1. Helpfully, the machine will now ignore presses of the LOAD/UNLOAD button when it is not green.

   1. Pressing LOAD/UNLOAD at the wrong time (when there is not a cassette on the stage at the ORG position, or when no cassette is on the stage and cassette is in the load lock) will no longer trigger an error that requires Bill or I reset via Manager mode.

   2. HOWEVER, you can still cause vacuum problems if you press the EVAC/VENT button when a cassette is on the stage.

   3. ONLY press EVAC/VENT if the “Cassette on Stage” light is off!

2. Due to changes in the underlying software, any “old” MGN files that you would like to re-expose will need to be remade “fresh” for future exposures.

   1. This can be done as normal with the purple SCHD square (or by re-creating in Job Maker, if you do it the old way).

   2. Contact me if you have any questions.

3. There is now an “Origin” button to move the stage+cassette to the ORG/Origin position.

   1. This is instead of the old method of selecting ORG from the Fixed Position drop down, and clicking the MOVE button.

   2. Annoyingly, it is very close to, and looks very similar to, the MOVE button. Be sure to tell them apart:
      

      

   3. There is no longer an ORG position under the ‘Fixed Position’ drop down:
      

      

   4. I have added an “Origin (ORG)” entry to the ‘User Def. Position’ drop down in case it’s needed…but you should just use the new Origin button:
      

      

4. The new “Origin” button has a major bug.

   1. If the HEI button is clicked and height measurement fails, the Origin button will be stuck greyed out.
      

      

   2. To un-grey it:

      1. In the Fixed Position drop down, select BE.

      2. Click the MOVE button.

      3. Click the HEI button to successfully measure the height of the BE mark.

      4. Unclick the HEI button to stop height measurement.

      5. The Origin button will be un-greyed and is then usable again.

5. There is now a “Pause” button in the Exposure page, but it’s not useful to us as far as I can tell.
   

   

   1. The Pause button pauses exposure after an entire Layer is complete, which means it will not pause in the middle of a V30, in the middle of an array of the same V30, or in the middle of an array of different V30s. We usually put all the files in the same Layer (unless maybe if you’re exposing on different windows within the same MGN?).

   2. If you do use it, I also can’t tell the difference between the “Do not unload” and “Unload” options.

6. When loading/unloading the cassette with LOAD/UNLOAD, previously both IV2 and IV3 were closed. Now only IV3 closes.

   1. Per JEOL, this is intentional and will not cause problems on the system.

   2. The Manual Loader Viewer window will look different when you’re loading/unloading a cassette:
      

      

These changes have not yet been updated in the SOP, I will integrate them as soon as I'm able.

Questions on the materials? Send a Teams chat to Justin and Bill

1 Intro to EBL Presentation

2 Intro to the JEOL JBX-8100FS Presentation

3 Hardware Overview Video (8 mins)

4 Hardware Behind the Scenes Video (6 mins, Background Info) (⛔ Do not interact with anything you see in this video)

5 Hardware Detail Presentation

6 Jbxwriter (Software) Overview Video (54 mins)

7 Jbxwriter (Software) Detail Presentation

8 Watch and Skim Read SOP Section: 2 Data Preparation (45 mins). Do not worry about reading the text in the Beamer sections in detail at this point, it will later be useful as a step by step when you have the software open. Do watch the Tracer videos as background information.

9 Watch and Skim Read SOP Section: 3 Machine Operation

10 Read SOP Section: 5 Frequently Asked Questions

11 Review: Review all previous material as necessary until you feel comfortable with the flow of the operation of the system.

12 Preliminary User Test: Download and fill out the 8100 Preliminary User Quiz - User Copy.docx (this may be done while you complete the previous steps). Once finished, submit your quiz in the iLab JEOL JBX-8100FS E-Beam Writer Training Request for Step 2: Preliminary User Quiz.

Have a layout in GDS, OAS, DXF, CIF, etc (OAS is far superior to other other formats but it is underutilized). These can be created with a variety of programs:

• KLayout: A free and simple editor. Recommended as a good way to view files and create simple structures.

  • A great tutorial is available online here: https://maebl.slab.com/posts/k-layout-75duvt74.

• LayoutEditor: Can be downloaded for free, but exports are limited. Beamer comes with a full version of Layout Editor (the EDIT module). See online manual here: https://www.layouteditor.org/

• GdsPy: A python scripting language for GDS export. Documentation here: https://gdspy.readthedocs.io/en/stable/

  • Optional as more information: See intro video by NSAC's Sam Peana here: https://web.microsoftstream.com/video/23c9cd89-301a-41bc-aa67-cf77dab5e10b

The 8100calculator.xlsx file is meant to help you select your current, shot pitch, beam step size, ensure your required clock speed is under the maximum clock speed of the tool, and estimate the write time of your pattern.

8100 Calculator video notes - Since the video was recorded, the file has been updated to:

• Fix a bug in the calculation of the max. clock speed. The predicted max. clock speed from 8100calculator now matches that on the 8100 software.

• The number of points that the beam steps has been clarified to be the "shot pitch" (as in Beamer) and the size of the beam step in nanometers has been clarified to be the "beam step size". This is now consistent with the rest of the materials.

Video 2.2: 8100calculator.xlsx

1. Download and open 8100calculator.xlsx or use a previously downloaded copy.

   1. If it opens in Protected View, click Enable Editing.

   2. White boxes can/should be edited, grey boxes are locked (and can be unlocked with the password specified in the file), and the Shot Pitch and Req. Clock Speed boxes will be green if acceptable values are input, or red if unacceptable values are input.

2. Use the file to help pick a good Shot Pitch and ensure your exposure parameters will not exceed the maximum clock speed of 125 MHz.

   1. In the Beam Current box, use the drop down to select the write current

      1. The theoretical minimum beam diameter is displayed directly below the current.

   2. In the Minimum Dose box, input your planned minimum dose for your exposure.

      1. For PEC exposures, this will be the smallest dose multiplier times your base dose. For dose arrays, this will be your smallest dose (accounting for PEC adjustments, if necessary), and for non-PEC and non-dose array exposures, this will just be your base dose.

   3. In the Pattern Unit box, by default leave this at 0.5 nm (needs to equal the value used in the Beamer Export module used to create your V30 file).

      1. This can be changed if necessary, but typically should be left at 0.5 nm and the Beam Scan Step/Shot Pitch should be varied.

   4. In the Beam Scan Step box, input your Scan Step (in points or pixels) to match your selected value in the Beamer Export module used to create your V30 file.

