iLab Name: Finetech FW1 Manual Die Bonder
iLab Kiosk: BRK Packaging and Assembly core
FIC: N/A
Owner: Mihailo Bradash
Location: Cleanroom D bay
Maximum Wafer Size: 200mm

Overview

General Description

Multi-Purpose Manual Die Bonder for applying temperature, pressure, and ultrasonic during bonding processes.

Specifications

Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 500N.

Technology Overview 

Sample Requirements and Preparation

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References