Versions Compared

Old Version 17

changes.mady.by.user Wirth, Justin C

Saved on

compared with

New Version 18

changes.mady.by.user Wirth, Justin C

Saved on

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.


With the install of the new spinners, materials will be segregated by spinner. Please see the following page for what spinner you will need to use for a particular material once the spinners are reclasiffiedreclassified.

The categories and allowed chemical/spinner pairings are still being refined and your feedback would be appreciated. Please comment on this page (at the page bottom) with any questions, comments, or feedback.

Excel
nameSpinner Material Usage.xlsx


Expand
titleText Version


Table of Content Zone
locationtop
styledisc

Table of Contents
outlinetrue
indent25px
stylenone



Spinner 1

& 2 : Acetone Soluble Resists

: General Spun on Materials (Foil required)

Expand
titleSpinner 1 & 23

Spinner 1:

Laurell WS-650HSpinner 2: Laurell WS-650

SCS G3P-8

Warning

Complete aluminum foil covering of the spinner bowl is required!

Novolak Resists

  • AZ 1500 Series

  • AZ 5200 Series
  • AZ 9200 Series
  • Shipley 1800 Series
  • SPR 220 Series
  • ma-N 2400 Series

Acrylic Resists

  • 495 PMMA
  • 950 PMMA
  • PMMA + Compolymers
  • ZEP 520 A / CSAR 62 / AR-P 6200

Spin on Glass EBL Resists

  • HSQ
    • XR-1541
    • FOX-1X

Conductive Polymers

  • Aquasave 57xs

  • ESpacer 300

  • DisChem DisCharge

Adhesion Promoters

Expand
titleSpinner 3

Spinner 3: SCS GSP-8

Warning

Complete aluminum foil covering of the spinner bowl is required!

SU-8
  • SurPass 3000/4000
  • 80% PGMEA + 20% HMDS Solutions
    • MCC Primer 80/20
    • Microprime MP-P20

Solvents

  • Acetone
  • Methanol
  • IPA
  • DI H20
  • PGMEA (AZ EBR Solvent, Microposit Thinner P)

ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.

Approval for new/additional chemicals:

Additional materials must be pre-approved, and material must:

A) Be completely removed in acetone if dried.
B) Not polymerize in contact with acetone, PGMEA, or water.
C) Not have vapors which harden resist (NMP, Ammonia, toluene, cholorbenzene) or dope substrates.

Spinner 3: SU-8, PGME Resists, Plastics, and other Spin-on-Materials (Foil required)

  • Silgard A-174

  • HD Microsystems VM652

  • 3-mercaptopropyl trimethoxysilane

NIL Resists & Promoters

  • NXR-3000
  • Ormolayer stamp
  • Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)

SU-8 Epoxy

  • SU-8 (Any dilution)

  • SU-8 Thinner (gamma-Butyrolactone (GBL)

  • OmniCoat (PGME/Cyclopentanone)

Plastics

  • Polyimide
  • Polystyrene
  • Poly(vinyl alcohol)
  • Poly(ethyleneimine)

LOR/PGMI (Cyclopentanone/PGME)

  • LOR A:

    • 3A

    • 3B

    • 5A

    • 30B

  • LOR B:

    • 3B
    • 30B

  • PGMI SF 8

Adhesion promoters

  • 80% PGMEA + 20% HMDS Solutions
    • MCC Primer 80/20
    • Microprime MP-P20

  • Silgard A-174

  • Ormoprime 08
  • HD Microsystems VM652

  • 3-mercaptopropyl trimethoxysilane

Spin on dopants/Spin on glass

  • P509 SOD

  • B155 SOD

Etch Protectants/Waxes

  • Protek A2-22
  • Epotek OE
  • Protek PSB and PS
  • Protek B2 and B2 Primer
  • Protek B3 and B3 Primer

Other Spin on Materials

  • Polypropylene carbonate
  • Graphite oxide
  • Alq3
  • Pelc conductive silver paint
  • PST toluene
  • Spin on teflon
  • Coronene in toluene

Cleaning Solvents

  • As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate.

Solvents

Spinner 4: EBL/NIL
  • Acetone
  • Methanol
  • IPA
  • DI H20
  • PGMEA (AZ EBR Solvent, Microposit Thinner P)

ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.


Spinner 2: Metal Ion Free, General Spun on Materials (Foil required)

Expand
titleSpinner 4: EBL/NIL (Foil Required)2

Spinner

4

2: SCS

G3P-8

6800

Warning

Complete aluminum Complete aluminum foil covering of the spinner bowl is required!