   5. The resulting Shot Pitch (Pattern Unit (nm) x Beam Scan Step (pts) = Shot Pitch (nm)) is shown, and is highlighted in green if less than the minimum beam diameter, and red if greater than the minimum beam diameter.

      1. Ideally, the shot pitch should be ~3-4x smaller than your minimum feature size.

      2. For small features: The larger the shot pitch, the larger the edge roughness and feature size non-uniformity.

      3. A shot pitch larger than the beam diameter will usually give poor features, hence the red highlighting. It would be good to use a shot pitch at least 1/2 your beam diameter, but doesn't need to be smaller than 1/4 your beam diameter.

   6. The required clock speed will also be shown, and needs to be ≤125 MHz.

      1. This will be highlighted in green when ≤125 MHz, and red if > 125 MHz.

      2. This absolutely needs to be < 125 MHz or the machine will not be able to expose the pattern, and will throw an error.

3. You can also use the file to very roughly estimate your write time

   1. In Pattern area per chip, enter your pattern area from Beamer.

      1. Write time is proportional to pattern area.

   2. In Average Dose, enter your base dose, or a more appropriate dose estimate if available.

      1. Write time is proportional to dose.

   3. In Fields in each chip, enter the number of write fields in each chip (as shown by Beamer for your V30 file)

      1. Motion between fields takes ~0.25 s on the 8100.

   4. In Number of chips, enter the total number of chips in the exposure.

      1. For exposure of a single pattern/chip, this will be 1.

   5. In the lower section, you will see estimates for E-beam write time and stage motion time, and the total write time.

      1. Here, the estimated write time is based only on beam on time (the necessary time for the beam to be on to achieve the average dose on your pattern area). In reality, there are additional time components due to subfield settling, polygon placement settling, beam blanking, etc., which are not included in this estimate. PEC may increase the write time due to these effects.

      2. The stage motion time is just 0.25 s x Total Fields. This may be large for large chip area but small exposure area (sparse) patterns and small field sizes (e.g. 100 μm by 100 μm).

      3. Total write time is the addition of the E-beam write time and Stage motion time.

4. If desired, save the file for your own later use.

Tracer can optionally be used to create a point spread function of your exposure for use in Beamer with Proximity Effect Correction. This is not mandatory, but is a good idea when you're starting out to get a feel for scattering and start using PEC on your patterns. You will have a much easier time finding doses when your patterns change if you have been using PEC and know the base dose for your patterns/substrate/etc. If you're interested in learning about advanced PEC, refer to the Genisys Beamer PEC Webinars. 

Video 2.3a: Tracer - Scattering vs. Vacc

Video 2.3b: Tracer - PSF Creation

Video 3.2.1: Cassette Reminders

1. Put on a clean pair of latex gloves.

2. Determine appropriate cassette for loading in the cassette stack:

   1. Piece cassettes: There are two piece cassettes, these are identical.

      1. For pieces, you can load onto any of the three mounting areas. While you can put multiple pieces on the same mounting area (if sample thicknesses are the same), you won't be able to adjust their rotation independently. It's best to put each piece on its own window.

   2. Wafer cassettes:

      1. 3"

      2. 4"

      3. 6"

3. ⛔ Continue with care! The cassettes have many sensitive pieces, and are themselves sensitive. They are precision machined, costing up to $30,000 each. Be gentle and careful with them, and be sure not to roughly bump or drop them.

Video 3.3a: Loading - Load Lock View

Video 3.3b: Loading - Jbxwriter View

1. Open the Exchange Chamber Access door.

2. ⛔ Ensure the CASSETTE ON STAGE LED is OFF, if a cassette is already on the stage, proceed to the 3.9 Unload Cassette from Machine section

3. If no cassette is on the stage, check the vacuum gauge:

   1. If it reads close to -97.5 in red letters, the load lock is under vacuum. Hold the EVAC/VENT button to vent the LL. This should take ~2 minutes.

      1. ⛔ You should only ever press the EVAC/VENT button if the CASSETTE ON STAGE LED is OFF.

   2. If it reads 0.0 in green letters, the load lock is at atmosphere.

      1. This would occur if the previous user forgot to evacuate the LL before leaving. The system will take longer than normal to load the cassette, and you may need to wait some time for the system to reach thermal equilibrium.

4. After the load lock is vented/at atmosphere and the EVAC/BUTTON button has stopped flashing, turn the lock knob 90 degrees CCW to disengage the lock.

5. Open the load lock chamber door fully.

6. ⛔ There should not be a cassette in the pouch, but visually check the LL viewport to see if a cassette is already in the loading pouch.

   1. ⛔ If there is a cassette present

      1. ⛔ Remove the pouch from the LL, holding it with the handle end higher than the hook end. If it is held improperly, the will fall out!

      2. ⛔ When sliding the pouch out of the LL, be sure also to not scrape the Teflon holding block with the pouch.

      3. ⛔ Remove the cassette from the pouch.

   2. If as expected, no cassette is present, remove the pouch from the LL, ensuring not to scrape the Teflon holding block with the pouch.

7. ⛔ As good practice when handling the pouch, always hold it with the handle end higher than the hook end. If it is held improperly, a cassette (if present) will fall out!

8. Insert the cassette into the pouch, and insert the pouch into the load lock.

   1. ⛔ Ensure at all times that the pouch with cassette is kept level or with the handle end slightly higher than the hook end.

   2. ⛔ When sliding the pouch into the LL, be sure also to not scrape the Teflon holding block with the pouch.

9. Close the load lock chamber door.

10. Close the lock knob, rotating it 90 degrees CW to lock.

11. Before proceeding, ensure that the LOAD/UNLOAD button is lit green, and only 2 LEDs (Stage Initial, Exp Ready) are lit green.

    1. ⛔ If the Cassette on Stage LED is green, there is already a cassette on the stage, and you should proceed to the 3.9 Unload Cassette from Machine section.

12. Having ensured the LOAD/UNLOAD button is green, open the cover of the LOAD/UNLOAD button, press and hold until it beeps and begins flashing (about 3-5 seconds). The cassette will be loaded into the chamber (~2.5 min).

13. Close the cover of the LOAD/UNLOAD button.

    1. ⛔ You should only ever press the LOAD/UNLOAD button if it is green.

14. Close the Exchange Chamber Access door.

    1. Leaving this open will change the temperature of the column, adversely affecting your write and the writes of later users.

