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2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

Status

DOWN

Issue Date and Description

 Relocation to Q Bay

Estimated Fix Date and Comment

  TGMS hooked up, testing monday 5/20

Responding Staff

R. Hosler

Nitric Oxide Anneal

DO NOT LEAVE TUBE UNATTENDED WHEN Nitric Oxide GAS IS BEING DISPENSED. 

For long anneals either plan for an interval break or have someone else trained on the tube take over. If no-one is present at the tube, it should NOT be dispensing NO gas!

Limited Use

Due to cleanliness and contamination concerns, this furnace tube is limited to authorized users. Please contact Rich Hosler for more info.

THIS FURNACE WILL BE UNAVAILABLE STARTING 3/1/2024 AND RELOCATED.

THERE IS NO ESTIMATED DURATION BUT WE WILL WORK TO MINIMIZE DOWNTIME.

iLab Name: Nitric Oxide Anneal

iLab Kiosk: BRK Furnace Core
FIC: Shared
Owner: Rich Hosler
Location: Cleanroom - P Bay
Maximum Wafer Size: 3"/75 mm

This tube is currently configured for Prof. Morisette's group as of 5/8/2024. 

Overview


General Description

Small bore, high temperature furnace for annealing silicon carbide.

Specifications

  • Max Temperature (°C): 1150°C

  • Max Processing Time (min): n/a

  • Available Gas: Nitric Oxide, and Argon

  • Vacuum Capability: None

  • Max Wafer Size: 3"/75 mm


Sample Requirements and Preparation

If possible, samples should be Piranha cleaned for 10 minutes. If this is not possible due to material incompatibility, a TAI Solvent clean followed by a mandatory DI water rinse step is permissible.


Standard Operating Procedure

Nitric Oxide Anneal Standard Operating Procedure

 

References

Nitric Oxide MSDS

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