Suss SB6e Substrate Bonder

iLab Name: SB6e bonder
iLab Kiosk: BRK Lithography Core
FIC: David Janes
Owner: Joon Park
Location: Cleanroom - Bay N
Maximum Wafer Size: 4"/100 mm

Overview

General Description

The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are mechanically clamped using the transport fixture for further processing in the SB6e chamber.

Specifications

• 4 inch wafer size for bonding

• Vacuum down to 5x10^-5 mbar.

• Over pressure up to 3 bar absolute

• Flexible process control using Windows NT with data recording and analysis

• Optimized bonding routines can be replicated

Technology Overview

Sample Requirements and Preparation

This tool is currently operated by staff and super-user. If you need this tool for your process, please contact Joon Park. He will process your sample for you.

Standard Operating Procedure

Open

Questions & Troubleshooting

Process Library

References

Literature References:

"Highly efficient vertical outgassing channels for low-temperature InP-to-silicon direct wafer bonding on the silicon-on-insulator substrate", D. Liang and J. E. Bowers, JVST B 26, 1560 (2008)