Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
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Status	UP
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Responding Staff

Suss SB6e Substrate Bonder

iLab Name: SB6e bonder
iLab Kiosk: BRK Lithography Core
FIC: David Janes
Owner: Joon Park
Location: Cleanroom - Bay N
Maximum Wafer Size: 4"/100 mm

Overview

General Description

The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are mechanically clamped using the transport fixture for further processing in the SB6e chamber.

Specifications

4 inch wafer size for bonding
Vacuum down to 5x10^-5 mbar.
Over pressure up to 3 bar absolute
Flexible process control using Windows NT with data recording and analysis
Optimized bonding routines can be replicated

Technology Overview

Sample Requirements and Preparation

This tool is currently operated by staff and super-user. If you need this tool for your process, please contact Joon Park. He will process your sample for you.