15. In jbxwriter, observe the image in the Manual Loader Viewer tab. When loading is complete:

    1. Both boxes on the column (the IV valves) will be white, indicating they are open.

    2. The stage position will be medium blue, indicating the presence of a wafer.

    3. The box between the column and stage (LL valve) will be white, indicating it is open.

    4. The LL position will be white, indicating there is no cassette in the LL.

Video 3.4a: Height Detection - Basic

Video 3.4b: Height Detection - Advanced

1. Tell jbxwriter which cassette you just loaded, and which wafer position you'll be using

   1. In jbxwriter, in the upper right corner, go to the 'Stage Control' tab.

   2. click the Cassette Type… button in Stage Control tab.

   3. Cassette Types for Stage Control Tab

2. Determine a location to measure height: If doing an aligned write, do this at the P Mark. For an unaligned write, do this at this chip center.

   1. If you measured the location of chip edges or your mark locations, you can calculate the center of the chip using 8100calculator.xlsx.

3. In the Stage Control tab, select the Substrate coordinate system

   1. The 8100 has two sets of coordinates: Stage coordinates, and Substrate coordinates (also referred to as material coordinates).

   2. Stage coordinates are useful in determining if the cassette is at the origin (ORG) position (~100/100). It's also used extensively by BNC staff and JEOL for calibrations. This coordinate system has the origin at the upper left of the stage, with X towards the LL, and Y towards the Beamer PC (down, on the stage diagram). This makes it somewhat confusing to use.

   3. Substrate coordinates have their origin at the center of each wafer holder. The holder is set with the Cassette Type... button in the stage control tab, as we did before. Having the wrong set cassette or window will give you the "wrong" origin. Substrate coordinates have their X towards the LL, and their Y towards the back of the machine (up, on the stage diagram), and they're most useful when working with samples and doing exposures. Generally, you'll use substrate coordinates at all times, unless ensuring that the stage is at the origin (ORG) position (~100/100 in Stage Coordinates), as there isn't a sensible way to talk about the origin position in substrate coordinates.

4. Set the Target Position radio button to Absolute.

   1. Relative can be useful when moving between marks, chips, etc., if you know their offset, but we'll mostly use Absolute mode (except when finding the P Mark Offset, which uses Relative).

5. Type in your height measurement location into the X and Y Target Position (um) boxes.

   1. Almost all coordinates and distances in jbxwriter are in µm. The exceptions are the SEM and Spot tabs in the Image Control area, which are both in nm.

   2. You cannot paste into the X and Y Target Position boxes. This is very annoying. However, you can copy from them to paste elsewhere in the software.

   3. As you enter a coordinate, you'll see the blue coordinate indicator snap to your input position. You can also right click in the Stage Position Window to set a target position with the track ball.

6. Click the MOVE button to move the stage to the input target position.

   1. The red coordinate indicator will snap towards your Target Position, and the X and Y Current Position boxes will be very close (within 5 µm) to your Target Position. The machine uses laser based correction (LBC) of the stage position to make up the difference. This modifies the beam position electrostatically rather than moving the stage mechanically.

   2. You can also use the Stage Arrows to the left of the MOVE button to move by the distance in the um/step window. Note that these move the STAGE in the given direction, which is counter intuitive. If we're at substrate position of 0/0 with a 1000 um/step setting, the following clicks will give the following moves:

      1. → moves to -1000/0

      2. ← moves to 1000/0

      3. ↑  moves to 0/-1000

      4. ↓  moves to 0/ 1000

   3. Positions and um/step can be set to large (10s of mm or 10000s of µm) or small (1 nm or 0.001 µm) values. The stage position is accurate/controlled to within 0.6 nm with the help of LBC, even though the mechanical accuracy of the stage is only /- 5 µm.

7. To start measuring the height, hit the HEI button. The height (in µm) will be displayed to the right of the button. Click the HEI button again to stop measuring the height.

   1. The height is displayed relative to the zero position (0 µm) of the stage. 

   2. The stage cannot be moved while the height is being measured. If you're interested is measuring the height across your sample, go to the section on performing a Height Map. 

   3. The height should absolutely be within +/- 100 µm, and ideally within +/- 50 µm. Closer to 0 µm will give better write quality, with anything being within +/- 10 µm being great.

   4. You can open the small push door (below the monitor, above the keyboard and EOS operation panel (which you should never touch), and left of the Emergency Off (which you should also never touch, unless there's an emergency)), and see a 4x1 VGA Switch. It should almost always be on INPUT 2. If you're having problems measuring the height, you can change it to INPUT 1, which will display the height measurement raw output on the left monitor. The white bar is the laser, the machine determines the center of this and assigns that as the height (indicated with the green arrow/cross). If the white bar doesn't span the window or looks blocked, it may give you an erroneous height reading, or indicate that you're by a piece clip or the edge of a wafer holder. Be sure to go back to INPUT 2 after you do this, and close up the small push door.

8. If the height of the chip isn't within +/- 100 µm, or the height can't be measured at one of your marks, remove the cassette (proceed to the 3.9 Unload Cassette from Machine section) and fix the issue.

9. Optional: If the height can't be measured, it's possible the location you measured in the alignment microscope is off. You could pull the cassette back out to check, but it may be good to first try to find a landmark with the SEM to avoid needing to do that,.

   1. You can use the SEM to try to find a chip edge, an alignment mark, a piece clip, wafer holder edge, etc., to get your bearings.

   2. Under the Image Control section of jbxwriter, click the SEM tab (not the SEM button, which turns on the SEM).

      1. Using the SEM will heavily expose resist that is imaged. For most substrates, you should not image anything within 100 µm of your pattern to be exposed since backscattered electrons from the SEM will contribute to exposing the resist. Directly exposing part of your sample to be patterned will drastically affect your developed pattern. This is also true for the automated mark detection algorithm, to a lesser degree.

   3. Under the SEM tab, you'll set appropriate values for Rapid, Grid, and Scan Width [nm]

      1. The Rapid check box will scale the Scan Width by a factor of 50% in both X and Y, scanning just the center 25%. This is useful to have checked when moving around with the SEM on, because it shows images at 4x the speed.

      2. The Grid check box will display a 10 by 10 green dotted grid over the image (division size = Scan Width / 10). The center divisions are colored red. This is useful when precisely aligning to a mark/feature, but should generally be left off when hunting for features because it may obscure them.

