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Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff

 

iLab Name: Westbond 7476E
iLab Kiosk: BRK Packaging and Assembly Core
FIC: David Janes
Owner: Tim Miller
Location: BRK 2092

Overview

General Description

This precision tool welds gold wire from chip pad to package. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

Specifications 

         Spec sheet from West Bond - http://www.westbond.com/7400aspc.htm

Technology Overview - Remove if multiple tools use the same technology/process

 

 

Sample Requirements and Preparation

No special sample cleaning is required prior to wire bonding.  Sample metallization must be thick enough to withstand the rigors of bonding.  Samples must be securely mounted in their respective packages, and the package must be securely mounted to the bonding fixture.  Double-sided cellophane tape is not an acceptable mounting technique.  

 

Standard Operating Procedure


Questions & Troubleshooting


 

Process Library

References

 

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