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With the install of the new spinnersSpinner 3, materials will be segregated by spinner. Please see the following page for what spinner you will need to use for a particular material once the spinners are reclasiffiedreclassified.

The categories and allowed chemical/spinner pairings are still being refined and your feedback would be appreciated. Please comment on this page (at the page bottom) with any questions, comments, or feedback.

Excel
nameSpinner Material Usage.xlsx


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titleText Version


Table of Content Zone
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Spinner 1

& 2 : Acetone Soluble Resists

: General Spun on Materials (Foil required)

Expand
titleSpinner 1
: Laurell WS-650H

Spinner

2

1:

Laurell WS-650

SCS G3P-8

Warning

Complete aluminum foil covering of the spinner bowl is required!


Novolak Resists

  • AZ 1500 Series

  • AZ 5200 Series
  • AZ 9200 Series
  • Shipley 1800 Series
  • SPR 220 Series
  • ma-N 2400 Series

Acrylic EBL Resists

495 PMMA + Compolymers
  • PMMA
  • 950 PMMA
      • 495k
      • 950k
    • PMMA + Copolymers
    • ZEP 520 A / CSAR 62 / AR-P 6200

    Spin on Glass EBL Resists

    • HSQ:
      • XR-1541
      • FOX-15,16

    NIL Resists

    • NXR-3000
    • Ormolayer stamp

    LOR/PGMI (Cyclopentanone/PGME)

    • LOR A:

      • 3A

      • 5A

    • LOR B:

      • 3B
      • 30B

    • PGMI SF 8

    SU-8 Epoxy

    • SU-8 (Any dilution)

    • SU-8 Thinner (gamma-Butyrolactone (GBL)

    Adhesion Promoters

    • SurPass 3000/4000
    • 80% PGMEA + 20% HMDS Solutions
      • MCC Primer 80/20
      • Microprime MP-P20

    • Silgard A-174

    • HD Microsystems VM652

    • 3-mercaptopropyl trimethoxysilane

    • Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)
    • OmniCoat (PGME/Cyclopentanone)

    Solvents

    • Acetone
    • Methanol
    • IPA
    • DI H20
    • PGMEA (AZ EBR Solvent, Microposit Thinner P)
    ABSOLUTELY NO 100%

    • Other: As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate, EXCEPT HMDS, Toluene, or NMP

    due to contamination concerns. Discuss with BNC staff you need assistance removing resists.

    Approval for new/additional chemicals:

    Additional materials must be pre-approved, and material must:

    A) Be completely removed in acetone if dried.
    B) Not polymerize in contact with acetone, PGMEA, or water.
    C) Not have vapors which harden resist (NMP, Ammonia, toluene, cholorbenzene) or dope substrates.

    Spinner 3: SU-8, PGME Resists, Plastics, and other Spin-on-Materials (Foil required)

    Spinner 3: SCS GSP-8

    • .

    Conductive Polymers

    • Aquasave 57xs

    • ESpacer 300

    • DisChem DisCharge

    Plastics

    • Polyimide
    • Polystyrene
    • Poly(vinyl alcohol)
    • Poly(ethyleneimine)

    Etch Protectants/Waxes

    • Protek A2-22
    • Epotek OE
    • Protek PSB and PS
    • Protek B2 and B2 Primer
    • Protek B3 and B3 Primer

    Spin on dopants

    • P509 SOD

    • B155 SOD

    Other Spin on Materials

    • Polypropylene carbonate
    • Graphite oxide
    • Alq3
    • Pelc conductive silver paint
    • PST toluene
    • Spin on teflon
    • Coronene in toluene


    Spinner 2: Metal Ion Free, General Spun on Materials (Foil required)

  • Polyimide
  • Polystyrene
  • Poly(vinyl alcohol)
    • Poly(ethyleneimine)
    Expand
    titleSpinner 2

    Spinner 2: SCS 6800

    Warning

    Complete aluminum foil covering of the spinner bowl is required!


    Warning
    titleProhibited Solvents

    ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.


    Warning
    titleMetal and metal ion containing solutions are prohibited!

    SU-8 Epoxy

    • SU-8 (Any dilution)

    • SU-8 Thinner (gamma-Butyrolactone (GBL)

    • OmniCoat (PGME/Cyclopentanone)

    Plastics

    Prohibited materials, compared with Spinner 1
    Spin on dopants

    • P509 SOD

    • B155 SOD

    Other Spin on Materials

    • Polypropylene carbonate
    • Graphite oxide
    • Alq3
    • Pelc conductive silver paint
    • PST toluene
    • Spin on teflon
    • Coronene in toluene


    Novolak Resists

    • AZ 1500 Series

    • AZ 5200 Series
    • AZ 9200 Series
    • Shipley 1800 Series
    • SPR 220 Series
    • ma-N 2400 Series

    Acrylic EBL Resists

    • PMMA
      • 495k
      • 950k
    • PMMA + Copolymers
    • ZEP 520 A / CSAR 62 / AR-P 6200

