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With the install of the new spinners, materials will be segregated by spinner. Please see the following page for what spinner you will need to use for a particular material once the spinners are reclassified.

The categories and allowed chemical/spinner pairings are still being refined and your feedback would be appreciated. Please comment on this page (at the page bottom) with any questions, comments, or feedback.

Excel
nameSpinner Material Usage.xlsx


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titleText Version


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Spinner 1: General Spun on Materials (Foil required)

Expand
titleSpinner 1

Spinner 1: SCS G3P-8

Warning

Complete aluminum foil covering of the spinner bowl is required!


Novolak Resists

  • AZ 1500 Series

  • AZ 5200 Series
  • AZ 9200 Series
  • Shipley 1800 Series
  • SPR 220 Series
  • ma-N 2400 Series

Acrylic EBL Resists

  • 495 PMMA
  • 950 PMMA
  • PMMA + Copolymers
  • ZEP 520 A / CSAR 62 / AR-P 6200

Spin on Glass EBL Resists

  • Thin HSQ: XR-1541
  • Thick HSQ: FOX-15,16

NIL Resists

  • NXR-3000
  • Ormolayer stamp

LOR/PGMI (Cyclopentanone/PGME)

  • LOR A:

    • 3A

    • 5A

  • LOR B:

    • 3B
    • 30B

  • PGMI SF 8

SU-8 Epoxy

  • SU-8 (Any dilution)

  • SU-8 Thinner (gamma-Butyrolactone (GBL)

Adhesion Promoters

  • SurPass 3000/4000
  • 80% PGMEA + 20% HMDS Solutions
    • MCC Primer 80/20
    • Microprime MP-P20

  • Silgard A-174

  • HD Microsystems VM652

  • 3-mercaptopropyl trimethoxysilane

  • Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)
  • OmniCoat (PGME/Cyclopentanone)

Solvents

  • Acetone
  • Methanol
  • IPA
  • DI H20
  • PGMEA (AZ EBR Solvent, Microposit Thinner P)

  • Other: As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate, EXCEPT HMDS, Toluene, or NMP.

Conductive Polymers

  • Aquasave 57xs

  • ESpacer 300

  • DisChem DisCharge

Plastics

  • Polyimide
  • Polystyrene
  • Poly(vinyl alcohol)
  • Poly(ethyleneimine)

Etch Protectants/Waxes

  • Protek A2-22
  • Epotek OE
  • Protek PSB and PS
  • Protek B2 and B2 Primer
  • Protek B3 and B3 Primer

Spin on dopants

  • P509 SOD

  • B155 SOD

Other Spin on Materials

  • Polypropylene carbonate
  • Graphite oxide
  • Alq3
  • Pelc conductive silver paint
  • PST toluene
  • Spin on teflon
  • Coronene in toluene


Spinner 2: Metal Ion Free, General Spun on Materials (Foil required)

Expand
titleSpinner 2

Spinner 2: SCS 6800

Warning

Complete aluminum foil covering of the spinner bowl is required!


Warning
titleProhibited Solvents

ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.


Warning
titleMetal and metal ion containing solutions are prohibited!

Prohibited materials, compared with Spinner 1
Spin on dopants

  • P509 SOD

  • B155 SOD

Other Spin on Materials

  • Polypropylene carbonate
  • Graphite oxide
  • Alq3
  • Pelc conductive silver paint
  • PST toluene
  • Spin on teflon
  • Coronene in toluene


Novolak Resists

  • AZ 1500 Series

  • AZ 5200 Series
  • AZ 9200 Series
  • Shipley 1800 Series
  • SPR 220 Series
  • ma-N 2400 Series

Acrylic EBL Resists

  • 495 PMMA
  • 950 PMMA
  • PMMA + Copolymers
  • ZEP 520 A / CSAR 62 / AR-P 6200

Spin on Glass EBL Resists

  • Thin HSQ: XR-1541
  • Thick HSQ: FOX-15,16

NIL Resists

  • NXR-3000
  • Ormolayer stamp

LOR/PGMI (Cyclopentanone/PGME)

  • LOR A:

    • 3A

    • 5A

  • LOR B:

    • 3B
    • 30B

  • PGMI SF 8

SU-8 Epoxy

  • SU-8 (Any dilution)

  • SU-8 Thinner (gamma-Butyrolactone (GBL)

Adhesion Promoters

  • SurPass 3000/4000
  • 80% PGMEA + 20% HMDS Solutions
    • MCC Primer 80/20
    • Microprime MP-P20

  • Silgard A-174

  • HD Microsystems VM652

  • 3-mercaptopropyl trimethoxysilane

  • Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)
  • OmniCoat (PGME/Cyclopentanone)

Solvents

  • Acetone
  • Methanol
  • IPA
  • DI H20
  • PGMEA (AZ EBR Solvent, Microposit Thinner P)

  • Other: As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate, EXCEPT HMDS, Toluene, or NMP.

Conductive Polymers

  • Aquasave 57xs

  • ESpacer 300

  • DisChem DisCharge

Plastics

  • Polyimide
  • Polystyrene
  • Poly(vinyl alcohol)
  • Poly(ethyleneimine)

Etch Protectants/Waxes

  • Protek A2-22
  • Epotek OE
  • Protek PSB and PS
  • Protek B2 and B2 Primer
  • Protek B3 and B3 Primer



Spinner 3 : Acetone Soluble Resists

Expand
titleSpinner 3

Spinner 3: Laurell WS-650


Warning
titleOnly Acetone Soluble Resists!

Only resists that may be completely removed by acetone may be used in Spinner 3. Contact Joon Park with questions about using any chemicals not specifically listed below.


Warning
titleProhibited Solvents

ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.


Novolak Resists

  • AZ 1500 Series

  • AZ 5200 Series
  • AZ 9200 Series
  • Shipley 1800 Series
  • SPR 220 Series
  • ma-N 2400 Series

Acrylic EBL Resists

  • 495 PMMA
  • 950 PMMA
  • PMMA + Copolymers
  • ZEP 520 A / CSAR 62 / AR-P 6200

Adhesion Promoters

  • 80% PGMEA + 20% HMDS Solutions
    • MCC Primer 80/20
    • Microprime MP-P20

Solvents

  • Acetone
  • Methanol
  • IPA

  • PGMEA (AZ EBR Solvent, Microposit Thinner P)

Approval for new/additional chemicals:

Additional materials must be pre-approved, and material must:

A) Be completely removed in acetone if dried.
B) Not polymerize in contact with acetone, PGMEA, or water.
C) Not have vapors which harden resist (NMP, Ammonia, toluene, cholorbenzene) or dope substrates.


Specifically not permitted in Cleanroom

Silicones/PDMS

Reason: These are impossible to remove chemically once cured, and are not used for lithography processes. Email Joon Park for information on proper curing of HMDS outside the cleanroom.

  • Sylgard 182
  • Sylgard 184

100% HMDS

Reason: 100% HMDS is extremely hazardous for both skin contact and inhalation. Additionally, in air, it degrades into ammonia upon evaporation, which crosslinks common photoresist. It gives sub-optimal results compared to diluted (80% PGMEA + 20% HMDS) solutions, or SurPass. Contact Justin Wirth with any questions.

  • HMDS/Hexamethyldisilazane