      3. The Scan Width [nm] is the X and Y width in nms that will be imaged by the SEM. This is set in 1000 nm intervals, and it's useful to click the blue slider and then use the scroll dial on the track ball to quickly increase or decrease this. Be aware that Rapid will decrease this by a factor of 50% in both the X and Y, showing only the center 25%. Also be aware that the Grid interval = (Scan Width)/10, so picking a nice round scan width can line up the Grid with your mark edges. For example, with Grid and Rapid checked, a centered 10 µm wide mark will hit the green grid lines at a Scan Width of 100000 nm, or 50000 nm if Rapid is off. 

   4. For the other settings in the SEM, use the following settings (and contact BNC Staff if you have questions about changing these, though you won't hurt anything by changing the settings in the SEM tab):

      1. Signal: BE Radio Button

      2. Integration: 1

      3. Scan clock [nsec]: 5000

      4. Main Def. Offset [nm] X & Y: 0

      5. Sub Def. Offset [nm] X & Y: 0

   5. Doublecheck that Rapid and Scan Width [nm] are appropriately set (these control the area of the SEM that will expose your sample), and hit the SEM Button to turn on the SEM.

      1. The SEM image will be displayed on the left monitor. The image can be saved with the Capture... button in the jbxwriter Image Control section.

      2. The SEM will be on until the SEM Button is pressed again. After turning it off, the last scan will persist on the left monitor, allowing you in inspect it carefully without the SEM actively scanning, if you desire.

   6. If you need to change the above SEM settings, click the Apply button.

      1. The SEM settings (aside from BE Brightness, Contrast, and Contrast Multiplier) will not be applied until the Apply button is pressed.

   7. Adjust the BE Brightness, Contrast, and Contrast Multiplier based on reasonable values for your sample.

      1. Good values for these depend heavily on the current, as well as on your substrate and any features on it.

      2. The set values for these in jbxwriter will generally change each time you to come to the tool because they will be what the last user used. 

      3. Once you find good values for a particular current, substrate, and substrate features, you can use those values in the future if you remember them/take a picture of them/write them down.

      4. Some good starting values are:
         Current - Brightness - Contrast - Contrast Multiplier
         2 nA 1225 1635 x56
         10 nA 1975 3590 x1
         30 nA 1865 2785 x1
         100 nA 1332 1805 x1

   8. Adjust the Scan Width, BE Brightness/Contrast/Multiplier, and move positions until you're able to find a landmark that help guide you to your feature of interest.

10. Once it is verified that chip height at the necessary positions can be measured, proceed to the next section.

Video 3.5.1: Unaligned Material Corrections

1. In jbxwriter, go to the Calibration page → Material Corr. tab.

2. In the Correction File section, next to File Name, click the Load button.

3. Select and open the 0_currentnA.mcorrprm file that corresponds with your current/condition file.

   1. You can click the Name bar above the listed files to list in A/Z or Z/A. List in A/Z, and these files will be at the top. 

4. In the checkboxes under file name, ensure only Beam Drift Correction is checked.

   1. This is important, because the Execute button at the lower right of the Calibration page will execute all checked subprograms.

5. In the Beam Drift sub-tab.

   1. Ensure the BE Mark radio button is selected.

   2. Press the Set BE Mark button

   3. In the lower right hand corner, press the Execute button.

      1. In the log, the Mark Scan X, Y reported by DRIFT is the location the mark was found, in stage coordinates. The Position Shift X, Y = Newly Measured Position - Previous Mark Position.

   4. Use the buttons in the lower right to perform an Update/Save:

      1. Press the lower right Update button.

      2. Press the lower right Save button.

      3. This is necessary to update the saved position of the BE mark, which is used by the batch file and the exposure file.

      4. The lower right Save button saves the displayed information to the subprogram file in the condition file. This will need to be pressed for each setting tab in the Material Corr. tab in order to use those settings during an exposure. After an exposure completes, whether successfully or not, a Restore is performed, which reloads all of the saved subprograms files back into jbxwriter. This will overwrite your previous values if you have not used the lower right Save button. For this reason, you should generally not use the upper middle Save button to save the mcorrprm file after an exposure has been attempted, as some important settings may have been changed, and the change may not be obvious. Do not save the 0_currentnA.mcorrprm files, these are updated by BNC staff. However, you may load them and then use the upper middle Save As... to save them under a new file name for your modification and later use. Please use the following convention: alias_YYYYMMDD_currentnA_windowID_markpattern.mpcorrprm, where windowID is 2A, 2B, or 3G for the piece holder windows, or 3A, 4W, or 6W for the wafer windows.

      5. The Update and Save buttons in the lower left hand corner no longer need to be pressed, but doing a lower left hand Update and then lower left hand Save will not hurt anything.

6. Proceed to Run DAILYCAL.

Overview

Mark detection can be complicated, and the software allows you to do many things that our users do not typically need to do. If you have questions about more advanced mark detection, contact jcwirth@purdue.edu. The following sections assume you have 4 global marks, all of which have the same width and length (though P may be longer with no changes to the procedure necessary) and either have 4 physical chip marks, or are using the global marks as chip marks, or are using virtual marks. 

See the Run Card Supplements for suggestions for robust example marks and mark parameters. There may be good reasons to use other values, these only serve as a robust starting point.

Video 3.5.2.1: Find P Mark

1. In the Stage Control tab, select the Substrate coordinate system

2. Set the Target Position radio button to Absolute.

3. Ensure the Cassette Type… button is set with your proper Type/Size/Window.

4. Type the following location into the into the X and Y Target Position (um) boxes:

   1. If using a piece window: measured P Mark location from the microscope.

   2. If using a wafer window: design P mark location (the offset with the wafer holders is small, on the order of <100 μm).

5. Click the MOVE button.

6. Under the Image Control section of jbxwriter, click the SEM tab (not the SEM button, which turns on the SEM).

   1. Under the SEM tab, set appropriate values for Rapid, Grid, and Scan Width [nm]. 

      1. You could start by leaving Rapid unchecked, Grid checked, and a Scan Width of 200,000 nm (you may later need to increase the scan width).

   2. For other values: Signal = BE Radio Button, Integration = 1, Scan clock [nsec]= 5000, Main Def. Offset [nm] X & Y = 0, Sub Def. Offset [nm] X & Y: 0

7. Press the SEM Button to turn on the SEM.

   1. ⛔ Remember, we're exposing any resist we see in the SEM, and backscattering can expose resist as far as ~100 um from the beam. So be aware of when you turn the SEM on, and be sure to turn it off before moving across your write area.

