Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

Status	UP
Issue Date and Description
Estimated Fix Date and Comment
Responding Staff

iLab Name: Finetech FW1 Manual Die Bonder
iLab Kiosk: BRK Packaging and Assembly core
FIC: N/A
Owner: Mihailo Bradash
Location: Cleanroom D bay
Maximum Wafer Size: 200mm

Overview

General Description

Multi-Purpose Manual Die Bonder for applying temperature, pressure, and ultrasonic during bonding processes.

Specifications

Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 500N.

Birck Nanotechnology Center Wiki

Finetech FW1 Multi-Purpose Manual Die Bonder

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Overview

General Description

Specifications

Technology Overview

Sample Requirements and Preparation

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References

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