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iLab Name: Disco Dad641
iLab Kiosk: BRK Packaging and Assembly Core
FIC: Shared
Owner: Tim Miller
Location: BRK 22611254
Maximum Wafer Size: 6"/150 mm
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Overview
THE DISCO DAD641 HAS BEEN SUPERSCIEDED BY ACCRETECH SS20.
General Description
The Disco dicing saw is a precision sawing machine used in cutting semiconductor and MEMS wafers for separation of individual chips or devices. Pieces to be cut are mounted on wafer tape, which allows any size and shape of sample to be cut, up
to 6to 8 inches in diameter, and up to 1 millimeter thick. A supply of blades is on hand for most common substrates. Unusual substrates or non-standard cutting dimensions (i. e. extremely narrow kerf) may necessitate ordering special blades. There may be an extra cost to order special blades.
Specifications
Technology Overview - Remove if multiple tools use the same technology/process
Due to the nature of the automation in this tool, it is challenging to align smaller samples. The Disco DAD2H/6 is better suited to handling small (less than 2" in diameter) samples.
Specifications
Technology Overview
Sample Requirements and Preparation
No special sample preparation is required. Users have the option of applying a sacrificial layer of photoresist to the top surface of the sample prevent surface damage.
Samples over 1 mm thick require special handling and specific blades. Please consult Tim or Nithin before attempting to cut anything over 1 mm in thickness.
Standard Operating Procedure
DiscoDAD 2H/6 Operator's Guide
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Questions & Troubleshooting
Under no conditions should a user try to replace a broken blade! Please contact Tim or Nithin to have it replaced.
Process Library