    Spin on Glass EBL Resists

    • HSQ:
      • XR-1541
      • FOX-15,16

    NIL Resists

    • NXR-3000
    • Ormolayer stamp

    LOR/PGMI (Cyclopentanone/PGME)

    • LOR A:

      • 3A

    3B

      • 5A

    30B

    • LOR B:

      • 3B
      • 30B

    • PGMI SF 8

    SU-8 Epoxy

    • SU-8 (Any dilution)

    • SU-8 Thinner (gamma-Butyrolactone (GBL)

    Adhesion

    promoters

    Promoters

    • SurPass 3000/4000
    • 80% PGMEA + 20% HMDS Solutions
      • MCC Primer 80/20
      • Microprime MP-P20

    • Silgard A-174

    Ormoprime 08

    • HD Microsystems VM652

    • 3-mercaptopropyl trimethoxysilane

    Spin on dopants/Spin on glass

  • P509 SOD

    • B155 SOD

    • Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)
    • OmniCoat (PGME/Cyclopentanone)

    Solvents

    • Acetone
    • Methanol
    • IPA
    • DI H20
    • PGMEA (AZ EBR Solvent, Microposit Thinner P)

    • Other: As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate, EXCEPT HMDS, Toluene, or NMP.

    Conductive Polymers

    • Aquasave 57xs

    • ESpacer 300

    • DisChem DisCharge

    Plastics

    • Polyimide
    • Polystyrene
    • Poly(vinyl alcohol)
    • Poly(ethyleneimine)

    Etch Protectants/Waxes

    • Protek A2-22
    • Epotek OE
    • Protek PSB and PS
    • Protek B2 and B2 Primer
    • Protek B3 and B3 Primer

    Other Spin on Materials

    • Polypropylene carbonate
    • Graphite oxide
    • Alq3
    • Pelc conductive silver paint
    • PST toluene
    • Spin on teflon
    • Coronene in toluene

    Cleaning Solvents

    • As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate.

    Spinner 4: EBL/NIL (Foil required)

    Spinner 4: SCS G3P-8

    Warning

    Complete aluminum foil covering of the spinner bowl is required!

    EBL Resists

    • HSQ
      • XR-1541
      • FOX-1X
    • ZEP-520
    • PMMA
      • 495 PMMA
      • 950 PMMA
      • PMMA + Compolymers
    • ma-N 2400

    EBL Conductive Polymers

    • Aquasave 57xs

    • ESpacer 300



    EBL

    Spinner 3 : Acetone Soluble Resists

    Expand
    titleSpinner 3

    Spinner 3: Laurell WS-650


    Warning
    titleOnly Acetone Soluble Resists!

    Only resists that may be completely removed by acetone may be used in Spinner 3. Contact Joon Park with questions about using any chemicals not specifically listed below.


    Warning
    titleProhibited Solvents

    ABSOLUTELY NO 100% HMDS, Toluene, or NMP due to contamination concerns. Discuss with BNC staff you need assistance removing resists.


    Novolak Resists

    • AZ 1500 Series

    • AZ 5200 Series
    • AZ 9200 Series
    • Shipley 1800 Series
    • SPR 220 Series
    • ma-N 2400 Series

    Acrylic EBL Resists

    • PMMA
      • 495k
      • 950k
    • PMMA + Copolymers
    • ZEP 520 A / CSAR 62 / AR-P 6200

    Adhesion Promoters

    • 80% PGMEA + 20% HMDS Solutions
      • MCC Primer 80/20
      • Microprime MP-P20
  • MAMA(8.5)MAA EL 11

    • NIL Resists & Promoters

    • NXR-3000
    • Ormolayer stamp
    • Ormoprime 08 (Be extremely careful, may be impossible to remove with normal solvents)

    Resist Removal Solvents

    As needed for removal of approved resists. Any Litho hood approved solvents may be used as appropriate.

    Solvents

    • Acetone
    • Methanol
    • IPA

    • PGMEA (AZ EBR Solvent, Microposit Thinner P)

    Approval for new/additional chemicals:

    Additional materials must be pre-approved, and material must:

    A) Be

    for use in an EBL or NIL system

    completely removed in acetone if dried.
    B)

    Be spun in low volumes

    Not polymerize in contact with acetone, PGMEA, or water.
    C

    ) Be removable with an approved solvent or alkaline

    ) Not have vapors which harden resist (NMP, Ammonia, toluene, cholorbenzene) or dope substrates.


    Specifically not permitted in Cleanroom

    Silicones/PDMS

    Reason: These are impossible to remove chemically once cured, and are not used for lithography processes. Email Joon Park for information on proper curing of HMDS outside the cleanroom.

    • Sylgard 182
    • Sylgard 184

    100% HMDS

    Reason: 100% HMDS is extremely hazardous for both skin contact and inhalation. Additionally, in air, it degrades into ammonia upon evaporation, which crosslinks common photoresist. It gives sub-optimal results compared to diluted (80% PGMEA + 20% HMDS) solutions, or SurPass. Contact Justin Wirth with any questions.

    • HMDS/Hexamethyldisilazane
    TBD:
    AP
    Ti prime
    Nanoparticles
    Liquid diamond monocrystalline (microdiamant)