8. Adjust the BE Brightness, Contrast, and Contrast Multiplier based on reasonable values for your sample, refering to the 4.2 Example SEM Values if needed.

9. If you're confident you're using appropriate BE Brightness, Contrast, and Contrast Multiplier values, but cannot see the P mark, it's likely outside your scan area.

   1. Increase the Scan Width [nm] a reasonable amount (e.g. 100,000 nm), then click the Apply button.

      1. It's useful to click the blue slider and then use the scroll dial on the track ball to quickly increase or decrease the Scan Width.

      2. Remember that the Rapid check box will scale the Scan Width by a factor of 50% in both X and Y, scanning just the center 25%.

   2. Continue to increase the Scan Width [nm] (and turn off Rapid, if necessary) until you've found part of the P mark.

      1. If you're unable to find the P mark even at the maximum Scan Width and with Rapid off, it's likely your BE Brightness, Contrast, and Contrast Multiplier values are off.

      2. If you adjust these and still cannot find your mark, your position from the alignment microscope was very far off. Try to move to one of the chip corners (or off the chip, to one of the clips, etc.), find a landmark that is useful for reference, and navigate to your P mark from there.

      3. If you still can't find it this way, you will need to unload the cassette to visually check what happened.

10. Once you've located the P mark, find the center and center your cross in the SEM grid using the Stage Arrows to the left of the MOVE button to move by the distance in the um/step window.

11. After it is centered, turn off the SEM by pressing the SEM button.

12. Locate the User Def. Position drop down, and select UsrMayRegist: P Mark,

13. Under UsrMayRegist: P Mark, locate the Regist. button 

    1. ⛔ NEVER click the Regist. button under Fixed Position, only ever click the Regist. button under User Def. Position!

    2. Click the Regist. button under User Def. Position

    3. It will ask for confirmation, click OK.

14. Again, in the User Def. Position drop down, select UsrMayRegist: P Mark

    1. This is done because, although we have save the P Mark location into UsrMayRegist: P Mark, our target position is still the old value of UsrMayRegist: P Mark. Reselecting UsrMayRegist: P Mark will make our P Mark location both the target and current position.

Video 3.5.2.2: Load MCORRPRM File

1. In jbxwriter, go to the Calibration page → Material Corr. tab.

2. In the Correction File section, next to File Name, click the Load button.

   1. If you have previously saved a mcorrprm file, select and open it.

   2. If you do not have a previously saved mcorrprm file, or are using different enough mark parameters that you would like to create a new one:

      1. Load the 0_currentnA.mcorrprm file that corresponds with your current/condition file.

      2. ⛔ Do not save over/overwrite the 0_currentnA.mcorrprm file

      3. Click the Save As... button.

      4. Please save a new file using the following convention: alias_YYYYMMDD_currentnA_windowID_markpattern.mpcorrprm, where windowID is 2A, 2B, or 3G for the piece holder windows, or 3A, 4W, or 6W for the wafer windows. The markpattern portion could be an identifier of your mark composition, thickness/depth, type, size, location, substrate, etc. This just needs to make sense to each user so they can distinguish which mpcorrprm file is useful as a starting point for future writes.

3. ⛔!!!!! Very important note !!!!!: Loading a mcorrprm file only loads the values into the jbxwriter software. It is not until you click the lower right Save button on each sub tab of the Material Corr. window that each sub program's values will be saved into the machine settings, which are used by the exposure. After an exposure, the machine will execute a Restore (without a Demag) which will load the saved values back into jbxwriter, which will be different from the values you had unless you've saved each subprogram. For this reason, you should generally be careful about when you save your mcorrprm file, and should not save it after an exposure has been attempted. Additionally, when you open the RG Detection Condition or BE Detection Condition button in the sub tabs, you should press the OK button to close it. Pressing the Cancel button after initially loading the mcorrprm file and opening the RG Detection Condition window will change the values in the RG Detection Condition window back to what they were before your load. For more information review the "Notes on the Material Correction Tab" section of the Jbxwriter (Software) Detail Presentation from the Training Materials.

Video 3.5.2.3: Determine P Mark Offset

1. The Offset is the relative offset vector from our Design P Mark Position to our Actual P Mark Position. To find this, we'll move to our Design P Mark Position (in substrate coordinates). Then select our saved Actual P Mark Position (previously saved in UsrMayRegist: P Mark), display the relative offset between them, and save that to our Global Mark Detection sub-tab in the Offset X/Y boxes.

2. The Offset will later need to be added to your exposure data, either by manually changing the SDF's OFFSET (0, 0) line (and saving) before converting it into a magazine (MGN) file, or in Beamer → VisualJob → Layer_#→ Substrate Origin Offset X/Y. If you do not do either of these later, during the exposure the machine will look for your P Mark at substrate coordinate (0/0), and it's probably not going to be there.

3. Type in your P mark design position into the Target Position X and Y values (ensuring Absolute is checked and the proper Type/Size/Window are set in the Cassette Type button).

   1. You cannot paste into the Target Position boxes.

4. Click the Move button.

5. In the User Def. Position drop down, select UsrMayRegist: P Mark.

6. Under Target Position (um), select Relative.

7. In the Material Corr. tab, check the Global Mark Detection box.

8. Type the displayed Target Position X and Y values in the Offset X and Y values in the Global Mark Detection subtab

   1. You can also use the mouse to select a displayed Target Position value, right click, Copy, then go to the Offset box, right click, Paste.

9. In the Global Mark Detection sub-tab, press the lower right (LR) Save button.

10. Under Target Position (um), select Absolute.

Video 3.5.2.6: Chip Mark Detection

1. ⛔ This section may be omitted if you are using global marks, but opting to use virtual marks for height detection.

2. ⛔ Even if you do not have physical chip marks distinct from your global marks, you can actually use the global marks as chip marks. Simply go to the Chip Mark Detection subtab, make sure AGC is unchecked, choose Mode 4, ensure Height measurement for modes 1 and 4 is checked, put the center X and Y as 0 / 0, and assign your global marks as M1, M2, M3, and M4, such that M1 is -X / +Y, M2 is +X / +Y, M3 is +X / -Y, and M4 is -X / -Y.

3. In jbxwriter, go to the Calibration page → Material Corr. tab. → Chip Mark subtab.

4. Click the subprogram check boxes so that only the Chip Mark Detection check box is checked.

5. ⛔ If you're working from a saved mcorrprm file that is already properly setup for your sample, skip to the "Execute" step below.

