sheet from West Bond - http://www.westbond.com/7400aspc.htm
Technology Overview - Remove if multiple tools use the same technology/process
Sample Requirements and Preparation
No special sample cleaning is required prior to wire bonding. Sample metallization must be thick enough to withstand the rigors of bonding. Samples must be securely mounted in their respective packages, and the package must be securely mounted to the bonding fixture. Double-sided cellophane tape is not an acceptable mounting technique.
Standard Operating Procedure
Questions & Troubleshooting
Process Library
References