  • HSQ
    • XR-1541
    • FOX-1X
  • ZEP-520
    • PMMA
    Warning
    titleMetal and metal ion containing solutions are prohibited!

    EBL Resists

    Prohibited materials, compared with Spinner 1
    Spin on dopants

    • P509 SOD

    • B155 SOD

    Other Spin on Materials

    • Polypropylene carbonate
    • Graphite oxide
    • Alq3
    • Pelc conductive silver paint
    • PST toluene
    • Spin on teflon
    • Coronene in toluene


    Novolak Resists

    • AZ 1500 Series

    • AZ 5200 Series
    • AZ 9200 Series
    • Shipley 1800 Series
    • SPR 220 Series
    • ma-N 2400 Series

    Acrylic Resists

    EBL
    • 495 PMMA
    • 950 PMMA
    • PMMA + Compolymers
  • ma-N 2400
    • ZEP 520 A / CSAR 62 / AR-P 6200

    Spin on Glass EBL Resists

    • HSQ
      • XR-1541
      • FOX-1X

    Conductive Polymers

    • Aquasave 57xs

    • ESpacer 300

    • DisChem DisCharge
    EBL

    Adhesion Promoters

    • SurPass 3000/4000
    • 80% PGMEA + 20% HMDS Solutions
      • MCC Primer 80/20
      • Microprime MP-P20
      MAMA(8.5)MAA EL 11

    • Silgard A-174

    • HD Microsystems VM652

    • 3-mercaptopropyl trimethoxysilane

    NIL Resists & Promoters

    • NXR-3000
    • Ormolayer stamp
    • Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)
    Resist Removal
    • )

    SU-8 Epoxy

    • SU-8 (Any dilution)

    • SU-8 Thinner (gamma-Butyrolactone (GBL)

    • OmniCoat (PGME/Cyclopentanone)

    Plastics

    • Polyimide
    • Polystyrene
    • Poly(vinyl alcohol)
    • Poly(ethyleneimine)

    LOR/PGMI (Cyclopentanone/PGME)

    • LOR A:

      • 3A

      • 3B

      • 5A

      • 30B

    • LOR B:

      • 3B
      • 30B

    • PGMI SF 8

    Etch Protectants/Waxes

    • Protek A2-22
    • Epotek OE
    • Protek PSB and PS
    • Protek B2 and B2 Primer
    • Protek B3 and B3 Primer

    Cleaning Solvents

    • As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate.

    Solvents

    • Acetone
    • Methanol
    • IPA
    • DI H20
    • PGMEA (AZ EBR Solvent, Microposit Thinner P)

    ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.


    Spinner 3 : Acetone Soluble Resists

    Expand
    titleSpinner 3

    Spinner 3: Laurell WS-650


    Warning
    titleOnly Acetone Soluble Resists!

    Only resists that may be completely removed by acetone may be used in Spinner 3. Contact Joon Park with questions about using any chemicals not specifically listed below.


    Novolak Resists

    • AZ 1500 Series

    • AZ 5200 Series
    • AZ 9200 Series
    • Shipley 1800 Series
    • SPR 220 Series
    • ma-N 2400 Series

    Acrylic Resists

    • 495 PMMA
    • 950 PMMA
    • PMMA + Compolymers

    Adhesion Promoters

    • SurPass 3000/4000
    • MCC Primer 80/20
    • Microprime MP-P20

    Solvents

    • Acetone
    • Methanol
    • IPA
    • DI H20
    • PGMEA (AZ EBR Solvent, Microposit Thinner P)

    ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.

    Approval for new/additional chemicals:

    Additional materials must be pre-approved, and material must:

    A) Be for use in an EBL or NIL systemcompletely removed in acetone if dried.
    B) Be spun in low volumesNot polymerize in contact with acetone, PGMEA, or water.
    C) Be removable with an approved solvent or alkaline) Not have vapors which harden resist (NMP, Ammonia, toluene, cholorbenzene) or dope substrates.


    Specifically not permitted in Cleanroom

    Silicones/PDMS

    Reason: These are impossible to remove chemically once cured, and are not used for lithography processes. Email Joon Park for information on proper curing of HMDS outside the cleanroom.

    • Sylgard 182
    • Sylgard 184

    100% HMDS

    Reason: 100% HMDS is extremely hazardous for both skin contact and inhalation. Additionally, in air, it degrades into ammonia upon evaporation, which crosslinks common photoresist. It gives sub-optimal results compared to diluted (80% PGMEA + 20% HMDS) solutions, or SurPass. Contact Justin Wirth with any questions.

    • HMDS/Hexamethyldisilazane