iLab Name: SB6e bonder
iLab Kiosk: BRK Lithography Core
FIC: David Janes
Owner: Mike Courtney
Location: Cleanroom - Bay N
Maximum Wafer Size: 4"/100 mm
Overview
General Description
The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are mechanically clamped using the transport fixture for further processing in the SB6e chamber.
Specifications
- 4 inch wafer size for bonding
- Vacuum down to 5x10-5 mbar.
- Over pressure up to 3 bar absolute
- Flexible process control using Windows NT with data recording and analysis
- Optimized bonding routines can be replicated
Technology Overview
Sample Requirements and Preparation
Standard Operating Procedure
Questions & Troubleshooting
Process Library
References
Karl Suss SB6e Operator Manual (Internal Resource)
Suss Transport Fixture Service Manual (Internal Resource)
Literature References: