Finetech FW1 Multi-Purpose Manual Die Bonder

Owned by Bradash, Mihailo Rayko
Last updated: Jun 23, 2023

2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff

iLab Name: Finetech FW1 Manual Die Bonder
iLab Kiosk: BRK Packaging and Assembly core
FIC: N/A
Owner: Mihailo Bradash
Location: Cleanroom D bay
Maximum Wafer Size: 200mm

Overview

General Description

Multi-Purpose Manual Die Bonder for applying temperature, pressure, and ultrasonic during bonding processes.

Specifications

Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 500N.

Technology Overview 

 


Sample Requirements and Preparation


Standard Operating Procedure


Questions & Troubleshooting



Process Library

References