6. Setup parameters in the Chip Mark subtab:

   1. Ensure AGC is unchecked

   2. Ensure the Mode radio button is set to 4. Assuming you're using 4 chip marks. You could instead use only 1.

   3. Ensure the Height measurement for Mode 1 and Mode 4 box is checked.

   4. Enter the design center of the chip you wish to scan in the Center X and Y boxes.

      1. Since we've already done global mark detection and set the Offset, the machine can automatically go to the design center of the chip.

   5. Enter the design positions of your marks (i.e. what your layout expects, not the actual position on the fabricated wafer) into the M1, M2, M3, and M4 boxes.

7. Click the RG Detection Condition... button:

   1. In the Scan Tab, set the Scan Position X/Y to 40%*Lc and the Scan Width X/Y to 3*Wc.

   2. In the Scan Type tab, set the Mark Width to Wc and Mark Length to Lc.

   3. In the Retry tab, set Maximum number of retries (times) to be 10 and set the Amount of shift at a retry (um) to be 0.5 for X and Y

   4. Click OK.

   5. Click the lower right Save button.

8. Click the Execute button.

9. Observe the left screen as detection proceeds to ensure the machine finds your marks, and nothing odd is going on.

   1. Chip marks only execute in 'Auto' mode, meaning if a mark can't be found, it is not used for alignment.

10. Once execution completes, press the Log button.

    1. In chip mark detection, the given offsets and mark rotation are relative to where they were predicted to be with your chip mark detection. Heights are absolute.

    2. Ensure the height is measured for each mark, and the offsets and mark rotations are reasonable.

    3. When satisfied, click the Close button.

11. Click the lower right Save button and then deselect the Global Mark Detection check box.

12. If needed, in the Correction File section, Click the Save button to save your MCORRPRM file.

Video 3.5.2.7: Aligned Beam Drift

1. ⛔ The Beam Drift settings need to be set every time you do an aligned write, because the MCORRPRM file does not save the RG Detect Conditions for the Beam Drift tab (or the AGC or User Defined Mark, but we're not using those here).

2. When executing drift correction during the exposure (which you should do via DIRE20 if your write will take 20 minutes or longer), the machine will update drift on the best mark it has. 

   1. For an unaligned write that's the BE mark, and will use the preset BE Detect Condition settings in the loaded 0_currentnA.mcorrprm file. 

   2. For an aligned write with global marks but no physical chip marks, it will use the P mark. 

   3. For an aligned with with both global marks and physical chip marks, it will use the M1 mark on the particular chip.

   4. So we need to think what we're doing, and apply the RG Detect Conditions settings of either the P Mark or the Chip Marks to the Beam Drift (called the DRIFT (fine) program).

3. In jbxwriter, go to the Calibration page → Material Corr. tab.

4. Decide which set of mark detection parameters to use, and execute only one of the following:

   1. If you are using Global Marks but do not have physical chip marks, use the P fine settings:

      1. Ensure the Global Mark Detection check box is checked.

      2. In the Global Mark subtab, click the P Fine Scan RG Detect Condition... button.

      3. Click the Applies to another subprogram button.

      4. ⛔ Importantly, the next step is different from previous sections!

      5. Under the Mark Type: Registration Mark (RG) section, select only DRIFT (fine).

      6. Click the Subprogram that can be set button.

      7. Then click the Close button

      8. Click the OK button.

   2. If you are using physical Chip Marks as well as Global Marks, use the Chip Mark settings:

      1. Ensure the Chip Mark Detection check box is checked.

      2. In the Chip Mark subtab, click the RG Detect Condition... button.

      3. Click the Applies to another subprogram button.

      4. ⛔ Importantly, the next step is different from previous sections!

      5. Under the Mark Type: Registration Mark (RG) section, select only DRIFT (fine).

      6. Click the Subprogram that can be set button.

      7. Then click the Close button

      8. Click the OK button.

   3. If you prefer, you can also choose settings directly in the Beam Drift subtab.

      1. In jbxwriter, go to the Calibration page → Material Corr. tab. → Beam Drift subtab.

      2. Click the subprogram check boxes so that only the Beam Drift Correction check box is checked.

      3. Click the lower right Save button.

5. You may proceed.

Video 3.6: Run DAILYCAL

1. In jbxwriter, go to the Calibration page > Batch tab.

   1. The DAILYCAL batch calibrations need to be done for each current every day. They should be run after ~20 to 40 minutes of settling time after changing the current.

   2. If you know that another user you trust has:

      1. used the same write current within the last 24 hours

      2. waited for the appropriate settling time before running DAILYCAL

      3. and had completely performed DAILYCAL without issues, you can omit running them. However, we recommend that all users run these each time they use the machine for optimum write quality, and it could be a costly mistake to omit them.

2. Ensure that Batch Name shows DAILYCAL.

   1. If the Batch Name is not DAILYCAL, click the Open button, select the DAILYCAL file, and click Open.

3. Ensure the list on the left is unchanged: If the list does not correspond with that below, click the Open button, select the DAILYCAL file, and click Open.

   1. Beam Current Measurement

   2. AE Mark Detection

   3. AE Mark Detection

   4. Static Focus Correction

   5. BE Mark Detection

   6. BE Mark Detection

   7. Main DEF Correction

   8. Sub DEF Correction

   9. Distor Correction

   10. Save

4. Click Execute in the lower right corner to run.

5. This will take ~ 8 minutes.

   1. You will see the execution of the batch calibrations on the left screen.

   2. During the calibration, you may click the Logbutton in the lower right, and go to the Log window Calibration tab. This will display the results of the calibrations as they run.

   3. The calibrations that execute are:

      1. Beam Current Measurement (CURRNT): The tool measures the beam current (averaged over 5 measurements) to determine the current for dose calculations. This is done to ensure the current can be measured successfully before exposure.

      2. AE Mark Detection (INITAE): The tool scans the beam over a gold knife edge, and measures the current during this sweep. This is used to determine the position of the AE Mark for focus correction. This is run twice in order to allow the user to check the difference between the two scans in the log file, if they so desire. A difference of more than ~5 nm between scans indicates the beam may not be properly stable. The log also displays the measured size of the beam, which depends on both the quality of the AE mark (the scan position needs to be periodically moved by BNC staff) and the quality of the beam. This measured size is always larger than the true beam size due to electron scattering. 

      3. Static Focus Correction (SFOCUS): The tool changes the focus lens (Lens 4) setting under and over focus to determine the optimal focus value. On the left monitor, lateral movement of the peak during this scan is indicative of slight objective aperture misalignment ("wobble"), which is corrected weekly by BNC staff to minimize this motion. The STIG is the difference between the optimal focus point for the X size and the Y size, and should be less than 20 points.

