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iLab Name: Finetech FW1 Manual Die Bonder
iLab Kiosk: BRK Packaging and Assembly core
FIC: N/A
Owner: Mihailo Bradash
Location: Cleanroom D bay
Maximum Wafer Size: 200mm
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Overview
General Description
Multi-Purpose Manual Die Bonder for applying temperature, pressure, and ultrasonic during bonding processes.
Specifications
Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 500N.
Technology Overview
Sample Requirements and Preparation
Standard Operating Procedure
Questions & Troubleshooting
Process Library