      4. BE Mark Detection (INITBE): The tool scans the beam over a 1 µm wide gold cross on a silicon substrate at z = 0 µm (the BE Mark), and another identical mark at z = -50 µm (the Under BE Mark). These are used to determine the position of the beam during further calibrations. This is run twice in order to allow the user to check the difference between the two scans in the log file, if they so desire. A difference of more than ~5 nm between scans indicates the beam may not be properly stable.

      5. Main DEF. Correction (PDEFBE): Main deflector correction. The position of the BE mark is measured as the stage moves to the edges of the maximum main field size (1000 µm). Then the edge points are retraced, and the positions measured again. The Gain and Rotation calibration values for the main field are adjusted. Then the same thing happens for the Under BE Mark. This allows the tool to calibration how the beam position changes with height, setting the height correction coefficient gain and rotation.

      6. Sub DEF. Correction (SUBDEFBE): Sub deflector correction. The position of the BE mark is measured as the stage moves to the corners and edges of the maximum main sub size (8 µm). Then the corner and edge points are retraced, and the positions measured again. The Shift, Gain and Rotation calibration values for the sub field are adjusted. Then the same thing happens for the Under BE Mark. This allows the tool to calibration how the beam position changes with height, setting the height correction coefficient shift, gain and rotation.

      7. Distor Correction (DISTBE): Distortion correction. The position of the BE mark is measured as the stage moves to a 7 x 7 grid throughout the write field. Then the grid points are retraced, and the positions measured again. Placement corrections are calculated and applied for each point. This correction take the most time (~4 minutes), especially if the DAILYCAL has not been done for a few days.

      8. Save: This saves the values to the restore file for this current. It is the equivalent of clicking the lower left Update button followed by the lower left Save button.

6. Once the buttons are ungreyed, execution is complete.

Video 3.8a: Unaligned Exposure

Video 3.8b: Aligned Exposure

1. In jbxwriter, go to the Exposure page.

2. Remove any magazine files left in the Queue by selecting them and then clicking the Remove button.

   1. When you press the Start Exposure button, Jbxwriter will expose all magazine files listed in the queue. This can be used if you actually want to expose multiple MGNs, but will mean previous users patterns will be exposed if they are not removed from the Queue.

3. Load your MGN file(s) into the Queue

   1. Click the Open button.

   2. Navigate to your .../jeoleb/job/user/alias/thisexposure folder

   3. Double click your MGN file to load it into the Queue (or single click it, and press the Open button in the bottom right of the window).

   4. Repeat as necessary for all MGN files for the exposure.

      1. Most exposures will only be of one MGN file.

4. Double check the Queue to ensure the proper MGN files are loaded.

5. Check the Job Progress area to ensure your pattern looks right, and will exposed in the right area of the window.

   1. Zoom in by left clicking, dragging the cursor down and right, and then releasing.

   2. Zoom out by left clicking and dragging any direction that's not down and right. Double click to return to the original zoom.

   3. The selected JDF will be highlighted green. Select other by double clicking them.

   4. The fields of the selected JDF/chip will be shown in chip progress, and the pattern associated with the chip will be shown in the 'Pattern' area.

6. In the bottom left, select the appropriate setting for 'Behavior at the time of the exposure error'

   1. This controls whether the tool will continue exposing if an exposure error is encountered (and exposing can continue) or if it will stop. This is most relevant to aligned writes on multiple chips with chip marks, as mark detection may fail on some chips but not others. It's also relevant to exposures of multiple chips if height detection fails on some chips but not others.

   2. 'Continue' is selected by default. This is a good setting if you're exposing a single chip, or have previously encountered errors that you know may occur. But be sure to check the log file after the exposure to see if any errors occurred.

   3. You should select 'Stop' if you're first starting to use multiple chips in a single MGN, or if you do not anticipate any errors.

7. Click the Start Exposure button. Watch to ensure exposure completes mark detection and PATH, and exposure of the pattern begins.

   1. The machine will begin by executing the selected PATH (DIRE20 usually). This will take ~2 minutes.

   2. If doing an aligned write: global mark detection will then occur. In semiauto mode, if you did not properly set your global alignment parameters, you may need to manually find some marks here.

   3. If doing DIRE20 or DIRE05, drift measurement will then occur. This will measure the current then the position of the best mark the machine has for drift:

      1. For unaligned writes: BE Mark

      2. Global marks, no chip marks: P Mark

      3. Global marks and chip marks: M1 Mark.

   4. If this fails, you forgot to save the proper beam drift parameters.

      1. For unaligned writes: See 3.5.1 Unaligned Exposure Material Corrections

      2. For aligned writes, see 3.5.2.7 Save the Beam Drift parameters

   5. After DRIFT completes, the machine will begin exposing your file. The scanning of the beam can be seen on the left monitor.

   6. jbxwriter will indicate progress in multiple ways:

      1. The Exposure Progress bar will show completion of chips

      2. The elapsed time and remaining time will show times estimated for your exposure by SCHD GUI. These are usually pretty accurate.

      3. PATH will show the PATH name (DIRE20) if it is executing. This will execute at set intervals (20 minutes for DIRE20) and before each new JDF file.

      4. Completed and current chips will be indicated by blue and yellow overlays, respectively, in the job progress and chip progress areas.

8. If there are problems:

   1. The status tower will flash yellow or red, depending on the severity.

   2. Inspect the issues as reported in the software. If the errors are minor, you should clear them with the Confirm button, and by opening the Alarm window, reviewing the message, and then closing it.

   3. Submit a support ticket with any questions about errors.

9. When exposing is finished:

   1. The stage will automatically move to the origin (ORG) position.

   2. The status tower will flash green instead of the usual solid green.

   3. A popup will show 'Exposing Complete'. Click the OK button to acknowledge this.

Video 3.9a: Unloading - Load Lock View

Video 3.9b: Unloading - Jbxwriter View

1. In the Stage Control tab → Fixed Position drop down, select the ORG position, then click the MOVE button.

   1. This step is unnecessary after an exposure has just completed, as the machine will automatically move the stage to ORG after a successful exposure.

   2. ⛔ NEVER press the Regist. button under the Fixed Position drop down! This would change the position of important system locations and cause problems for you and subsequent users. If you do inadvertently press the Regist. button under the Fixed Position drop down. a confirmation pop-up will appear, select Cancel. If instead you click OK, the previous system position will be overwritten. If you have inadvertently overwritten this position, please submit a support ticket immediately so the position can be remapped.

2. Open the Exchange Chamber Access door.

3. Ensure the:

   1. LOAD/UNLOAD Button is GREEN

   2. STAGE INITIAL LED is GREEN

   3. CASSETTE ON STAGE LED is GREEN

   4. EXP READY LED is GREEN

   5. ⛔ If either the LOAD/UNLOAD Button or the STAGE INITIAL LED is off, DO NOT PROCEED. The cassette is not at the origin (or the machine does not believe it is at the origin). It must be moved there first or an error requiring staff intervention will be thrown. If this error occurs, submit a support ticket immediately. 

4. Open the cover of the LOAD/UNLOAD Button, press and hold until it beeps and begins flashing (3-5 seconds). Wait for the unload, and for the load lock to vent.

   1. ⛔ You should only ever press the LOAD/UNLOAD button if it is green.

5. Once the LL is at atmosphere and the LOAD/UNLOAD button has stopped blinking, turn the LL knob 90 degrees CCW to disengage the lock.

6. Open the LL handle fully.

7. ⛔ Remove the pouch, holding it with the handle end higher than the hook end. If it is held improperly, the cassette will fall out!

   1. ⛔ Ensure at all times that the pouch with cassette is kept level or with the handle end slightly higher than the hook end.

8. Remove the cassette from the pouch and place it on a cleanroom wipe on the table.

9. Insert the pouch into the LL.

   1. ⛔ When sliding the pouch into the LL, be sure also to not scrape the Teflon holding block with the pouch.

10. Close the LL handle.

11. Close the LL knob, rotating it 90 degrees CW to engage the load lock.

12. Open the cover of the EVAC/VENT button, press and hold until it beeps and begins flashing.

    1. ⛔ You should only ever press the EVAC/VENT button if the CASSETTE ON STAGE LED is OFF.

13. Close the Exchange Chamber Access door.

    1. Leaving this open will change the temperature of the column, adversely affecting your write and the writes of later users.

Video 3.10: Finishing

1. Load current for next user, if they have indicated a current in iLab.

2. Dismount your sample(s) from the cassette.

3. Place cassette back in plastic box.

4. Ensure the height rings are properly arranged.

5. Close Beamer, log out of the Beamer PC.

6. End the session in the BRK Lithography Core iLab Kiosk.

First verify that jbxwriter isn't just running on another desktop, check the bottom right to switch between all three desktops.

If the software has indeed been closed, open jbxwriter with the icon on the desktop. When it opens, ensure the "on" icon in the bottom left is green. If so, the software is ready to use. If the "on" icon is blue, contact BNC staff.

In the current version of jbxwriter, the beam should usually be off and should not turn on unexpectedly. However, the software does not have a reliable beam on/off indication, and you can ensure the beam is off by measuring current at the Faraday Cup (FC). 

To verify the beam is off

1. In jbxwriter, under Stage Control > Fixed Position, select ‘FC’ and click MOVE

2. Under Monitor > General, ensure current is 0 pA ( /- 1 pA). 

3. If the current is non-zero, the beam is on. Turn it off:

   1. Under Image Control, press the Spot button (above the Spot tab)

   2. This will turn the beam “on”, even if it is already on. A white dot will appear on the left hand monitor.

   3. Click Spot again to turn the beam off. The white dot will disappear.

   4. Ensure the current is 0 pA ( /- 1 pA).

This error seems to have started with the installation of a new VAC CONT board back in 2018 (maybe). This board is one of the three computers that controls the system, and is responsible for load/unload operations.

With the old board, if there was no cassette on the stage and no cassette in the load lock, and the LOAD/UNLOAD button was pressed, the system apparently ignored it. With the new board, there seems to be a change in behavior: now, pressing the LOAD/UNLOAD button without a cassette on the stage or in the load lock will cause an error in the software: "ebloaderd - Failed to start LOAD_EVAC or LOAD_VENT. Abnormality occurred in the program for monitoring for autoloader unit status."

Clearing this error requires staff intervention, as the process, if done improperly, could vent the column, cause a loss in column vacuum pressure, or change critical software parameters. For this reason, if you accidentally encounter this error, please email Justin or Bill Rowe immediately, and we’ll get it resolved as soon as we can. Users are also encouraged to report the problem on the 8100 wiki page (preferably via the Equipment Status section of the page, though the comments section works as well) so other users know about it.

To avoid seeing this error:

• Only press the LOAD/UNLOAD button if it is lit GREEN!

  • The LOAD/UNLOAD button will be green if the stage is at the origin (ORG) position (~100/100 in stage coordinates), and if there is a cassette either on the stage or in the load lock to load/unload.

• Only press the EVAC/VENT button if the "cassette on stage" LED is off!
  

  • If a cassette is present on the stage, this may cause a vacuum error.

NOTE: This does not apply to finding the BE mark for DRIFT/Beam Drift correction. In that case, see answer 14.

If you attempt this, please submit a support ticket to let us know you had the issue and had to take these steps.

DO NOT change anything beyond what is described below in the AE/BE detect condition tab, as this could negatively and unpredictability affect your write and the writes of other users.

If the AE or BE mark detection fails:

1. Go to the Calibration page → Std. Mark Detection tab. Ensure both AE Mark Detection and BE Mark Detection boxes are checked.

2. Go to the AE Mark subtab, click the AE detect condition button. Change the Scan Width (NOT Scan Position) from 4 to 24 for both X and Y. 

3. Go to the BE Mark subtab, click the BE detect condition button. Change the Scan Width (NOT Scan Position) from 4 to 24 for both X and Y. 

4. Click Execute in the lower right corner. If detection is successful, click Save. If it fails, contact BNC Staff.

5. Then, go to the AE Mark subtab, click the AE detect condition button. Change the Scan Width (NOT Scan Position) back to 4 for both X and Y. 

6. Go to the BE Mark subtab, click the BE detect condition button. Change the Scan Width (NOT Scan Position) back to 4 for both X and Y. 

7. Click Execute in the lower right corner. If detection is successful, click Save. If it fails, contact BNC Staff.

8. Then, rerun the DAILYCAL batch file.

Remember: Do not change anything else in the AE/BE detect condition tabs, as changes could negatively and unpredictability affect your write and the writes of other users.

A CHIPAL error has been seen when software setting for virtual marks are incorrect, or when the sample height is out of range due to mis-mounting.